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TSP53C30N2

Texas Instruments

TSP53C30N2 by Texas Instruments

TSP53C30N2 by Texas Instruments is a CMOS Speech Synthesizer IC with 28 terminals, operating at 0-70°C. It requires 5V power supply and draws a max current of 3mA. Ideal for Music & Sound applications due to its rectangular package style and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,897 parts In-Stock

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5,897

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Digiode

USA . 3,976 parts In-Stock

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3,976

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 121 parts In-Stock

1+ parts

$0.236

100+ parts

-

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$1.524

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121

$0.236

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$1.524

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DigiPath Technology Company

USA . 664 parts In-Stock

1+ parts

$0.260

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664

$0.260

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ChromeModa Solutions

Germany . 927 parts In-Stock

1+ parts

$0.265

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$0.217

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927

$0.265

$0.217

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IDEA Electronic Components Group

UK . 419 parts In-Stock

1+ parts

$0.265

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$0.238

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419

$0.265

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$0.238

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AZTECH Wire

Italy . 351 parts In-Stock

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$7.970

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351

$7.970

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One Stop Electronics

USA . 1,324 parts In-Stock

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$12.800

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$12.800

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Corphita

USA . 2,628 parts In-Stock

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Overview

Elevate your audio projects with the TSP53C30N2 by Texas Instruments, a high-quality Speech Synthesizer IC designed to deliver exceptional sound performance. Manufactured by the renowned Texas Instruments, this product is perfect for a wide range of music and sound applications. With its innovative technology and reliable construction, the TSP53C30N2 offers customers unparalleled value and benefits. Upgrade your projects today with the superior quality and advanced features of this top-of-the-line synthesizer IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body offers cost-effective and durable protection for the synthesizer IC.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and placement within electronic devices, optimizing space usage.

General IC Type: SPEECH SYNTHESIZER

The speech synthesizer IC type enables the generation of human-like speech or audio output, ideal for various applications including voice assistance and communication devices.

Power Supplies (V): 5

The 5V power supply ensures compatibility with standard voltage requirements, making it suitable for a wide range of electronic systems.

No. of Terminals: 28

The 28 terminals provide multiple connectivity options, allowing for versatile integration and functionality in different circuit designs.

Terminal Position: DUAL

The dual terminal position enhances stability and connectivity, ensuring reliable performance even in demanding operating conditions.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the synthesizer IC energy-efficient and reliable in noise-sensitive environments.

Technical Specifications

Music & Sound Synthesizer ICs TSP53C30N2 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.4

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

3 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TSP53C30N2 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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