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TPA112DR

Texas Instruments

TPA112DR by Texas Instruments

TPA112DR by Texas Instruments is an audio amplifier IC with 2 channels, 0.1% harmonic distortion, and 0.15W nominal output power. It operates in industrial temperature range (-40 to 85 °C) and supports supply voltages from 2.5V to 5.5V. Ideal for compact audio applications requiring high-quality sound amplification.

Median Price

$1.054

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,500 parts In-Stock

1+ parts

$1.140

100+ parts

$0.791

1k+ parts

$0.516

10k+ parts

-

2,500

$1.140

$0.791

$0.516

-

Mouser Electronics

USA . 2,280 parts In-Stock

1+ parts

$2.490

100+ parts

$1.190

1k+ parts

$0.847

10k+ parts

$0.752

2,280

$2.490

$1.190

$0.847

$0.752

Rochester

USA . 82,500 parts In-Stock

1+ parts

-

100+ parts

$0.934

1k+ parts

$0.775

10k+ parts

$0.691

82,500

-

$0.934

$0.775

$0.691

Verical

USA . 70,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.969

10k+ parts

$0.864

70,000

-

-

$0.969

$0.864

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,701 parts In-Stock

1+ parts

$0.549

100+ parts

-

1k+ parts

-

10k+ parts

-

2,701

$0.549

-

-

-

Vyrian

USA . 3,119 parts In-Stock

1+ parts

$0.578

100+ parts

-

1k+ parts

-

10k+ parts

-

3,119

$0.578

-

-

-

DigiKey Marketplace

USA . 82,500 parts In-Stock

1+ parts

-

100+ parts

$0.520

1k+ parts

-

10k+ parts

-

82,500

-

$0.520

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 59,095 parts In-Stock

1+ parts

$0.491

100+ parts

-

1k+ parts

-

10k+ parts

-

59,095

$0.491

-

-

-

Corphita

USA . 3,902 parts In-Stock

1+ parts

$0.520

100+ parts

-

1k+ parts

-

10k+ parts

-

3,902

$0.520

-

-

-

Parana Technologies

USA . 1,982 parts In-Stock

1+ parts

$0.947

100+ parts

-

1k+ parts

$1.852

10k+ parts

-

1,982

$0.947

-

$1.852

-

DigiPath Technology Company

USA . 1,944 parts In-Stock

1+ parts

$1.043

100+ parts

-

1k+ parts

-

10k+ parts

-

1,944

$1.043

-

-

-

ChromeModa Solutions

Germany . 5,886 parts In-Stock

1+ parts

$1.064

100+ parts

$0.872

1k+ parts

-

10k+ parts

-

5,886

$1.064

$0.872

-

-

IDEA Electronic Components Group

UK . 1,660 parts In-Stock

1+ parts

$1.064

100+ parts

-

1k+ parts

$0.958

10k+ parts

-

1,660

$1.064

-

$0.958

-

Microchip USA

USA . 2,447 parts In-Stock

1+ parts

$61.910

100+ parts

$60.840

1k+ parts

$60.300

10k+ parts

$59.760

2,447

$61.910

$60.840

$60.300

$59.760

Perfect Parts

USA . 2,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,433

-

-

-

-

A-Z Elektronik GmbH

Germany . 2,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,100

-

-

-

-

Kepictronics

USA . 1,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,006

-

-

-

-

Assy Fe

Spain . 1,006 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,006

-

-

-

-

Overview

Enhance your audio experience with the TPA112DR by Texas Instruments, a top-of-the-line audio amplifier designed to deliver crystal-clear sound quality. Manufactured by the renowned Texas Instruments, this compact yet powerful device is perfect for a wide range of applications in the audio and video industry. With its low harmonic distortion and dual terminal position, the TPA112DR ensures optimal performance and reliability. Don't compromise on quality - choose Texas Instruments for superior audio solutions. Upgrade your audio system today with the TPA112DR and immerse yourself in premium sound like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the amplifier lightweight and durable, ideal for portable audio devices.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, saving space and simplifying assembly.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound output and compatibility with audio devices.

Nominal Output Power: 0.15 W

Despite its compact size, the amplifier offers a decent output power of 0.15W, suitable for small to medium-sized audio applications.

Nominal Bandwidth: 0.02 kHz

With a nominal bandwidth of 0.02 kHz, this amplifier is capable of reproducing fine details in audio signals, providing clear and crisp sound.

Technical Specifications

Audio & Video Amplifiers TPA112DR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.15 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

TPA112DR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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