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SN76477N

Texas Instruments

SN76477N by Texas Instruments

SN76477N by Texas Instruments is a Music & Sound Synthesizer IC with 28 terminals in an IN-LINE package. Operating temp range: -10 to 40°C. Ideal for commercial applications requiring bipolar technology for sound synthesis and music production.

Median Price

$39.060

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$39.060

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Vyrian

USA . 4,731 parts In-Stock

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Digiode

USA . 2,181 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 278 parts In-Stock

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Holdelec - ElecDif-Pro

France . 278 parts In-Stock

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Century Electronics Ltd.

USA . 94 parts In-Stock

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ECAB

Sweden . 75 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 44 parts In-Stock

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Electronic Expediters

USA . 24 parts In-Stock

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Goldney Electronics S.L.

Spain . 9 parts In-Stock

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Prism Electronics

USA . 4 parts In-Stock

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LittleDiode

UK . 2 parts In-Stock

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GES GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,915 parts In-Stock

1+ parts

$0.533

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$1.642

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1,915

$0.533

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$1.642

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ChromeModa Solutions

Germany . 2,947 parts In-Stock

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$0.599

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$0.491

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2,947

$0.599

$0.491

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IDEA Electronic Components Group

UK . 42 parts In-Stock

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$0.599

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$0.539

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42

$0.599

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$0.539

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AZTECH Wire

Italy . 366 parts In-Stock

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$11.717

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One Stop Electronics

USA . 619 parts In-Stock

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$18.800

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619

$18.800

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A-Z Elektronik GmbH

Germany . 9,162 parts In-Stock

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Corphita

USA . 4,698 parts In-Stock

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DigiPath Technology Company

USA . 445 parts In-Stock

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$0.540

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445

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Assy Fe

Spain . 38 parts In-Stock

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Overview

Experience the unparalleled sound quality and versatility of the SN76477N Music & Sound Synthesizer IC by Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers a product that exceeds expectations. This innovative IC opens up a world of creative possibilities in music and sound synthesis. Let your imagination run wild as you explore the endless applications of this high-performance component. Elevate your projects with the reliability, value, and cutting-edge technology that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good durability and protection for the internal components of the synthesizer IC, ensuring reliable performance over time.

No. of Terminals: 28

Having 28 terminals allows for versatile connectivity options and the ability to interface with various other electronic components effectively.

Maximum Operating Temperature: 40 °C

The high maximum operating temperature of 40°C ensures that the synthesizer IC can operate efficiently even in potentially warm environments.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature of -10°C indicates that the synthesizer IC can also function reliably in colder conditions without any issues.

Technology: BIPOLAR

Being based on bipolar technology, this synthesizer IC offers high performance and precision in signal processing, making it a suitable choice for audio applications.

Technical Specifications

Music & Sound Synthesizer ICs SN76477N attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN76477N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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