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MSP53C392N

Texas Instruments

MSP53C392N by Texas Instruments

The Texas Instruments MSP53C392N is a Speech Synthesizer IC with 16 terminals, operating at 3.3-6.5V. It comes in an in-line package style, measuring 19.304mm x 7.62mm x 5.08mm, suitable for music and sound applications due to its CMOS technology and low supply current of 4.5mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,072 parts In-Stock

1+ parts

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4,072

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Digiode

USA . 2,178 parts In-Stock

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2,178

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,342 parts In-Stock

1+ parts

$1.320

100+ parts

-

1k+ parts

$2.061

10k+ parts

-

2,342

$1.320

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$2.061

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ChromeModa Solutions

Germany . 5,672 parts In-Stock

1+ parts

$1.483

100+ parts

$1.216

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5,672

$1.483

$1.216

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IDEA Electronic Components Group

UK . 804 parts In-Stock

1+ parts

$1.483

100+ parts

-

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$1.335

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804

$1.483

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$1.335

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AZTECH Wire

Italy . 273 parts In-Stock

1+ parts

$10.978

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273

$10.978

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One Stop Electronics

USA . 1,286 parts In-Stock

1+ parts

$13.800

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1,286

$13.800

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Corphita

USA . 2,685 parts In-Stock

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2,685

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DigiPath Technology Company

USA . 1,085 parts In-Stock

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$1.337

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1,085

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$1.337

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Overview

Enhance your audio projects with the MSP53C392N from Texas Instruments, a leading manufacturer known for top-quality electronics. This Music & Sound Synthesizer IC offers unparalleled performance and reliability, making it ideal for a wide range of applications in speech synthesis. With its compact design and advanced technology, this product delivers exceptional value and benefits to customers looking to create cutting-edge sound systems. Upgrade your projects with the MSP53C392N and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and reliability for the IC, making it suitable for long-term use.

Power Supplies (V): 3.3/6.5

Support for dual power supplies allows flexibility in voltage requirements, catering to different system designs.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into various electronic devices or systems.

No. of Terminals: 16

Sufficient number of terminals for connection to other components, providing versatility in circuit design.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability in various environments and usage conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for use in a wide range of temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability of the IC.

Width: 7.62 mm

Compact width facilitates space-saving design and integration into compact electronic devices.

Minimum Supply Voltage (Vsup): 3.3 V

Low minimum supply voltage enables operation in applications with limited power availability.

Technical Specifications

Music & Sound Synthesizer ICs MSP53C392N attributes and parameters. Explore more Music & Sound Synthesizer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T16

Length:

19.304 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/6.5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Audio Synthesizer ICs

Maximum Supply Current:

4.5 mA

Maximum Supply Voltage (Vsup):

6.5 V

Minimum Supply Voltage (Vsup):

3.3 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

MSP53C392N General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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