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TMS370C742AFNTG4

Texas Instruments

TMS370C742AFNTG4 by Texas Instruments

TMS370C742AFNTG4 by Texas Instruments is an 8-bit microcontroller with 44 terminals, operating at a max frequency of 20 MHz. Ideal for industrial applications, it features OTPROM ROM programmability, PWM channels, and ADC support. With a temp range of -40 to 105 °C, this CMOS technology chip carrier has a compact square shape suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,537 parts In-Stock

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Digiode

USA . 3,422 parts In-Stock

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3,422

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AZTECH Wire

Italy . 883 parts In-Stock

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$8.451

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883

$8.451

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One Stop Electronics

USA . 899 parts In-Stock

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$12.000

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$12.000

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Microchip USA

USA . 415 parts In-Stock

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$31.080

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$30.630

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$30.410

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$30.190

415

$31.080

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$30.190

Parana Technologies

USA . 1,536 parts In-Stock

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$60.969

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DigiPath Technology Company

USA . 1,449 parts In-Stock

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$67.134

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ChromeModa Solutions

Germany . 848 parts In-Stock

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$68.504

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$56.173

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$68.504

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IDEA Electronic Components Group

UK . 7 parts In-Stock

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$68.504

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$65.079

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$61.654

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7

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A-Z Elektronik GmbH

Germany . 5,153 parts In-Stock

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Kepictronics

USA . 1,404 parts In-Stock

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Corphita

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Overview

Unleash the power of innovation with the TMS370C742AFNTG4 by Texas Instruments, a cutting-edge microcontroller that delivers unparalleled quality and reliability. With Texas Instruments' reputation for excellence in manufacturing, this chip offers endless possibilities for applications in various industries. From automotive to consumer electronics, trust in the TMS370C742AFNTG4 to provide unmatched performance and efficiency. Experience the value and benefits of this top-of-the-line microcontroller, designed to exceed your expectations and propel your projects to new heights.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Provides durability and protection for the internal components of the microcontroller.

Maximum Supply Voltage - 5.5 V

Allows for a higher voltage input, making it suitable for a wide range of applications.

Bit Size - 8

Offers a good balance between performance and complexity for various tasks.

ADC Channels - YES

Enables analog-to-digital conversion, expanding the range of input signals that can be processed.

Maximum Clock Frequency - 20 MHz

Provides high-speed processing capabilities for efficient operation.

Technology - CMOS

Offers low power consumption and high noise immunity for reliable performance.

No. of I/O Lines - 36

Provides ample input/output options for connecting to external devices and sensors.

Technical Specifications

Microcontrollers TMS370C742AFNTG4 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e4

Length:

16.585 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

44

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

5 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Peripheral IC Type:

Trade Compliance

TMS370C742AFNTG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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