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TMS320C6711GFN150

Texas Instruments

TMS320C6711GFN150 by Texas Instruments

TMS320C6711GFN150 by Texas Instruments is a 32-bit DSP with 22-bit address bus, operating at 149.25 MHz clock frequency. Ideal for digital signal processing applications, it features low power mode, 17408 RAM words, and CMOS technology for efficient performance in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,032 parts In-Stock

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Atlantic Semiconductor

USA . 903 parts In-Stock

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Bristol Electronics

USA . 810 parts In-Stock

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Digiode

USA . 810 parts In-Stock

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810

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AZTECH Wire

Italy . 409 parts In-Stock

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$17.696

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One Stop Electronics

USA . 703 parts In-Stock

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$23.000

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Parana Technologies

USA . 76 parts In-Stock

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$27.500

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$36.626

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Corohmni

South Africa . 16 parts In-Stock

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$28.367

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DigiPath Technology Company

USA . 78 parts In-Stock

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$30.281

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$27.859

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ChromeModa Solutions

Germany . 3,493 parts In-Stock

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$30.899

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$25.337

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IDEA Electronic Components Group

UK . 1,856 parts In-Stock

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$30.899

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$29.354

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$27.809

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Corphita

USA . 4,579 parts In-Stock

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Microchip USA

USA . 334 parts In-Stock

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Perfect Parts

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Overview

Experience the power of cutting-edge technology with the TMS320C6711GFN150 by Texas Instruments. As a leader in digital signal processors, Texas Instruments guarantees top-notch quality and performance. Ideal for a wide range of applications, this DSP offers unparalleled value to customers seeking high-speed processing capabilities and efficient power management. Elevate your projects with the TMS320C6711GFN150 and unlock a new world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and protection for the internal components of the DSP, ensuring a longer lifespan.

Maximum Supply Voltage: 2 V

The maximum supply voltage of 2 V allows for efficient power management and ensures the DSP operates within safe limits.

RAM Words: 17408

With a high RAM word capacity, the DSP can efficiently handle large amounts of data and complex algorithms.

Maximum Clock Frequency: 149.25 MHz

The high maximum clock frequency enables fast processing speeds and real-time data handling for demanding applications.

Low Power Mode: YES

The low power mode feature helps in conserving energy and extending the battery life of devices equipped with the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6711GFN150 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

149.25 MHz

External Data Bus Width:

32

Format:

FLOATING POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B256

Length:

27 mm

Low Power Mode:

YES

No. of Terminals:

256

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA256,20X20,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Words:

17408

Maximum Seated Height:

2.32 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

2 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

1.9 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6711GFN150 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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