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TMS320DM6431ZDU3

Texas Instruments

TMS320DM6431ZDU3 by Texas Instruments

TMS320DM6431ZDU3 by Texas Instruments is a 32-bit DSP with integrated cache, operating at max 30 MHz. Ideal for digital signal processing applications, it features 16384 RAM words and 72 DMA channels. With low power mode and boundary scan support, it offers high performance in a compact package.

Median Price

$14.590

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 303 parts In-Stock

1+ parts

-

100+ parts

$14.590

1k+ parts

-

10k+ parts

-

303

-

$14.590

-

-

Rochester

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$12.630

1k+ parts

$11.300

10k+ parts

$10.630

73

-

$12.630

$11.300

$10.630

Verical

USA . 60 parts In-Stock

1+ parts

-

100+ parts

$15.787

1k+ parts

$14.125

10k+ parts

$13.287

60

-

$15.787

$14.125

$13.287

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,609 parts In-Stock

1+ parts

$13.328

100+ parts

-

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-

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1,609

$13.328

-

-

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Vyrian

USA . 6,541 parts In-Stock

1+ parts

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6,541

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Chip Stock

USA . 401 parts In-Stock

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401

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DigiKey Marketplace

USA . 303 parts In-Stock

1+ parts

-

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303

-

-

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

1+ parts

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60

-

-

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Bristol Electronics

USA . 60 parts In-Stock

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60

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Dan-Mar Components

USA . 60 parts In-Stock

1+ parts

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60

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Euro-Tech

UK . 13 parts In-Stock

1+ parts

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 551 parts In-Stock

1+ parts

$4.270

100+ parts

-

1k+ parts

$4.100

10k+ parts

$4.100

551

$4.270

-

$4.100

$4.100

Corphita

USA . 232 parts In-Stock

1+ parts

$12.627

100+ parts

-

1k+ parts

-

10k+ parts

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232

$12.627

-

-

-

Component Stockers USA

USA . 872 parts In-Stock

1+ parts

$14.560

100+ parts

$13.680

1k+ parts

-

10k+ parts

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872

$14.560

$13.680

-

-

Microchip USA

USA . 316 parts In-Stock

1+ parts

$40.850

100+ parts

$40.270

1k+ parts

$39.980

10k+ parts

$39.680

316

$40.850

$40.270

$39.980

$39.680

Corohmni

South Africa . 3,105 parts In-Stock

1+ parts

$62.229

100+ parts

-

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10k+ parts

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3,105

$62.229

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Parana Technologies

USA . 1,129 parts In-Stock

1+ parts

$72.581

100+ parts

-

1k+ parts

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1,129

$72.581

-

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DigiPath Technology Company

USA . 1,226 parts In-Stock

1+ parts

$79.921

100+ parts

$73.527

1k+ parts

-

10k+ parts

-

1,226

$79.921

$73.527

-

-

ChromeModa Solutions

Germany . 3,338 parts In-Stock

1+ parts

$81.552

100+ parts

$66.873

1k+ parts

-

10k+ parts

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3,338

$81.552

$66.873

-

-

IDEA Electronic Components Group

UK . 1,345 parts In-Stock

1+ parts

$81.552

100+ parts

$77.474

1k+ parts

$73.397

10k+ parts

-

1,345

$81.552

$77.474

$73.397

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Perfect Parts

USA . 330 parts In-Stock

1+ parts

-

100+ parts

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330

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Overview

Unlock the power of cutting-edge technology with the TMS320DM6431ZDU3 by Texas Instruments. As a leader in digital signal processors, Texas Instruments delivers top-notch quality and reliability. This DSP is perfect for a wide range of applications, offering seamless integration, high-speed processing, and low power consumption. Experience the value and benefits of this product, from its integrated cache to its advanced internal bus architecture. Trust Texas Instruments to provide you with the tools you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and protection for the DSP, ensuring long-lasting performance.

Integrated Cache: YES

Having an integrated cache helps in improving processing speeds and efficiency of the DSP.

Maximum Supply Voltage: 1.89 V

This voltage value allows for sufficient power supply to the DSP without risking damage from overvoltage.

Address Bus Width: 32

A wider address bus allows for efficient memory addressing and data transfer within the DSP.

Power Supplies (V): 1.2, 1.8, 3.3

Having multiple power supply options gives flexibility in different operating environments and power requirements.

RAM Words: 16384

With a large RAM capacity, the DSP can efficiently handle large data sets and complex calculations.

Maximum Clock Frequency: 30 MHz

A high clock frequency ensures faster processing speeds and real-time performance for the DSP.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it an efficient choice for DSPs.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM6431ZDU3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B376

JESD-609 Code:

e1

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

72

No. of Terminals:

376

No. of Timers:

5

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA376,22X22,40

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.48 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM6431ZDU3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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