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SAE800GXK

Infineon Technologies

SAE800GXK by Infineon Technologies

Infineon's SAE800GXK is a small outline tone/music synthesizer IC with 8 terminals. Operating b/w -25 to 125°C, it supports supply voltages from 2.8V to 18V. Ideal for music and sound applications, this bipolar technology IC is surface mountable in plastic/epoxy package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 1,257 parts In-Stock

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Digiode

USA . 298 parts In-Stock

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Nova Conductors

Japan . 150 parts In-Stock

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150

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Modulus Dynamics

Lithuania . 2,225 parts In-Stock

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$0.824

100+ parts

$0.791

1k+ parts

$0.758

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2,225

$0.824

$0.791

$0.758

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Aztec Data Supply Inc.

USA . 4,185 parts In-Stock

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$0.840

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$0.840

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Corohmni

South Africa . 96 parts In-Stock

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$2.729

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$2.729

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AZTECH Wire

Italy . 293 parts In-Stock

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$6.248

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293

$6.248

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Semicontronic

India . 800 parts In-Stock

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$9.800

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$9.555

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$9.506

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800

$9.800

$9.555

$9.506

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Ampacity Inc.

Singapore . 1,639 parts In-Stock

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$12.800

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$12.800

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Andel Nordic

Denmark . 311 parts In-Stock

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$18.290

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$12.802

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$12.802

311

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$12.802

Continental Prestige Electronics

USA . 4,899 parts In-Stock

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Bastille Electronics

Australia . 2,556 parts In-Stock

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Argo Parts USA

USA . 347 parts In-Stock

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Corphita

USA . 150 parts In-Stock

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iodParts Technologies Inc.

India . 9 parts In-Stock

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Overview

Unleash the power of sound with the SAE800GXK by Infineon Technologies. Crafted with precision and expertise, this Music & Sound Synthesizer IC is designed to elevate your audio experience to new heights. With its compact size and advanced technology, it offers unparalleled value and benefits to customers looking for high-quality sound solutions. Whether you're a musician, audio enthusiast, or tech-savvy individual, the SAE800GXK is the perfect choice for your next project. Elevate your sound and immerse yourself in the world of music with this innovative product from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and longevity of the product.

Surface Mount: YES

Being surface mountable makes it easy to integrate into various electronic applications.

General IC Type: TONE/MUSIC SYNTHESIZER

Designed specifically for tone and music synthesis, offering high performance in audio applications.

No. of Terminals: 8

Provides sufficient connectivity options for different circuit configurations.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: -25 °C

Can operate in low temperature conditions without any issues, making it versatile.

Technology: BIPOLAR

Bipolar technology offers high speed and low noise performance, ideal for audio applications.

Maximum Supply Voltage (Vsup): 18 V

Support for a high supply voltage allows for flexibility in power requirements.

Technical Specifications

Music & Sound Synthesizer ICs SAE800GXK attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Infineon Technologies

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

5 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

2.8 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4 mm

Trade Compliance

SAE800GXK General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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