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TMS320C6727GDHA250

Texas Instruments

TMS320C6727GDHA250 by Texas Instruments

TMS320C6727GDHA250 by Texas Instruments is a 32-bit DSP with 262144 RAM words, 25 MHz clock frequency, and 1.2-3.3 V power supplies. It is used in digital signal processing applications requiring high-speed data processing and boundary scan capabilities.

Median Price

$44.378

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 3 parts In-Stock

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$44.378

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$44.378

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Vyrian

USA . 6,029 parts In-Stock

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Digiode

USA . 2,830 parts In-Stock

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2,830

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Legend Electronics Inc.

USA . 85 parts In-Stock

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One Stop Electronics

USA . 643 parts In-Stock

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$5.000

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AZTECH Wire

Italy . 480 parts In-Stock

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$5.365

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Corohmni

South Africa . 865 parts In-Stock

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$51.650

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Parana Technologies

USA . 681 parts In-Stock

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$58.849

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DigiPath Technology Company

USA . 1,844 parts In-Stock

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$64.801

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ChromeModa Solutions

Germany . 6,398 parts In-Stock

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$66.123

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$54.221

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IDEA Electronic Components Group

UK . 2,369 parts In-Stock

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$66.123

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$62.817

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$59.511

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2,369

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Component Stockers USA

USA . 587 parts In-Stock

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$99.990

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Corphita

USA . 1,354 parts In-Stock

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Microchip USA

USA . 230 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 7 parts In-Stock

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Overview

Experience superior signal processing capabilities with the TMS320C6727GDHA250 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality and reliability in their Digital Signal Processors (DSPs). This powerful processor is ideal for a wide range of applications, offering customers unmatched value and performance. From audio processing to telecommunications, the TMS320C6727GDHA250 provides the speed, efficiency, and precision you need to take your projects to the next level. Trust Texas Instruments to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protects the internal components of the DSP from external factors, ensuring a longer lifespan.

Surface Mount: YES

Surface mounting makes installation easier and allows for compact design, saving space in electronic devices.

Maximum Supply Voltage: 1.32 V

This allows for efficient power usage while providing enough voltage for the DSP to operate effectively.

Address Bus Width: 32

Having a wider address bus width allows for faster data processing and improved performance of the DSP.

Package Shape: SQUARE

The square shape of the package helps in efficient and compact placement within electronic devices.

Bit Size: 32

A 32-bit size allows for processing larger amounts of data at once, resulting in faster operation and better performance.

Power Supplies (V): 1.2, 3.3

Having multiple power supply options provides flexibility in designing electronic systems and ensures compatibility with different power sources.

No. of Terminals: 256

The high number of terminals allows for a greater connection capability and versatility in usage.

Package Style (Meter): GRID ARRAY

The grid array package style offers better thermal performance and reliability, making it suitable for demanding applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage helps in reducing power consumption and improving energy efficiency of the DSP.

Terminal Position: BOTTOM

Having terminals at the bottom aids in easier and more secure PCB mounting, ensuring stability during operation.

Maximum Seated Height: 2.02 mm

The low seated height allows for a thinner profile and compact design of electronic devices where the DSP is used.

RAM Words: 262144

Having a large RAM capacity enables the DSP to store and process a significant amount of data efficiently.

Width: 17 mm

The compact width of the DSP makes it suitable for use in space-constrained electronic applications.

Boundary Scan: YES

Boundary scan capability facilitates testing and debugging during the manufacturing process, ensuring high product quality and reliability.

External Data Bus Width: 32

A wide external data bus width allows for faster data transfer between the DSP and external components, improving overall system performance.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables the DSP to process data at a faster rate, enhancing speed and efficiency.

Internal Bus Architecture: MULTIPLE

Having multiple internal bus architectures enhances the DSP's ability to handle different types of data processing tasks efficiently.

Length: 17 mm

The compact length of the DSP contributes to a smaller overall footprint in electronic devices where space is limited.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Supporting various peripheral IC types enhances the DSP's compatibility and functionality in a wide range of applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the DSP energy-efficient and reliable in operation.

Terminal Form: BALL

The ball terminal form provides secure electrical connections and enables efficient heat dissipation for better thermal management.

Nominal Supply Voltage: 1.2 V

The nominal supply voltage ensures stable and reliable operation of the DSP within the specified voltage range.

Terminal Pitch: 1 mm

The small terminal pitch allows for high-density mounting of the DSP on PCBs, enabling compact and space-saving designs.

Format: FLOATING POINT

Supporting floating-point format enables the DSP to perform complex mathematical calculations with higher precision and accuracy.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6727GDHA250 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

32 BIT FLOATING POINT; ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

32

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

Length:

17 mm

Low Power Mode:

NO

No. of Terminals:

256

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

262144

Maximum Seated Height:

2.02 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

17 mm

Peripheral IC Type:

Trade Compliance

TMS320C6727GDHA250 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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