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NS32AM161V-20

Texas Instruments

NS32AM161V-20 by Texas Instruments

NS32AM161V-20 by Texas Instruments is a Speech Synthesizer IC with 5V power supply, 68 terminals, and 200mA max supply current. It is used in music & sound applications due to its CMOS technology, operating b/w 0°C to 70°C temperature range.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,999 parts In-Stock

1+ parts

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7,999

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Digiode

USA . 2,795 parts In-Stock

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2,795

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Anansix

USA . 398 parts In-Stock

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398

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,884 parts In-Stock

1+ parts

$3.377

100+ parts

-

1k+ parts

$3.904

10k+ parts

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1,884

$3.377

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$3.904

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DigiPath Technology Company

USA . 683 parts In-Stock

1+ parts

$3.718

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683

$3.718

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ChromeModa Solutions

Germany . 6,901 parts In-Stock

1+ parts

$3.794

100+ parts

$3.111

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6,901

$3.794

$3.111

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IDEA Electronic Components Group

UK . 2,345 parts In-Stock

1+ parts

$3.794

100+ parts

-

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$3.415

10k+ parts

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2,345

$3.794

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$3.415

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AZTECH Wire

Italy . 511 parts In-Stock

1+ parts

$5.980

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511

$5.980

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One Stop Electronics

USA . 1,409 parts In-Stock

1+ parts

$13.800

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1,409

$13.800

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Corphita

USA . 1,983 parts In-Stock

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1,983

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Overview

Experience the next level of sound synthesis with the NS32AM161V-20 by Texas Instruments. Crafted with precision and expertise, this music and sound synthesizer IC offers unparalleled quality and performance. Whether you're a musician, audio engineer, or hobbyist, this versatile chip carrier is the perfect solution for creating unique and innovative sound effects. With a maximum operating temperature of 70°C and a power supply of 5 V, the possibilities are endless. Elevate your projects to new heights with the Texas Instruments NS32AM161V-20.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material provides durability and protection for the IC, ensuring long-lasting performance.

Surface Mount: YES

Surface mount technology makes the installation of the IC easier and more efficient, saving time and effort.

Package Shape: SQUARE

Square package shape allows for easy integration and placement in different electronic devices.

Power Supplies (V): 5

Operating at 5V makes this IC compatible with a wide range of common power supplies, increasing its versatility.

No. of Terminals: 68

Having 68 terminals provides plenty of connection options, allowing for more complex circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers a compact and secure housing for the IC, making it suitable for various applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this IC can withstand higher temperature environments without performance degradation.

Minimum Operating Temperature: 0 °C

Operating at temperatures as low as 0°C ensures reliable performance in a variety of temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

Tin/lead terminal finish provides good electrical conductivity and solderability, ensuring secure connections and reliable performance.

Terminal Position: QUAD

Quad terminal position allows for easier PCB layout and routing, simplifying the design and assembly process.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable operation in typical commercial environments, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable in noisy environments.

Terminal Form: J BEND

J bend terminal form allows for easier soldering and inspection, simplifying the manufacturing and maintenance processes.

Maximum Supply Current: 200 mA

With a maximum supply current of 200 mA, this IC can operate reliably without exceeding current limits, ensuring stable performance.

Terminal Pitch: 1.27 mm

Terminal pitch of 1.27 mm provides ample spacing for easy soldering and assembly, reducing the risk of short circuits and assembly errors.

Technical Specifications

Music & Sound Synthesizer ICs NS32AM161V-20 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-J68

JESD-609 Code:

e0

No. of Terminals:

68

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC68,1.0SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

200 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

NS32AM161V-20 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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