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MSP50C604PM

Texas Instruments

MSP50C604PM by Texas Instruments

MSP50C604PM by Texas Instruments is a Speech Synthesizer IC in a square plastic/epoxy package. It has 64 terminals with low profile flatpack style, suitable for hand-held devices. Operating temperature range from 0 to 70°C, voltage supply of 3-5.2V, and on-chip ROM/SRAM memory make it ideal for commercial applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,072 parts In-Stock

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7,072

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Digiode

USA . 1,425 parts In-Stock

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1,425

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,209 parts In-Stock

1+ parts

$0.142

100+ parts

-

1k+ parts

$1.488

10k+ parts

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1,209

$0.142

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$1.488

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ChromeModa Solutions

Germany . 3,501 parts In-Stock

1+ parts

$0.160

100+ parts

$0.131

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3,501

$0.160

$0.131

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IDEA Electronic Components Group

UK . 886 parts In-Stock

1+ parts

$0.160

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$0.144

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886

$0.160

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$0.144

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One Stop Electronics

USA . 416 parts In-Stock

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$6.800

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416

$6.800

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AZTECH Wire

Italy . 299 parts In-Stock

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$13.185

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299

$13.185

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Corphita

USA . 4,626 parts In-Stock

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4,626

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DigiPath Technology Company

USA . 1,396 parts In-Stock

1+ parts

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$0.144

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1,396

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$0.144

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Overview

Experience the ultimate in sound synthesis with the MSP50C604PM by Texas Instruments. Crafted with precision and expertise, this music and sound synthesizer IC offers unparalleled quality and performance. Ideal for hand-held devices, this speech synthesizer delivers crystal-clear audio with a wide range of applications. Dive into a world of innovation and creativity with this cutting-edge technology that promises to elevate your audio experience to new heights. Discover the difference with Texas Instruments and unlock endless possibilities in sound synthesis.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making this product suitable for handheld devices that require portability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Package Shape: SQUARE

Square package shape provides uniformity and compactness, making it easier to integrate into electronic devices.

General IC Type: SPEECH SYNTHESIZER

Speech synthesizer capability allows for the creation of realistic and natural-sounding voices and speech patterns, ideal for a variety of applications.

No. of Terminals: 64

With 64 terminals, this IC offers flexibility and connectivity options for various functions and features in the device it is integrated into.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style ensures space-saving design and efficient layout on the circuit board, optimizing performance and functionality.

Application: HAND-HELD DEVICES

Specifically designed for handheld devices, this IC is ideal for portable gadgets that require speech synthesizer functionality.

Maximum Operating Temperature: 70 °C

Wide operating temperature range of up to 70°C ensures reliability and performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature of 0°C ensures functionality even in colder environments.

Terminal Position: QUAD

Quad terminal position offers stable and secure connections, enhancing the overall performance and reliability of the IC.

Maximum Seated Height: 1.6 mm

Low maximum seated height of 1.6 mm allows for a slim and compact design, suitable for space-constrained devices.

Width: 10 mm

Compact width of 10 mm enables easy integration into electronic devices with limited space availability.

Minimum Supply Voltage (Vsup): 3 V

Low minimum supply voltage requirement of 3 V ensures energy efficiency and compatibility with a wide range of power sources.

Length: 10 mm

Short length of 10 mm contributes to the overall compactness and space-saving design of the IC.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliability and performance in standard operating conditions for commercial electronic devices.

On Chip Memory Type: ROM; SRAM

On-chip ROM and SRAM memory types provide storage and processing capabilities that are essential for speech synthesizer functionality.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable connections, ensuring stable performance in various operating conditions.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5 mm allows for precise and compact layout on the circuit board, optimizing space and performance.

Maximum Supply Voltage (Vsup): 5.2 V

High maximum supply voltage of 5.2 V provides flexibility and compatibility with a wide range of power sources, enhancing the versatility of the IC.

Technical Specifications

Music & Sound Synthesizer ICs MSP50C604PM attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

Application:

HAND-HELD DEVICES

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

On Chip Memory Type:

ROM; SRAM

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

5.2 V

Minimum Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

10 mm

Trade Compliance

MSP50C604PM General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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