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TMS320C6743CZKB3

Texas Instruments

TMS320C6743CZKB3 by Texas Instruments

TMS320C6743CZKB3 by Texas Instruments is a 32-bit DSP with 13-bit address bus, 16-bit external data bus, and max clock frequency of 30 MHz. Ideal for digital signal processing applications requiring low power mode and floating-point format in a compact grid array package.

Median Price

$12.340

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$10.690

1k+ parts

$9.560

10k+ parts

$9.000

99

-

$10.690

$9.560

$9.000

DigiKey

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$12.340

1k+ parts

-

10k+ parts

-

99

-

$12.340

-

-

Verical

USA . 99 parts In-Stock

1+ parts

-

100+ parts

$13.363

1k+ parts

$11.950

10k+ parts

$11.250

99

-

$13.363

$11.950

$11.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,137 parts In-Stock

1+ parts

$11.276

100+ parts

-

1k+ parts

-

10k+ parts

-

4,137

$11.276

-

-

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Vyrian

USA . 4,854 parts In-Stock

1+ parts

-

100+ parts

-

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-

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4,854

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-

-

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DigiKey Marketplace

USA . 99 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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-

99

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,278 parts In-Stock

1+ parts

$10.683

100+ parts

-

1k+ parts

-

10k+ parts

-

2,278

$10.683

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-

-

Microchip USA

USA . 1,547 parts In-Stock

1+ parts

$31.920

100+ parts

$31.460

1k+ parts

$31.240

10k+ parts

$31.010

1,547

$31.920

$31.460

$31.240

$31.010

Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$32.823

100+ parts

$29.869

1k+ parts

$26.915

10k+ parts

-

5,000

$32.823

$29.869

$26.915

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Parana Technologies

USA . 1,522 parts In-Stock

1+ parts

$68.592

100+ parts

$6,369.836

1k+ parts

$61.733

10k+ parts

-

1,522

$68.592

$6,369.836

$61.733

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Corohmni

South Africa . 2,637 parts In-Stock

1+ parts

$73.674

100+ parts

-

1k+ parts

-

10k+ parts

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2,637

$73.674

-

-

-

DigiPath Technology Company

USA . 106 parts In-Stock

1+ parts

$75.529

100+ parts

-

1k+ parts

-

10k+ parts

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106

$75.529

-

-

-

ChromeModa Solutions

Germany . 6,354 parts In-Stock

1+ parts

$77.070

100+ parts

$63.197

1k+ parts

-

10k+ parts

-

6,354

$77.070

$63.197

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-

IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$77.070

100+ parts

$73.216

1k+ parts

$69.363

10k+ parts

-

1,406

$77.070

$73.216

$69.363

-

Overview

Experience the power and precision of the TMS320C6743CZKB3 from Texas Instruments, a leader in digital signal processors. Designed for high-performance applications, this DSP offers unmatched processing capabilities in a compact package. With a wide range of power supplies and advanced internal bus architecture, this product delivers exceptional results in various industries. Whether you're working on audio processing, communications, or industrial control systems, this DSP provides the speed and efficiency you need to bring your projects to life. Upgrade to the TMS320C6743CZKB3 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and versatile, making the product affordable and durable.

Maximum Supply Voltage: 1.32 V

Allows for efficient power consumption and operation within a safe voltage range.

Bit Size: 32

Provides high processing capability and performance for complex signal processing tasks.

RAM Words: 8192

Sufficient memory capacity for storing and manipulating data effectively.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specifically designed for digital signal processing tasks, ensuring optimized performance.

Maximum Clock Frequency: 30 MHz

Enables fast processing speed for real-time signal processing applications.

Technology: CMOS

Utilizes low power consumption and provides high noise immunity, suitable for portable or battery-operated devices.

Minimum Operating Temperature: 0 °C

Suitable for operation in a wide range of environments, including low-temperature conditions.

Maximum Operating Temperature: 90 °C

Can withstand high-temperature conditions without sacrificing performance.

Low Power Mode: YES

Allows for energy efficiency and longer battery life in power-constrained applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6743CZKB3 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

13

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

30 MHz

External Data Bus Width:

16

Format:

FLOATING POINT

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

8192

Maximum Seated Height:

2.05 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6743CZKB3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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