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TPA102DGNRG4

Texas Instruments

TPA102DGNRG4 by Texas Instruments

TPA102DGNRG4 by Texas Instruments is an audio amplifier IC with 2 channels, 0.1% harmonic distortion, and 0.07W nominal output power. It operates in industrial temperature range (-40 to 85 °C) and requires 2.5-5.5V supply voltage. Ideal for compact audio applications due to its small outline package style and thin profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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7,501

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-

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Digiode

USA . 2,998 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,998

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,036 parts In-Stock

1+ parts

$1.283

100+ parts

-

1k+ parts

$2.041

10k+ parts

-

2,036

$1.283

-

$2.041

-

DigiPath Technology Company

USA . 606 parts In-Stock

1+ parts

$1.413

100+ parts

$1.300

1k+ parts

-

10k+ parts

-

606

$1.413

$1.300

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-

ChromeModa Solutions

Germany . 2,614 parts In-Stock

1+ parts

$1.442

100+ parts

$1.182

1k+ parts

-

10k+ parts

-

2,614

$1.442

$1.182

-

-

IDEA Electronic Components Group

UK . 251 parts In-Stock

1+ parts

$1.442

100+ parts

-

1k+ parts

$1.298

10k+ parts

-

251

$1.442

-

$1.298

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AZTECH Wire

Italy . 545 parts In-Stock

1+ parts

$9.995

100+ parts

-

1k+ parts

-

10k+ parts

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545

$9.995

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-

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One Stop Electronics

USA . 355 parts In-Stock

1+ parts

$12.800

100+ parts

-

1k+ parts

-

10k+ parts

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355

$12.800

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-

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A-Z Elektronik GmbH

Germany . 8,720 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,720

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Corphita

USA . 215 parts In-Stock

1+ parts

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215

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Overview

Experience exceptional audio quality and clarity with the TPA102DGNRG4 by Texas Instruments. As a leader in the industry, Texas Instruments delivers reliable and innovative solutions for audio and video amplifiers. The TPA102DGNRG4 is a versatile and compact audio amplifier perfect for a wide range of applications. With its high-quality design and superior performance, this product offers customers unmatched value and benefits. Upgrade your audio experience today with the TPA102DGNRG4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the amplifier easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Package Shape: SQUARE

Square shape of the package is compact and fits well in various electronic devices, optimizing space utilization.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high-quality sound output and performance.

Harmonic Distortion: 0.1 %

Low harmonic distortion results in clear and distortion-free audio signals, providing an enhanced listening experience.

No. of Terminals: 8

Sufficient number of terminals facilitate easy connectivity and integration within audio systems and circuits.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Package style features enhance cooling efficiency, compact design, and improved electrical performance for optimal amplifier operation.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures reliable performance in various environmental conditions without overheating.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments, ensuring operational stability and versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent conductivity, corrosion resistance, and long-term reliability for consistent signal transmission.

Terminal Position: DUAL

Dual terminal positioning offers flexibility in circuit connectivity and board layout, accommodating different design requirements.

Nominal Output Power: 0.07 W

Nominal output power rating supports efficient audio amplification for various applications, delivering adequate sound levels.

Maximum Seated Height: 1.1 mm

Low seated height profile enables compact device assembly and integration in space-constrained designs.

Width: 3 mm

Compact width dimensions facilitate easy placement and installation within electronic devices or audio systems.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement ensures compatibility with a wide range of power sources, enhancing flexibility in system design.

Maximum Time At Peak Reflow Temperature (s): 30

Sufficient reflow time allows for proper soldering and component bonding during manufacturing, ensuring reliable performance under thermal stress.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance supports robust soldering processes for secure component attachment and durability.

Length: 3 mm

Compact length dimensions enable easy placement and integration in tight spaces or small electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable operation in demanding environmental conditions, making it suitable for various industrial applications.

No. of Channels: 2

Dual-channel configuration allows for stereo sound reproduction and separation, enhancing audio quality and spatial imaging.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with digital circuits, enhancing overall amplifier efficiency.

Nominal Bandwidth: 0.02 kHz

Wide nominal bandwidth capability ensures accurate signal reproduction across a range of audio frequencies, delivering high-fidelity sound output.

Terminal Form: GULL WING

Gull wing terminal form offers secure soldering connections and easy handling during assembly, ensuring reliable electrical contact.

Maximum Supply Current: 3 mA

Low maximum supply current requirement minimizes power consumption and heat generation, contributing to efficient amplifier operation.

Terminal Pitch: 0.65 mm

Close terminal pitch spacing allows for compact circuit board layout and efficient signal routing, optimizing space utilization.

Maximum Supply Voltage (Vsup): 5.5 V

High maximum supply voltage rating supports compatibility with a wide range of power sources, providing flexibility in system integration and operation.

Technical Specifications

Audio & Video Amplifiers TPA102DGNRG4 attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.07 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA102DGNRG4 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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