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TMUX1119DBVR

Texas Instruments

TMUX1119DBVR by Texas Instruments

TMUX1119DBVR by Texas Instruments is a single-ended multiplexer with 6 terminals. It has a max on-state resistance of 4.9 ohm and nominal bandwidth of 250 kHz. Ideal for automotive applications due to its small outline, low profile package and wide operating temperature range from -40 to 125 °C.

Median Price

$2.280

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 423,444 parts In-Stock

1+ parts

$1.658

100+ parts

$1.369

1k+ parts

$0.740

10k+ parts

-

423,444

$1.658

$1.369

$0.740

-

Mouser Electronics

USA . 7,030 parts In-Stock

1+ parts

$2.280

100+ parts

$1.380

1k+ parts

$1.220

10k+ parts

$1.170

7,030

$2.280

$1.380

$1.220

$1.170

DigiKey

USA . 2,720 parts In-Stock

1+ parts

$2.280

100+ parts

$1.379

1k+ parts

$1.217

10k+ parts

$1.146

2,720

$2.280

$1.379

$1.217

$1.146

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

25

$0.940

-

-

-

Digiode

USA . 2,686 parts In-Stock

1+ parts

$1.575

100+ parts

-

1k+ parts

-

10k+ parts

-

2,686

$1.575

-

-

-

Vyrian

USA . 151,151 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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151,151

-

-

-

-

Chip Stock

USA . 26,213 parts In-Stock

1+ parts

-

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26,213

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-

-

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Elcom Components

USA . 14 parts In-Stock

1+ parts

-

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-

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14

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 750 parts In-Stock

1+ parts

$0.864

100+ parts

$0.864

1k+ parts

$0.864

10k+ parts

-

750

$0.864

$0.864

$0.864

-

Argo Parts USA

USA . 4,870 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

4,870

$0.940

-

-

-

Continental Prestige Electronics

USA . 1,746 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

$0.921

1,746

$0.940

-

-

$0.921

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.940

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$0.940

-

-

-

Ampacity Inc.

Singapore . 151,329 parts In-Stock

1+ parts

$1.410

100+ parts

-

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-

10k+ parts

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151,329

$1.410

-

-

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Semicontronic

India . 151,172 parts In-Stock

1+ parts

$1.410

100+ parts

$1.375

1k+ parts

$1.368

10k+ parts

-

151,172

$1.410

$1.375

$1.368

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Corphita

USA . 4,210 parts In-Stock

1+ parts

$1.492

100+ parts

-

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4,210

$1.492

-

-

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Corohmni

South Africa . 347 parts In-Stock

1+ parts

$5.412

100+ parts

-

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347

$5.412

-

-

-

Parana Technologies

USA . 1,461 parts In-Stock

1+ parts

$8.788

100+ parts

-

1k+ parts

$9.473

10k+ parts

-

1,461

$8.788

-

$9.473

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DigiPath Technology Company

USA . 1,652 parts In-Stock

1+ parts

$9.677

100+ parts

$8.902

1k+ parts

-

10k+ parts

-

1,652

$9.677

$8.902

-

-

ChromeModa Solutions

Germany . 6,945 parts In-Stock

1+ parts

$9.874

100+ parts

$8.097

1k+ parts

-

10k+ parts

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6,945

$9.874

$8.097

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IDEA Electronic Components Group

UK . 540 parts In-Stock

1+ parts

$9.874

100+ parts

$9.380

1k+ parts

$8.887

10k+ parts

-

540

$9.874

$9.380

$8.887

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Lixinc

USA . 16,986 parts In-Stock

1+ parts

-

100+ parts

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16,986

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iodParts Technologies Inc.

India . 10,000 parts In-Stock

1+ parts

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100+ parts

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10,000

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Overview

Experience the unparalleled quality and reliability of Texas Instruments with the TMUX1119DBVR, a cutting-edge multiplexer designed to meet your switching needs. Whether you're in the automotive industry or working on an innovative electronics project, this versatile component offers exceptional performance and precision. With its small outline package and wide temperature range, the TMUX1119DBVR delivers value and efficiency like no other. Trust Texas Instruments to provide you with the best solutions for your applications.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and improving overall efficiency.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and integrate into circuit designs efficiently.

No. of Terminals: 6

With 6 terminals, this multiplexer offers flexibility and compatibility with a range of input and output configurations.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability and performance in a range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function effectively even in extreme cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance.

Maximum Seated Height: 1.45 mm

The low seated height makes the product suitable for compact designs where space is limited.

Width (mm): 1.6 mm

The small width dimension enables easy placement on PCBs and contributes to a more streamlined overall circuit layout.

Maximum Time At Peak Reflow Temperature (s): 30

The short time at peak reflow temperature facilitates quick and efficient soldering during assembly processes.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand the heat of soldering without damage, ensuring reliable connections.

Maximum On-state Resistance (Ron): 4.9 ohm

The low on-state resistance helps minimize signal loss and ensures efficient signal transmission through the multiplexer.

Length: 2.9 mm

The compact length of the product contributes to its overall space-saving design and compatibility with small electronic devices.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade indicates that the product is designed to meet the stringent temperature requirements of automotive applications, ensuring reliability in vehicle electronics.

Maximum Supply Current (Isup): 0.0014 mA

The low maximum supply current consumption helps optimize power efficiency and prolongs the battery life of electronic devices.

Nominal Bandwidth: 250 kHz

The wide nominal bandwidth allows for high-speed data transmission and versatile signal processing capabilities.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and secure mechanical connections, improving overall reliability.

Terminal Pitch: 0.95 mm

The close terminal pitch enables high-density PCB layouts and efficient use of space on the circuit board.

Technical Specifications

Multiplexers & Switches TMUX1119DBVR attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

250 kHz

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

4.9 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.45 mm

Maximum Supply Current (Isup):

.0014 mA

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.6 mm

Trade Compliance

TMUX1119DBVR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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