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CSS43XXXFN

Texas Instruments

CSS43XXXFN by Texas Instruments

Texas Instruments' CSS43XXXFN is a CMOS Speech Synthesizer IC with 28 terminals in a square chip carrier package. Operating at 0-70°C, it requires 5V power supply and draws max 3mA current. Ideal for music & sound applications requiring speech synthesis capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,773 parts In-Stock

1+ parts

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3,773

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Vyrian

USA . 3,564 parts In-Stock

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3,564

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Distributors (Availability)

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Native Components

USA . 102 parts In-Stock

1+ parts

$0.392

100+ parts

-

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$0.377

102

$0.392

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$0.377

Northwest PG Solutions

USA . 2,057 parts In-Stock

1+ parts

$0.432

100+ parts

-

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$0.381

2,057

$0.432

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$0.381

Parana Technologies

USA . 1,811 parts In-Stock

1+ parts

$1.854

100+ parts

-

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$2.402

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1,811

$1.854

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$2.402

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ChromeModa Solutions

Germany . 4,675 parts In-Stock

1+ parts

$2.083

100+ parts

$1.708

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4,675

$2.083

$1.708

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IDEA Electronic Components Group

UK . 733 parts In-Stock

1+ parts

$2.083

100+ parts

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$1.875

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733

$2.083

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$1.875

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AZTECH Wire

Italy . 863 parts In-Stock

1+ parts

$16.433

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863

$16.433

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One Stop Electronics

USA . 795 parts In-Stock

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$16.800

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795

$16.800

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Corphita

USA . 4,982 parts In-Stock

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4,982

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DigiPath Technology Company

USA . 2,057 parts In-Stock

1+ parts

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100+ parts

$1.878

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2,057

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$1.878

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Overview

Unlock a world of endless possibilities with the Texas Instruments CSS43XXXFN Music & Sound Synthesizer IC. Crafted with precision and expertise, this innovative speech synthesizer delivers unparalleled quality and reliability. Perfect for applications in music production, sound design, and more, this versatile IC offers customers exceptional value and performance. Transform your projects with the cutting-edge technology and superior functionality of the CSS43XXXFN by Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY is a durable and cost-effective material, making this product reliable and affordable.

Surface Mount: YES

Surface mount capability allows for easier assembly and installation of the synthesizer IC, saving time and effort.

Package Shape: SQUARE

The square package shape helps in efficient utilization of space on a circuit board, suitable for compact designs.

General IC Type: SPEECH SYNTHESIZER

Being a speech synthesizer, this IC can create lifelike voice output, making it ideal for applications requiring speech generation.

Power Supplies (V): 5

Operating at 5 volts allows for compatibility with standard power sources, ensuring ease of integration.

No. of Terminals: 28

Having a higher number of terminals provides versatility in connecting to other components, enabling greater functionality.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers a compact form factor and efficient heat dissipation, suitable for space-constrained applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, this IC can perform reliably in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the IC can operate in cold environments without any issues.

Terminal Position: QUAD

Quad terminal position provides stability and ease of connection, enhancing the reliability of the synthesizer IC.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions, suitable for most commercial applications.

Technology: CMOS

Using CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable.

Terminal Form: J BEND

The J bend terminal form simplifies the soldering process, leading to easier assembly and maintenance of the IC.

Maximum Supply Current: 3 mA

Low maximum supply current helps in reducing power consumption and heat generation, ideal for energy-efficient designs.

Terminal Pitch: 1.27 mm

Having a standard terminal pitch simplifies PCB layout and assembly, making it convenient for manufacturers to use this IC in their products.

Technical Specifications

Music & Sound Synthesizer ICs CSS43XXXFN attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PQCC-J28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

3 mA

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

CSS43XXXFN General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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