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TMUX1511RSVR

Texas Instruments

TMUX1511RSVR by Texas Instruments

TMUX1511RSVR by Texas Instruments is a CMOS SPST switch with 4 channels, operating at -40 to 125 °C. It features a low on-state resistance of 4.5 ohm and high off-state isolation of 75 dB, suitable for automotive applications due to its very thin profile chip carrier package.

Median Price

$0.517

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 251,661 parts In-Stock

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$0.517

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$0.351

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$0.180

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$0.517

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Nova Conductors

Japan . 10 parts In-Stock

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$0.312

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Digiode

USA . 3,621 parts In-Stock

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$0.491

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3,621

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Vyrian

USA . 118,797 parts In-Stock

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Chip Stock

USA . 20,440 parts In-Stock

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Bristol Electronics

USA . 1,003 parts In-Stock

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Microfarads

USA . 154 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 118,609 parts In-Stock

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$0.207

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Netroflash

USA . 1,000 parts In-Stock

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$0.312

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$0.306

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Continental Prestige Electronics

USA . 263 parts In-Stock

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$0.312

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Argo Parts USA

USA . 126 parts In-Stock

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126

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Corphita

USA . 2,604 parts In-Stock

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$0.465

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Parana Technologies

USA . 90 parts In-Stock

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$14.976

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$15.402

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90

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DigiPath Technology Company

USA . 1,490 parts In-Stock

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$16.490

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$15.171

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$16.490

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ChromeModa Solutions

Germany . 791 parts In-Stock

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$16.827

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$13.798

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IDEA Electronic Components Group

UK . 193 parts In-Stock

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$16.827

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$15.986

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$15.144

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193

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A-Z Elektronik GmbH

Germany . 13,206 parts In-Stock

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Lixinc

USA . 4,618 parts In-Stock

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Overview

Upgrade your electronic designs with the TMUX1511RSVR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality multiplexers and switches that meet the highest standards. The TMUX1511RSVR offers seamless switching capabilities with separate outputs, ensuring optimal performance in a wide range of applications. With a focus on reliability and efficiency, this chip carrier with a very thin profile provides customers with a compact solution that guarantees precision and accuracy. Trust Texas Instruments for innovative solutions that elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product and makes it more cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and efficient integration into circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3 V nominal supply voltage makes this product compatible with a wide range of applications while ensuring efficient power consumption.

No. of Terminals: 16

Having 16 terminals provides enough connectivity options for multiple channels, making it versatile for various switching and multiplexing requirements.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows for reliable performance in harsh environments, making it suitable for automotive and industrial applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high speed, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexers & Switches TMUX1511RSVR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

3000 kHz

JESD-30 Code:

R-PQCC-N16

JESD-609 Code:

e4

Length:

2.6 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

16

Nominal Off-state Isolation:

75 dB

Nominal On-state Resistance Match:

.07 ohm

Maximum On-state Resistance (Ron):

4.5 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.55 mm

Maximum Supply Current (Isup):

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

4000 ns

Maximum Switch-on Time:

60000 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.8 mm

Trade Compliance

TMUX1511RSVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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