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CSM41XXXN2

Texas Instruments

CSM41XXXN2 by Texas Instruments

CSM41XXXN2 by Texas Instruments is a Speech Synthesizer IC with 28 terminals, operating at 0-70°C. It has a power supply of 5V and max supply current of 3mA. Ideal for Music & Sound applications due to its CMOS technology and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,689 parts In-Stock

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7,689

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Digiode

USA . 1,201 parts In-Stock

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1,201

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Distributors (Availability)

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Native Components

USA . 694 parts In-Stock

1+ parts

$0.955

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694

$0.955

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Northwest PG Solutions

USA . 693 parts In-Stock

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$1.050

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693

$1.050

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Parana Technologies

USA . 194 parts In-Stock

1+ parts

$3.019

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$280.349

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$2.717

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194

$3.019

$280.349

$2.717

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DigiPath Technology Company

USA . 1,986 parts In-Stock

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$3.324

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1,986

$3.324

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ChromeModa Solutions

Germany . 2,630 parts In-Stock

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$3.392

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$2.781

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2,630

$3.392

$2.781

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IDEA Electronic Components Group

UK . 324 parts In-Stock

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$3.392

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$3.053

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324

$3.392

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$3.053

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One Stop Electronics

USA . 1,106 parts In-Stock

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$9.800

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1,106

$9.800

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AZTECH Wire

Italy . 570 parts In-Stock

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$12.503

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570

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Corphita

USA . 2,454 parts In-Stock

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Overview

Experience the perfect harmony of quality and innovation with the CSM41XXXN2 by Texas Instruments. As a leader in the industry, Texas Instruments delivers unparalleled excellence in Music & Sound Synthesizer ICs. Whether you're creating cutting-edge music equipment or enhancing speech synthesis technology, this versatile IC offers exceptional value and performance. Elevate your projects with the reliability and precision that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy body material helps in reducing weight and cost, making the product more affordable and easier to handle.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on a circuit board, optimizing layout and design.

General IC Type: SPEECH SYNTHESIZER

Speech synthesizer type enables the product to generate human-like speech, ideal for applications requiring voice output.

Power Supplies (V): 5

Operating at 5V makes it compatible with standard power sources, ensuring ease of integration into existing systems.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options, allowing for versatile usage in different applications.

Package Style (Meter): IN-LINE, SHRINK PITCH

The in-line, shrink pitch package style offers a compact form factor, saving space on the circuit board.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can withstand higher temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Operating down to 0°C ensures reliable performance in a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connection options, enhancing reliability and ease of use.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable operation in typical ambient conditions, suitable for most commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and performance of the product.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and secure connections, simplifying assembly and maintenance.

Maximum Supply Current: 3 mA

Operating at a maximum supply current of 3 mA ensures efficient power usage, reducing energy costs and heat dissipation.

Terminal Pitch: 1.78 mm

With a terminal pitch of 1.78 mm, the product offers precise and stable connections, minimizing the risk of signal interference.

Technical Specifications

Music & Sound Synthesizer ICs CSM41XXXN2 attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SDIP28,.4

Package Shape:

Package Style (Meter):

IN-LINE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

3 mA

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.78 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

CSM41XXXN2 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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