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TMS320LC31PQ40

Texas Instruments

TMS320LC31PQ40 by Texas Instruments

TMS320LC31PQ40 by Texas Instruments is a 32-bit DSP with 24-bit address bus, 32-bit external data bus, and max clock frequency of 40 MHz. Ideal for digital signal processing applications requiring low power mode, it features a plastic/epoxy package, operates b/w 0-85°C, and has a terminal pitch of 0.635mm.

Median Price

$48.442

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 403 parts In-Stock

1+ parts

-

100+ parts

$43.060

1k+ parts

$38.530

10k+ parts

$36.260

403

-

$43.060

$38.530

$36.260

DigiKey

USA . 403 parts In-Stock

1+ parts

-

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-

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403

-

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Verical

USA . 403 parts In-Stock

1+ parts

-

100+ parts

$53.825

1k+ parts

$48.163

10k+ parts

$45.325

403

-

$53.825

$48.163

$45.325

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 936 parts In-Stock

1+ parts

$45.448

100+ parts

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936

$45.448

-

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Vyrian

USA . 8,291 parts In-Stock

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8,291

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DigiKey Marketplace

USA . 403 parts In-Stock

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403

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Bristol Electronics

USA . 97 parts In-Stock

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97

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Connector Distribution Corp

USA . 12 parts In-Stock

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12

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Right Parts Inc.

USA . 12 parts In-Stock

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12

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 372 parts In-Stock

1+ parts

$28.896

100+ parts

-

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372

$28.896

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Corphita

USA . 1,975 parts In-Stock

1+ parts

$43.056

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1,975

$43.056

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Parana Technologies

USA . 1,525 parts In-Stock

1+ parts

$66.843

100+ parts

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1,525

$66.843

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DigiPath Technology Company

USA . 405 parts In-Stock

1+ parts

$73.602

100+ parts

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405

$73.602

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ChromeModa Solutions

Germany . 6,342 parts In-Stock

1+ parts

$75.104

100+ parts

$61.585

1k+ parts

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6,342

$75.104

$61.585

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IDEA Electronic Components Group

UK . 1,935 parts In-Stock

1+ parts

$75.104

100+ parts

$71.349

1k+ parts

$67.594

10k+ parts

-

1,935

$75.104

$71.349

$67.594

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Microchip USA

USA . 271 parts In-Stock

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271

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Unleash the power of cutting-edge technology with the TMS320LC31PQ40 by Texas Instruments, a top-of-the-line digital signal processor that offers unparalleled performance and reliability. Ideal for a wide range of applications, this high-quality product provides customers with exceptional value and benefits. From its advanced features to its impressive capabilities, the TMS320LC31PQ40 is designed to meet all your processing needs with ease. Trust Texas Instruments for superior quality and innovation that goes above and beyond. Elevate your projects to new heights today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and convenient assembly onto circuit boards.

Maximum Supply Voltage: 3.47 V

The high maximum supply voltage ensures stable operation even under varying input voltages.

Address Bus Width: 24

A wider address bus width enables the processor to access and process larger amounts of memory.

Package Shape: SQUARE

The square package shape simplifies the design and layout of the circuit board.

Bit Size: 32

A larger bit size allows for faster and more efficient processing of data.

Power Supplies (V): 3.3

The nominal power supply voltage of 3.3V ensures compatibility with standard power sources.

No. of Terminals: 132

Having a high number of terminals provides flexibility for connecting to various components.

Package Style (Meter): FLATPACK

The flatpack package style offers a compact and space-saving form factor.

Minimum Supply Voltage: 3.13 V

The low minimum supply voltage ensures efficient power consumption and compatibility with a range of power sources.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: QUAD

The quad terminal position offers ease of soldering and robust mechanical stability.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for a compact overall system design.

RAM Words: 2048

A higher number of RAM words allows for efficient data storage and retrieval during processing.

Width: 24.13 mm

The compact width of the product enables efficient integration into tight spaces.

External Data Bus Width: 32

A wider external data bus width results in faster data transfer and processing capabilities.

Maximum Clock Frequency: 40 MHz

The high maximum clock frequency allows for quick and responsive signal processing.

Maximum Time At Peak Reflow Temperature (s): 30

The short peak reflow time ensures accurate and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables robust solder joints for durability.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data transfer speeds and overall processing efficiency.

Length: 24.13 mm

The compact length of the product allows for easy integration into various system designs.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type ensures compatibility with a wide range of digital processing applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Maximum Supply Current: 300 mA

The maximum supply current ensures reliable performance under load conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage is standardized and widely available for easy integration into various applications.

Terminal Pitch: 0.635 mm

The small terminal pitch allows for high-density mounting and space-efficient PCB layouts.

Format: FLOATING POINT

The floating-point format enables precise mathematical calculations for signal processing applications.

Moisture Sensitivity Level (MSL): 4

The moisture sensitivity level indicates the product's resistance to moisture-related failures, ensuring reliability in humid environments.

Low Power Mode: YES

The low power mode feature helps conserve energy and extend the product's battery life in portable applications.

Barrel Shifter: YES

The barrel shifter functionality allows for efficient shifting and rotation operations in data processing tasks.

Technical Specifications

Digital Signal Processors (DSPs) TMS320LC31PQ40 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

24

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

NO

Maximum Clock Frequency:

40 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G132

JESD-609 Code:

e4

Length:

24.13 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

132

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

SPQFP132,1.1SQ

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Words:

2048

Maximum Seated Height:

4.57 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Current:

300 mA

Maximum Supply Voltage:

3.47 V

Minimum Supply Voltage:

3.13 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24.13 mm

Peripheral IC Type:

Trade Compliance

TMS320LC31PQ40 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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