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TMS5100NL

Texas Instruments

TMS5100NL by Texas Instruments

TMS5100NL by Texas Instruments is a Speech Synthesizer IC with 28 terminals in an IN-LINE package. Operating temperature range of 0-70°C makes it suitable for commercial applications. Utilizes MOS technology and through-hole terminal form, ideal for music & sound synthesis.

Median Price

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Lifecycle Status

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8

In-Stock Inventory

1k+

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Vyrian

USA . 4,845 parts In-Stock

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Digiode

USA . 1,177 parts In-Stock

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Pegasus Components GmbH

Germany . 230 parts In-Stock

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Holdelec - ElecDif-Pro

France . 44 parts In-Stock

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R&J Components

USA . 3 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 3 parts In-Stock

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ECAB

Sweden . 3 parts In-Stock

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Microfarads

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Parana Technologies

USA . 304 parts In-Stock

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$2.767

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$3.251

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DigiPath Technology Company

USA . 1,221 parts In-Stock

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$3.047

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$2.803

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ChromeModa Solutions

Germany . 3,799 parts In-Stock

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$3.109

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$2.549

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IDEA Electronic Components Group

UK . 1,514 parts In-Stock

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AZTECH Wire

Italy . 640 parts In-Stock

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One Stop Electronics

USA . 1,276 parts In-Stock

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Corphita

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Overview

Enhance your audio projects with the TMS5100NL from Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge Music & Sound Synthesizer ICs that are perfect for a wide range of applications. Whether you're working on speech synthesis or sound effects, this versatile IC offers exceptional value and performance. Experience seamless integration, precise sound reproduction, and unmatched durability with the TMS5100NL. Elevate your projects to the next level with the trusted brand that professionals rely on.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the IC, making it a reliable choice for long-term use.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and installation in various electronic devices.

General IC Type: SPEECH SYNTHESIZER

The speech synthesizer functionality enables the IC to generate human-like speech, making it suitable for applications requiring audio output.

No. of Terminals: 28

The large number of terminals provide flexibility for connecting to external components and interfacing with other devices.

Package Style (Meter): IN-LINE

The in-line package style offers a space-saving design, making it ideal for compact electronic devices or applications where space is limited.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance ensures reliable performance even in demanding environments with elevated temperatures.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for operation in various temperature conditions, making the IC versatile for different applications.

Terminal Position: DUAL

The dual terminal position enables efficient connection and secure attachment of the IC to the circuit board or external components.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures compatibility with standard operating conditions in commercial electronic devices and applications.

Technology: MOS

The use of MOS technology provides high-speed performance and low power consumption, making the IC energy-efficient and suitable for battery-powered devices.

Terminal Form: THROUGH-HOLE

The through-hole terminal form offers easy soldering and robust mechanical connection, ensuring secure attachment to the circuit board.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm allows for easy PCB layout and assembly, providing convenience for manufacturers during production.

Technical Specifications

Music & Sound Synthesizer ICs TMS5100NL attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS5100NL General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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