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TMS320UC5409PGE-80

Texas Instruments

TMS320UC5409PGE-80 by Texas Instruments

TMS320UC5409PGE-80 by Texas Instruments is a 16-bit DSP with 23-bit address bus, operating at max 20MHz. Ideal for industrial applications, it features low power mode, barrel shifter, and 32K RAM words for efficient signal processing.

Median Price

$25.040

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 26 parts In-Stock

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Rochester

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$21.680

1k+ parts

$19.400

10k+ parts

$18.260

25

-

$21.680

$19.400

$18.260

DigiKey

USA . 25 parts In-Stock

1+ parts

-

100+ parts

$25.040

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-

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25

-

$25.040

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Verical

USA . 13 parts In-Stock

1+ parts

-

100+ parts

$28.300

1k+ parts

$25.587

10k+ parts

-

13

-

$28.300

$25.587

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 225 parts In-Stock

1+ parts

$22.876

100+ parts

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225

$22.876

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Vyrian

USA . 6,192 parts In-Stock

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6,192

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DigiKey Marketplace

USA . 25 parts In-Stock

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25

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 22 parts In-Stock

1+ parts

$20.470

100+ parts

-

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22

$20.470

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Corphita

USA . 3,557 parts In-Stock

1+ parts

$21.672

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3,557

$21.672

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Parana Technologies

USA . 1,426 parts In-Stock

1+ parts

$22.978

100+ parts

-

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$23.629

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1,426

$22.978

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$23.629

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DigiPath Technology Company

USA . 2,332 parts In-Stock

1+ parts

$25.302

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2,332

$25.302

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ChromeModa Solutions

Germany . 3,618 parts In-Stock

1+ parts

$25.818

100+ parts

$21.171

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3,618

$25.818

$21.171

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IDEA Electronic Components Group

UK . 965 parts In-Stock

1+ parts

$25.818

100+ parts

$24.527

1k+ parts

$23.236

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965

$25.818

$24.527

$23.236

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Microchip USA

USA . 462 parts In-Stock

1+ parts

$53.180

100+ parts

$52.250

1k+ parts

$51.790

10k+ parts

$51.330

462

$53.180

$52.250

$51.790

$51.330

Corohmni

South Africa . 1,096 parts In-Stock

1+ parts

$75.946

100+ parts

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1,096

$75.946

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Overview

Experience unparalleled performance with the TMS320UC5409PGE-80 by Texas Instruments, a leading manufacturer known for top-quality digital signal processors. Ideal for a wide range of applications, this DSP offers unmatched value and benefits to customers. With advanced features and reliable performance, this product ensures seamless operation and exceptional results in industrial settings. Choose the TMS320UC5409PGE-80 for top-notch quality and cutting-edge technology that sets you apart from the competition.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for portable devices.

Surface Mount: YES

Surface mount technology allows for easy installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 1.98 V

This voltage level is sufficient for most signal processing tasks while keeping power consumption in check.

Address Bus Width: 23

A wide address bus allows for efficient memory access, improving the overall performance of the DSP.

Package Shape: SQUARE

Square packages are easy to handle and provide a balanced footprint for PCB layout.

Bit Size: 16

A 16-bit processor can handle moderate complexity signal processing tasks efficiently.

Power Supplies (V): 1.8,1.8/3.3

Multiple power supply options offer flexibility in design and compatibility with different voltage standards.

No. of Terminals: 144

Having a high number of terminals allows for more connectivity options and versatile integration with other components.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

These package styles contribute to space-saving design, important for compact device applications like mobile phones.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage helps in reducing power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 100 °C

With a high operating temperature range, the DSP can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures makes the product suitable for various industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides good conductivity and corrosion resistance for reliable long-term operation.

Terminal Position: QUAD

Quad terminal configuration offers stable connectivity and ease of soldering during assembly.

Maximum Seated Height: 1.6 mm

Low seated height contributes to a slim profile and facilitates space-constrained designs.

RAM Words: 32768

With a large RAM capacity, the DSP can handle complex algorithms and data processing efficiently.

Width: 20 mm

Compact width dimension allows for the integration of the DSP in small form factor devices.

Boundary Scan: YES

Boundary scan capability aids in testing and debugging the device during production and maintenance phases.

External Data Bus Width: 16

Matching the data bus width with the processor's bit size ensures optimal data transfer speed and efficiency.

Maximum Clock Frequency: 20 MHz

A moderate clock frequency enables fast signal processing without excessive power consumption.

Maximum Time At Peak Reflow Temperature (s): 30

A specific reflow temperature profile ensures proper soldering of the device during assembly.

Peak Reflow Temperature °C: 260

The high reflow temperature tolerance ensures reliable solder joints and long-term durability.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow and parallel processing capabilities for improved performance.

Length: 20 mm

Compact length dimension allows for versatile placement options and efficient space utilization on the PCB.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in demanding environments.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The presence of various peripheral IC types enhances the connectivity and compatibility of the product with different systems.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and improved reliability for the DSP.

Terminal Form: GULL WING

Gull wing terminal form provides robust mechanical strength and facilitates easy soldering during assembly.

Nominal Supply Voltage: 1.8 V

The specified nominal supply voltage ensures stable and efficient operation of the DSP.

Terminal Pitch: 0.5 mm

A fine terminal pitch enables high-density mounting on the PCB, saving space and allowing for compact designs.

Format: FIXED POINT

Fixed-point format allows for fast and efficient arithmetic operations, suitable for signal processing applications.

Low Power Mode: YES

Low power mode helps in conserving energy and extending battery life in portable devices.

Barrel Shifter: YES

The presence of a barrel shifter enhances data manipulation and processing capabilities for complex algorithms.

Technical Specifications

Digital Signal Processors (DSPs) TMS320UC5409PGE-80 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

YES

Bit Size:

16

Boundary Scan:

YES

Maximum Clock Frequency:

20 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,1.8/3.3

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

1.6 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.98 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

TMS320UC5409PGE-80 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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