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TMS320F28067PZPQ

Texas Instruments

TMS320F28067PZPQ by Texas Instruments

TMS320F28067PZPQ by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 102400 RAM bytes. It operates at a max clock frequency of 80 MHz, suitable for automotive applications requiring CAN, I2C, SPI connectivity. With low power mode and 16 PWM channels, it offers high performance in a compact package.

Median Price

$18.893

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 821 parts In-Stock

1+ parts

$14.576

100+ parts

$12.732

1k+ parts

$8.781

10k+ parts

-

821

$14.576

$12.732

$8.781

-

Mouser Electronics

USA . 4 parts In-Stock

1+ parts

$23.210

100+ parts

$14.840

1k+ parts

$14.310

10k+ parts

-

4

$23.210

$14.840

$14.310

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,687 parts In-Stock

1+ parts

$13.847

100+ parts

-

1k+ parts

-

10k+ parts

-

1,687

$13.847

-

-

-

Vyrian

USA . 7,576 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,576

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 136 parts In-Stock

1+ parts

$12.390

100+ parts

-

1k+ parts

-

10k+ parts

-

136

$12.390

-

-

-

Corphita

USA . 1,902 parts In-Stock

1+ parts

$13.118

100+ parts

-

1k+ parts

-

10k+ parts

-

1,902

$13.118

-

-

-

Microchip USA

USA . 2,168 parts In-Stock

1+ parts

$40.480

100+ parts

$39.900

1k+ parts

$39.610

10k+ parts

$39.320

2,168

$40.480

$39.900

$39.610

$39.320

Parana Technologies

USA . 2,099 parts In-Stock

1+ parts

$59.476

100+ parts

$5,523.252

1k+ parts

$53.528

10k+ parts

-

2,099

$59.476

$5,523.252

$53.528

-

DigiPath Technology Company

USA . 657 parts In-Stock

1+ parts

$65.490

100+ parts

$60.251

1k+ parts

-

10k+ parts

-

657

$65.490

$60.251

-

-

ChromeModa Solutions

Germany . 1,542 parts In-Stock

1+ parts

$66.827

100+ parts

$54.798

1k+ parts

-

10k+ parts

-

1,542

$66.827

$54.798

-

-

IDEA Electronic Components Group

UK . 703 parts In-Stock

1+ parts

$66.827

100+ parts

$63.486

1k+ parts

$60.144

10k+ parts

-

703

$66.827

$63.486

$60.144

-

Overview

Unlock limitless possibilities with the TMS320F28067PZPQ by Texas Instruments. This cutting-edge microcontroller is designed with precision and reliability in mind, making it the perfect choice for a wide range of applications. From automotive to industrial control systems, this versatile device offers unmatched performance and efficiency. Say goodbye to limitations and hello to innovation with the TMS320F28067PZPQ - your key to seamless integration and optimal functionality. Choose quality, choose Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost.

Maximum Supply Voltage: 1.995 V

The low maximum supply voltage helps in reducing power consumption, making it energy-efficient.

Screening Level: AEC-Q100

Compliance with automotive quality standards ensures reliability and safety in automotive applications.

Bit Size: 32

The 32-bit architecture allows for efficient processing and handling of data in complex applications.

No. of Terminals: 100

Having a high number of terminals provides versatility in connecting external devices and peripherals.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles offer flexibility in design and mounting options for different PCB layouts.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage ensures reliable operation even in low power scenarios.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range makes it suitable for industrial and automotive environments.

CPU Family: TMS320

Being part of the TMS320 family ensures compatibility and support for a wide range of development tools and resources.

Technical Specifications

Microcontrollers TMS320F28067PZPQ attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Additional Features:

2KB OF OTP ROM

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

TMS320

Maximum Clock Frequency:

80 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

6

No. of External Interrupts:

3

No. of I/O Lines:

54

No. of Terminals:

100

On Chip Program ROM Width:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP100,.63SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

RAM Bytes:

102400

ROM Words:

131072

ROM Programmability:

FLASH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Speed:

80 rpm

Maximum Supply Current:

245 mA

Maximum Supply Voltage:

1.995 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN, I2C, SCI(2), SPI(2), UART(2), USB

Peripherals:

BOR, COMPARATOR(3), DMA, POR, PWM(16), TIMER(3), WDT

Analog To Digital Convertors:

16-Ch 12-Bit

Trade Compliance

TMS320F28067PZPQ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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