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SN76488N3

Texas Instruments

SN76488N3 by Texas Instruments

SN76488N3 by Texas Instruments is a 28-terminal sound synthesizer IC with bipolar technology. It operates b/w 0°C to 70°C, making it suitable for commercial applications. The package style is in-line rectangular plastic/epoxy, ideal for music and sound systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,118 parts In-Stock

1+ parts

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4,118

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Vyrian

USA . 2,556 parts In-Stock

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2,556

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,753 parts In-Stock

1+ parts

$3.540

100+ parts

-

1k+ parts

$4.063

10k+ parts

-

1,753

$3.540

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$4.063

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DigiPath Technology Company

USA . 2,265 parts In-Stock

1+ parts

$3.898

100+ parts

-

1k+ parts

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10k+ parts

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2,265

$3.898

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ChromeModa Solutions

Germany . 5,741 parts In-Stock

1+ parts

$3.978

100+ parts

$3.262

1k+ parts

-

10k+ parts

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5,741

$3.978

$3.262

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IDEA Electronic Components Group

UK . 275 parts In-Stock

1+ parts

$3.978

100+ parts

-

1k+ parts

$3.580

10k+ parts

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275

$3.978

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$3.580

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AZTECH Wire

Italy . 610 parts In-Stock

1+ parts

$9.552

100+ parts

-

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610

$9.552

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One Stop Electronics

USA . 195 parts In-Stock

1+ parts

$9.800

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195

$9.800

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Corphita

USA . 3,602 parts In-Stock

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3,602

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Overview

Unleash the power of music and sound with the SN76488N3 by Texas Instruments, a top-of-the-line Music & Sound Synthesizer IC designed for high-quality audio applications. With Texas Instruments' renowned reputation for excellence in manufacturing, this IC offers unmatched reliability and performance. From musical instruments to gaming consoles, this versatile product delivers exceptional value and benefits to customers seeking superior sound quality and seamless integration. Elevate your sound experience with the SN76488N3 and discover the endless possibilities it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection to the internal components of the synthesizer IC, making it suitable for long-term use.

No. of Terminals: 28

Having 28 terminals allows for connectivity with a wide range of external devices and components, enabling versatile and customizable design options.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures that the synthesizer IC can operate efficiently and reliably even in challenging environmental conditions.

Technology: BIPOLAR

The use of bipolar technology provides high performance and precision in signal processing, offering high-quality sound synthesis capabilities.

Terminal Pitch: 2.54 mm

The standard terminal pitch of 2.54 mm makes it easy to integrate the synthesizer IC into existing circuit designs and PCB layouts, simplifying the overall system integration process.

Technical Specifications

Music & Sound Synthesizer ICs SN76488N3 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN76488N3 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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