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TMS320F28068FPFPQ

Texas Instruments

TMS320F28068FPFPQ by Texas Instruments

TMS320F28068FPFPQ by Texas Instruments is a 32-bit microcontroller with 131072 ROM words, 51200 RAM bytes, and 12-Ch 12-Bit ADC channels. Ideal for automotive applications due to AEC-Q100 screening level, it offers connectivity via CAN, I2C, SPI(2), UART(2), USB interfaces at a max clock frequency of 90 MHz.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,461 parts In-Stock

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Digiode

USA . 1,536 parts In-Stock

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1,536

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Distributors (Availability)

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AZTECH Wire

Italy . 600 parts In-Stock

1+ parts

$5.564

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600

$5.564

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One Stop Electronics

USA . 1,403 parts In-Stock

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$15.000

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Parana Technologies

USA . 1,058 parts In-Stock

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$22.481

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$23.146

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1,058

$22.481

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$23.146

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ChromeModa Solutions

Germany . 3,929 parts In-Stock

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$25.259

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$20.712

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3,929

$25.259

$20.712

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IDEA Electronic Components Group

UK . 1,172 parts In-Stock

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$25.259

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$23.996

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$22.733

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1,172

$25.259

$23.996

$22.733

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Corphita

USA . 3,712 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,400 parts In-Stock

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DigiPath Technology Company

USA . 1,296 parts In-Stock

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$22.774

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$22.774

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Microchip USA

USA . 478 parts In-Stock

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Overview

Unleash the power of innovation with the TMS320F28068FPFPQ by Texas Instruments. As a leader in microcontrollers, Texas Instruments delivers cutting-edge technology and reliability that you can trust. This versatile device is perfect for a wide range of applications, offering customers value, benefits, and advantages like never before. Experience seamless connectivity, high-speed processing, and top-notch performance with the TMS320F28068FPFPQ. Upgrade your projects and take them to the next level with this exceptional microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it ideal for various applications.

Maximum Supply Voltage: 1.995 V

The high maximum supply voltage allows for flexibility in power input options.

Bit Size: 32

The 32-bit processing capability enables fast and efficient operation of the microcontroller.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product is designed to integrate a CPU, memory, and peripherals in a single chip, making it a compact and versatile solution for embedded systems.

Maximum Operating Temperature: 125 °C

The high operating temperature range ensures reliable performance in harsh environmental conditions.

ROM Programmability: FLASH

Flash programmability allows for easy and flexible code updates, enhancing the versatility of the microcontroller.

Analog To Digital Convertors: 12-Ch 12-Bit

The inclusion of 12 analog to digital converters with 12-bit resolution enables accurate and precise data acquisition from external sensors.

Connectivity: CAN, I2C, SPI(2), UART(2), USB

Multiple connectivity options such as CAN, I2C, SPI, UART, and USB make it easy to interface the microcontroller with various peripherals and devices.

Technical Specifications

Microcontrollers TMS320F28068FPFPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

IT HAS OTPROM OF 1K

Address Bus Width:

0

Bit Size:

32

CPU Family:

TMS320

Maximum Clock Frequency:

90 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

80

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP80,.55SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

51200

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

90 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA(6), POR, PWM(14), TEMPERATURE SENSOR, TIMER(3), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TMS320F28068FPFPQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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