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TSP53C30AN2L

Texas Instruments

TSP53C30AN2L by Texas Instruments

TSP53C30AN2L by Texas Instruments is a Speech Synthesizer IC with 28 terminals, operating at 5V. It has a max supply current of 3mA and operates b/w 0°C to 70°C. This IC is commonly used in Music & Sound applications due to its CMOS technology and through-hole terminal form.

Median Price

$37.107

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 5 parts In-Stock

1+ parts

$37.107

100+ parts

$38.963

1k+ parts

$36.736

10k+ parts

-

5

$37.107

$38.963

$36.736

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Vyrian

USA . 2,271 parts In-Stock

1+ parts

-

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2,271

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Digiode

USA . 849 parts In-Stock

1+ parts

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849

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Q Components

USA . 52 parts In-Stock

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 368 parts In-Stock

1+ parts

$2.360

100+ parts

-

1k+ parts

$2.859

10k+ parts

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368

$2.360

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$2.859

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DigiPath Technology Company

USA . 1,699 parts In-Stock

1+ parts

$2.599

100+ parts

$2.391

1k+ parts

-

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1,699

$2.599

$2.391

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ChromeModa Solutions

Germany . 2,017 parts In-Stock

1+ parts

$2.652

100+ parts

$2.175

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-

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2,017

$2.652

$2.175

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IDEA Electronic Components Group

UK . 1,703 parts In-Stock

1+ parts

$2.652

100+ parts

-

1k+ parts

$2.387

10k+ parts

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1,703

$2.652

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$2.387

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AZTECH Wire

Italy . 217 parts In-Stock

1+ parts

$7.941

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217

$7.941

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One Stop Electronics

USA . 1,509 parts In-Stock

1+ parts

$14.800

100+ parts

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1,509

$14.800

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Corphita

USA . 3,877 parts In-Stock

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3,877

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Overview

Enhance your audio projects with the Texas Instruments TSP53C30AN2L Speech Synthesizer IC. Crafted with precision by a trusted manufacturer in the industry, this high-quality component is perfect for music and sound applications. Offering clear and crisp speech synthesis capabilities, this IC provides exceptional value and performance to customers looking to elevate their audio creations. Whether you're a hobbyist or a professional, the TSP53C30AN2L is sure to impress with its reliable operation and ease of use. Elevate your projects today with this top-of-the-line synthesizer IC.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the synthesizer IC easy to handle and resistant to damage during handling.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices or circuit boards.

General IC Type: SPEECH SYNTHESIZER

This IC is specifically designed for speech synthesis applications, making it suitable for projects requiring voice output.

Power Supplies (V): 5

Operating at 5V allows for compatibility with a wide range of electronic systems, making it versatile for different applications.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options for interfacing with other components or peripherals.

Package Style (Meter): IN-LINE

The in-line package style saves space and simplifies PCB layout, making it convenient for compact designs.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability and performance even in demanding environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature allows for use in a wide range of temperature conditions without compromising functionality.

Terminal Position: DUAL

Dual terminal positions offer flexibility and ease of installation in various circuit configurations.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring compatibility with standard electronic systems and requirements.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making the IC efficient and reliable in operation.

Terminal Form: THROUGH-HOLE

Through-hole terminals are sturdy and reliable for secure soldering connections, ensuring stable performance over time.

Maximum Supply Current: 3 mA

The low maximum supply current consumption is energy-efficient and suitable for battery-operated devices or power-sensitive applications.

Terminal Pitch: 2.54 mm

The standard terminal pitch allows for easy connection to a breadboard or PCB for prototyping or production purposes.

Technical Specifications

Music & Sound Synthesizer ICs TSP53C30AN2L attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.4

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

3 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TSP53C30AN2L General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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