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MSP50P37BDW

Texas Instruments

MSP50P37BDW by Texas Instruments

The Texas Instruments MSP50P37BDW is a Speech Synthesizer IC with 28 terminals, operating at temperatures from -10°C to 70°C. It has power supplies of 4-6.5V and uses CMOS technology. Ideal for music & sound applications, this IC is surface mountable in a small outline package shape.

Median Price

$3.850

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

$2.930

1k+ parts

$2.620

10k+ parts

$2.460

1,100

-

$2.930

$2.620

$2.460

DigiKey

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

$3.850

1k+ parts

-

10k+ parts

-

1,100

-

$3.850

-

-

Verical

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

$3.850

1k+ parts

$3.275

10k+ parts

$3.075

1,100

-

$3.850

$3.275

$3.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 848 parts In-Stock

1+ parts

$3.088

100+ parts

-

1k+ parts

-

10k+ parts

-

848

$3.088

-

-

-

Vyrian

USA . 1,503 parts In-Stock

1+ parts

$3.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1,503

$3.250

-

-

-

DigiKey Marketplace

USA . 1,100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,151 parts In-Stock

1+ parts

$0.248

100+ parts

-

1k+ parts

$1.526

10k+ parts

-

2,151

$0.248

-

$1.526

-

DigiPath Technology Company

USA . 369 parts In-Stock

1+ parts

$0.273

100+ parts

-

1k+ parts

-

10k+ parts

-

369

$0.273

-

-

-

ChromeModa Solutions

Germany . 5,202 parts In-Stock

1+ parts

$0.279

100+ parts

$0.229

1k+ parts

-

10k+ parts

-

5,202

$0.279

$0.229

-

-

IDEA Electronic Components Group

UK . 2,106 parts In-Stock

1+ parts

$0.279

100+ parts

-

1k+ parts

$0.251

10k+ parts

-

2,106

$0.279

-

$0.251

-

Corphita

USA . 2,974 parts In-Stock

1+ parts

$2.925

100+ parts

-

1k+ parts

-

10k+ parts

-

2,974

$2.925

-

-

-

Overview

Upgrade your sound experience with the MSP50P37BDW by Texas Instruments. As a leader in the industry, Texas Instruments ensures top-notch quality and innovation in their products. This speech synthesizer IC is perfect for a wide range of applications in music and sound systems. With its small outline package and dual terminal position, it offers ease of use and flexibility in design. Experience the benefits of advanced CMOS technology and a temperature grade suitable for commercial use. Enhance your projects with the reliability and performance of the MSP50P37BDW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for IC packages as it provides good insulation and protection to the internal components, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly processes, making this IC easier to integrate into electronic circuit boards.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on a PCB, enabling a compact design for the overall electronic device.

General IC Type: SPEECH SYNTHESIZER

This IC is specifically designed for speech synthesis applications, making it a suitable choice for projects requiring voice generation or recognition functionalities.

Power Supplies (V): 4/6.5

The specified power supply range of 4-6.5V allows for flexibility in power source options, accommodating different voltage requirements in various applications.

No. of Terminals: 28

With a sufficient number of terminals, this IC offers a wide range of input and output connections, providing versatility in circuit design and connectivity.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices or projects with limited board real estate.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance of 70°C ensures stability and reliability of the IC even under demanding environmental conditions.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature tolerance of -10°C allows for operation in a wide range of temperature environments, enhancing the IC's versatility.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and routing options, accommodating different design requirements and simplifying the assembly process.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures that this IC is suitable for use in standard commercial electronic devices and applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy-efficient and reliable for various electronic systems.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during PCB assembly, ensuring a reliable and robust connection.

Terminal Pitch: 1.27 mm

The specified terminal pitch of 1.27mm allows for compact placement of terminals on the IC, contributing to the overall miniaturization of the electronic device.

Technical Specifications

Music & Sound Synthesizer ICs MSP50P37BDW attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4/6.5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

MSP50P37BDW General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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