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SAE800GGEG

Infineon Technologies

SAE800GGEG by Infineon Technologies

Infineon's SAE800GGEG is a small outline tone/music synthesizer IC with 8 terminals. Operating from -25 to 125°C, it supports supply voltages from 2.8V to 18V. Ideal for music and sound applications, this bipolar technology IC is surface mountable in plastic/epoxy package.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Chip Stock

USA . 8,955 parts In-Stock

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Vyrian

USA . 2,972 parts In-Stock

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Digiode

USA . 898 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Modulus Dynamics

Lithuania . 3,226 parts In-Stock

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$0.231

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$0.222

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$0.213

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3,226

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Corohmni

South Africa . 986 parts In-Stock

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$1.089

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Ampacity Inc.

Singapore . 1,859 parts In-Stock

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$2.800

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Aztec Data Supply Inc.

USA . 2,666 parts In-Stock

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$3.719

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AZTECH Wire

Italy . 508 parts In-Stock

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$5.644

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Semicontronic

India . 359 parts In-Stock

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$13.800

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$13.455

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$13.386

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Component Stockers USA

USA . 385 parts In-Stock

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$99.990

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Perfect Parts

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Futuretech Components

Singapore . 6,091 parts In-Stock

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Microchip USA

USA . 4,307 parts In-Stock

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Argo Parts USA

USA . 1,959 parts In-Stock

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Bastille Electronics

Australia . 1,537 parts In-Stock

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Continental Prestige Electronics

USA . 1,065 parts In-Stock

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Corphita

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Robosynatics

Brazil . 100 parts In-Stock

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Overview

Elevate your audio experience with the SAE800GGEG by Infineon Technologies. Crafted with precision and expertise, this music and sound synthesizer IC promises top-notch quality and seamless performance. Perfect for a wide range of applications, this compact device offers unparalleled value to customers seeking crisp, clear tones and rich soundscapes. Embrace the advantages of cutting-edge technology and elevate your projects to new heights with the SAE800GGEG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the synthesizer IC.

Surface Mount: YES

Being surface mountable makes it easier to integrate the synthesizer IC onto circuit boards, saving space and enabling efficient assembly processes.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and alignment on the circuit board, enhancing the overall design aesthetics.

General IC Type: TONE/MUSIC SYNTHESIZER

The specific tone/music synthesizer design of this IC ensures high-quality sound output for musical applications, making it an ideal choice for audio projects.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with other components in the circuit, offering flexibility in system design.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves board space and allows for compact system designs, making it suitable for portable music devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand rigorous operating conditions, ensuring reliability in various environments.

Width: 4 mm

The compact width of 4mm allows for efficient space utilization on the circuit board, contributing to a streamlined and tidy design.

Minimum Supply Voltage (Vsup): 2.8 V

The low minimum supply voltage requirement of 2.8V enables energy-efficient operation and compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures proper soldering during assembly, enhancing the reliability and longevity of the synthesizer IC.

Technology: BIPOLAR

The bipolar technology used in this IC offers stable and precise signal processing, resulting in high-quality audio output for music and sound applications.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and assembly processes, ensuring reliable electrical connections for optimal performance.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, this IC allows for accurate placement and soldering of the terminals, contributing to the overall robustness of the circuit.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage capability of 18V provides flexibility in power options and supports compatibility with a wide range of electronic systems.

Technical Specifications

Music & Sound Synthesizer ICs SAE800GGEG attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Infineon Technologies

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

4 mm

Trade Compliance

SAE800GGEG General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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