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TMS320DM641AGDK6

Texas Instruments

TMS320DM641AGDK6 by Texas Instruments

TMS320DM641AGDK6 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 32-bit external data bus, and max clock frequency of 75 MHz. Ideal for digital signal processing applications requiring low power mode, it features a grid array package style with 548 terminals and operates on supply voltages ranging from 1.36V to 3.3V.

Median Price

$36.742

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 191 parts In-Stock

1+ parts

-

100+ parts

$32.660

1k+ parts

$29.220

10k+ parts

$27.500

191

-

$32.660

$29.220

$27.500

DigiKey

USA . 191 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

191

-

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-

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Verical

USA . 191 parts In-Stock

1+ parts

-

100+ parts

$40.825

1k+ parts

$36.525

10k+ parts

$34.375

191

-

$40.825

$36.525

$34.375

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,285 parts In-Stock

1+ parts

$34.476

100+ parts

-

1k+ parts

-

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1,285

$34.476

-

-

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Vyrian

USA . 4,069 parts In-Stock

1+ parts

-

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-

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-

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4,069

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,126 parts In-Stock

1+ parts

$32.661

100+ parts

-

1k+ parts

-

10k+ parts

-

1,126

$32.661

-

-

-

Parana Technologies

USA . 1,102 parts In-Stock

1+ parts

$39.105

100+ parts

-

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1,102

$39.105

-

-

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Corohmni

South Africa . 2,154 parts In-Stock

1+ parts

$39.910

100+ parts

-

1k+ parts

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10k+ parts

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2,154

$39.910

-

-

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DigiPath Technology Company

USA . 611 parts In-Stock

1+ parts

$43.059

100+ parts

$39.615

1k+ parts

-

10k+ parts

-

611

$43.059

$39.615

-

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IDEA Electronic Components Group

UK . 1,084 parts In-Stock

1+ parts

$43.938

100+ parts

$41.741

1k+ parts

$39.544

10k+ parts

-

1,084

$43.938

$41.741

$39.544

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ChromeModa Solutions

Germany . 730 parts In-Stock

1+ parts

$43.938

100+ parts

$36.029

1k+ parts

-

10k+ parts

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730

$43.938

$36.029

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Microchip USA

USA . 393 parts In-Stock

1+ parts

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393

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Overview

Unlock the power of advanced digital signal processing with the TMS320DM641AGDK6 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality products that guarantee high performance and reliability. This DSP is perfect for a wide range of applications, offering customers unparalleled value, benefits, and advantages. Experience seamless integration, efficient processing, and exceptional results with the TMS320DM641AGDK6. Elevate your projects to the next level with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the DSP ensuring that it can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy assembly and integration into electronic devices, making this DSP convenient to use.

Maximum Supply Voltage: 1.44 V

The high maximum supply voltage of 1.44V enables the DSP to handle high power requirements efficiently.

Bit Size: 32

A 32-bit architecture allows for high processing speeds and precision in signal processing tasks.

Power Supplies (V): 1.4, 3.3

With multiple power supply options, this DSP can be adapted to different voltage requirements in electronic systems.

No. of Terminals: 548

The large number of terminals provides connectivity options for various input and output devices, enhancing the functionality of the DSP.

RAM Words: 16384

A large RAM capacity of 16384 words allows for efficient data storage and retrieval during signal processing operations.

Maximum Clock Frequency: 75 MHz

A high maximum clock frequency of 75 MHz ensures fast and smooth operation of the DSP in handling real-time signal processing tasks.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The peripheral IC type of this DSP indicates that it is specifically designed for digital signal processing applications, making it a reliable choice for such tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this DSP energy-efficient and reliable in signal processing operations.

Technical Specifications

Digital Signal Processors (DSPs) TMS320DM641AGDK6 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B548

JESD-609 Code:

e0

Length:

23 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

548

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA548,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

220

Power Supplies (V):

1.4,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.44 V

Minimum Supply Voltage:

1.36 V

Nominal Supply Voltage:

1.4 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

20

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320DM641AGDK6 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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