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TPA122DGNR

Texas Instruments

TPA122DGNR by Texas Instruments

TPA122DGNR by Texas Instruments is an audio amplifier IC with 2 channels, 0.15W output power, and 0.1% harmonic distortion. It operates in industrial temperature range (-40 to 85°C) and supports a supply voltage of 2.5-5.5V. Ideal for compact audio applications requiring high-quality sound amplification.

Median Price

$1.271

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,350 parts In-Stock

1+ parts

$1.520

100+ parts

$1.380

1k+ parts

$0.987

10k+ parts

$0.889

2,350

$1.520

$1.380

$0.987

$0.889

Rochester

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

$1.110

1k+ parts

$0.921

10k+ parts

$0.821

14,000

-

$1.110

$0.921

$0.821

DigiKey

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.390

10k+ parts

-

14,000

-

-

$1.390

-

Verical

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.152

10k+ parts

$1.027

14,000

-

-

$1.152

$1.027

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,030 parts In-Stock

1+ parts

$0.690

100+ parts

-

1k+ parts

-

10k+ parts

-

1,030

$0.690

-

-

-

Digiode

USA . 3,326 parts In-Stock

1+ parts

$0.710

100+ parts

-

1k+ parts

-

10k+ parts

-

3,326

$0.710

-

-

-

Cyclops Electronics Ltd

UK . 98,650 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

98,650

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,131 parts In-Stock

1+ parts

$0.672

100+ parts

-

1k+ parts

-

10k+ parts

-

1,131

$0.672

-

-

-

Component Stockers USA

USA . 14,196 parts In-Stock

1+ parts

$0.710

100+ parts

$0.660

1k+ parts

$0.600

10k+ parts

$0.600

14,196

$0.710

$0.660

$0.600

$0.600

Parana Technologies

USA . 1,026 parts In-Stock

1+ parts

$3.550

100+ parts

-

1k+ parts

$4.072

10k+ parts

-

1,026

$3.550

-

$4.072

-

ChromeModa Solutions

Germany . 2,898 parts In-Stock

1+ parts

$3.989

100+ parts

$3.271

1k+ parts

-

10k+ parts

-

2,898

$3.989

$3.271

-

-

IDEA Electronic Components Group

UK . 339 parts In-Stock

1+ parts

$3.989

100+ parts

-

1k+ parts

$3.590

10k+ parts

-

339

$3.989

-

$3.590

-

A-Z Elektronik GmbH

Germany . 12,488 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

12,488

-

-

-

-

Kepictronics

USA . 4,935 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,935

-

-

-

-

Assy Fe

Spain . 2,348 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,348

-

-

-

-

DigiPath Technology Company

USA . 1,977 parts In-Stock

1+ parts

-

100+ parts

$3.596

1k+ parts

-

10k+ parts

-

1,977

-

$3.596

-

-

Perfect Parts

USA . 912 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

912

-

-

-

-

Overview

Elevate your audio experience with the TPA122DGNR by Texas Instruments, a top-of-the-line audio amplifier that offers unparalleled quality and performance. Crafted by a trusted manufacturer, this product is designed for excellence in audio amplification. Perfect for a range of applications in the audio and video industry, this amplifier delivers clear sound with minimal distortion. With a compact design and advanced technology, the TPA122DGNR provides customers with superior value and benefits. Upgrade your audio system today and enjoy the advantages of this high-quality amplifier.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the amplifier easy to handle and transport.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of the amplifier onto circuit boards.

Package Shape: SQUARE

The square shape of the package provides efficient use of space on the circuit board.

General IC Type: AUDIO AMPLIFIER

Specifically designed for audio amplification, ensuring high quality sound output.

Harmonic Distortion: 0.1 %

Low harmonic distortion ensures clean and accurate sound reproduction without interference or distortion.

No. of Terminals: 8

Sufficient number of terminals for connecting input and output sources as well as power supply.

Maximum Operating Temperature: 85 °C

Can operate effectively in high temperature environments without overheating or malfunctioning.

Minimum Operating Temperature: -40 °C

Capable of operating in low temperature conditions, making it versatile for various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for improved conductivity and durability, enhancing overall performance.

Nominal Output Power: 0.15 W

Sufficient output power for amplifying audio signals with clarity and precision.

Maximum Seated Height: 1.1 mm

Compact design with low seated height for easy integration into electronic devices.

Width: 3 mm

Small width allows for space-saving installation on circuit boards.

Minimum Supply Voltage (Vsup): 2.5 V

Low minimum supply voltage requirement for efficient power management.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a specified duration without damage.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the amplifier can endure soldering processes.

Length: 3 mm

Compact length for convenient placement on circuit boards.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with varying temperature conditions.

No. of Channels: 2

Dual channels for stereo sound output, enhancing audio performance and fidelity.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient and clear audio amplification.

Nominal Bandwidth: 0.02 kHz

Wide nominal bandwidth for reproducing a broad range of audio frequencies with accuracy.

Terminal Form: GULL WING

Gull wing terminal form for secure and reliable connections on circuit boards.

Maximum Supply Current: 3 mA

Low maximum supply current requirement for energy-efficient operation.

Terminal Pitch: 0.65 mm

Close terminal pitch for compact layout and space-saving design on circuit boards.

Maximum Supply Voltage (Vsup): 5.5 V

Maximum supply voltage of 5.5 V for optimal performance and safe operation.

Technical Specifications

Audio & Video Amplifiers TPA122DGNR attributes and parameters. Explore more Audio & Video Amplifiers devices from Texas Instruments

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

.15 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

TPA122DGNR General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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