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TMS320VC5409ZGU100

Texas Instruments

TMS320VC5409ZGU100 by Texas Instruments

TMS320VC5409ZGU100 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and 32768 RAM words for efficient signal processing tasks.

Median Price

$21.800

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$21.800

1k+ parts

$19.510

10k+ parts

$18.360

11

-

$21.800

$19.510

$18.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,435 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,435

-

-

-

-

Digiode

USA . 3,501 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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3,501

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 2,701 parts In-Stock

1+ parts

$17.262

100+ parts

-

1k+ parts

-

10k+ parts

-

2,701

$17.262

-

-

-

AZTECH Wire

Italy . 42 parts In-Stock

1+ parts

$18.110

100+ parts

-

1k+ parts

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10k+ parts

-

42

$18.110

-

-

-

Parana Technologies

USA . 1,895 parts In-Stock

1+ parts

$48.799

100+ parts

-

1k+ parts

-

10k+ parts

-

1,895

$48.799

-

-

-

ChromeModa Solutions

Germany . 2,992 parts In-Stock

1+ parts

$54.830

100+ parts

$44.961

1k+ parts

-

10k+ parts

-

2,992

$54.830

$44.961

-

-

IDEA Electronic Components Group

UK . 1,978 parts In-Stock

1+ parts

$54.830

100+ parts

$52.088

1k+ parts

$49.347

10k+ parts

-

1,978

$54.830

$52.088

$49.347

-

Corphita

USA . 4,318 parts In-Stock

1+ parts

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100+ parts

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4,318

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DigiPath Technology Company

USA . 1,822 parts In-Stock

1+ parts

-

100+ parts

$49.435

1k+ parts

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10k+ parts

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1,822

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$49.435

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Microchip USA

USA . 320 parts In-Stock

1+ parts

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320

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Overview

Experience superior performance and reliability with the TMS320VC5409ZGU100 by Texas Instruments, a trusted leader in digital signal processors. Ideal for a wide range of applications, this DSP offers unparalleled value with its advanced technology and efficient design. Whether you're working on audio processing, image recognition, or telecommunications, this product provides the power and precision you need to bring your projects to the next level. Trust Texas Instruments to deliver quality, innovation, and excellence in every component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, ideal for portable devices.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.98 V

Efficient power usage with a relatively low supply voltage.

Address Bus Width: 23

Wide address bus allows for fast and efficient data processing.

Package Shape: SQUARE

Optimal design for fitting into compact spaces on circuit boards.

Bit Size: 16

Suitable for processing digital signals and data effectively.

Power Supplies (V): 1.8,3.3

Supports multiple power supply options for flexibility in system design.

No. of Terminals: 144

Sufficient terminals for connecting to other components and peripherals.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

Advanced package style for improved performance and reliability.

Minimum Supply Voltage: 1.71 V

Ensures stable operation even under low power supply conditions.

Maximum Operating Temperature: 100 °C

Can withstand high operating temperatures for industrial applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme low temperatures for various environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance for long-term use.

Terminal Position: BOTTOM

Facilitates easy connection and soldering during assembly.

Maximum Seated Height: 1.4 mm

Low profile design for space-efficient installation.

RAM Words: 32768

Sufficient memory capacity for storing and processing data efficiently.

Width: 12 mm

Compact width for fitting into smaller electronic devices.

Boundary Scan: YES

Enables testing and debugging of the device during manufacturing.

External Data Bus Width: 16

Compatible with standard data bus width for easy interfacing with other components.

Maximum Clock Frequency: 20 MHz

Fast clock frequency for quick processing of digital signals.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures for manufacturing processes.

Internal Bus Architecture: MULTIPLE

Efficient bus architecture for handling data flow within the device.

Length: 12 mm

Compact length for space-saving installation on circuit boards.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial temperature environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Versatile IC type for handling digital signal processing tasks efficiently.

Technology: CMOS

Low power consumption and high noise immunity for reliable operation.

Terminal Form: BALL

Ball terminal form for easy soldering and reliable connections.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent performance.

Terminal Pitch: 0.8 mm

Optimal terminal pitch for efficient connections on circuit boards.

Format: FIXED POINT

Fixed-point format for accurate digital signal processing tasks.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for safe storage and handling.

Low Power Mode: YES

Energy-efficient low power mode for extended battery life.

Barrel Shifter: YES

Barrel shifter feature for efficient data manipulation and processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320VC5409ZGU100 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B144

JESD-609 Code:

e1

Length:

12 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA144,13X13,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.4 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

TMS320VC5409ZGU100 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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