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TMS320C6674ACYP

Texas Instruments

TMS320C6674ACYP by Texas Instruments

TMS320C6674ACYP by Texas Instruments is a 32-bit DSP with integrated cache, 64-bit external data bus width, and 80 DMA channels. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Features include 32768 RAM words, 24 mm width/length, and peak reflow temperature of 245°C.

Median Price

$256.692

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 26 parts In-Stock

1+ parts

$190.385

100+ parts

$172.331

1k+ parts

$164.125

10k+ parts

-

26

$190.385

$172.331

$164.125

-

DigiKey

USA . 40 parts In-Stock

1+ parts

$323.000

100+ parts

-

1k+ parts

-

10k+ parts

-

40

$323.000

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,186 parts In-Stock

1+ parts

$180.866

100+ parts

-

1k+ parts

-

10k+ parts

-

2,186

$180.866

-

-

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Vyrian

USA . 5,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,886

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 201 parts In-Stock

1+ parts

$19.525

100+ parts

-

1k+ parts

-

10k+ parts

-

201

$19.525

-

-

-

Parana Technologies

USA . 1,708 parts In-Stock

1+ parts

$32.740

100+ parts

-

1k+ parts

$112.087

10k+ parts

-

1,708

$32.740

-

$112.087

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DigiPath Technology Company

USA . 1,055 parts In-Stock

1+ parts

$36.051

100+ parts

$33.167

1k+ parts

-

10k+ parts

-

1,055

$36.051

$33.167

-

-

ChromeModa Solutions

Germany . 5,706 parts In-Stock

1+ parts

$36.787

100+ parts

$30.165

1k+ parts

-

10k+ parts

-

5,706

$36.787

$30.165

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IDEA Electronic Components Group

UK . 619 parts In-Stock

1+ parts

$36.787

100+ parts

$34.948

1k+ parts

$33.108

10k+ parts

-

619

$36.787

$34.948

$33.108

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Corphita

USA . 3,767 parts In-Stock

1+ parts

$171.346

100+ parts

-

1k+ parts

-

10k+ parts

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3,767

$171.346

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-

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Overview

Unlock the power of digital signal processing with the TMS320C6674ACYP by Texas Instruments. This cutting-edge DSP offers unparalleled quality and performance, making it ideal for a wide range of applications. With integrated cache, low power mode, and a wide range of power supplies, this processor delivers exceptional value and benefits to customers looking for fast and efficient signal processing solutions. Trust Texas Instruments to provide top-of-the-line technology that meets your needs and exceeds your expectations. Elevate your projects with the TMS320C6674ACYP today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components of the DSP, ensuring durability and reliability.

Integrated Cache: YES

Improves processing speed by storing frequently accessed data for quick retrieval.

Maximum Supply Voltage: 1.155 V

Allows for efficient power consumption while maintaining optimal performance.

Address Bus Width: 16

Enables the DSP to efficiently handle memory addressing for complex calculations and data manipulation.

Package Shape: SQUARE

Provides a compact and space-saving design for easy integration into various electronic devices.

Bit Size: 32

Offers high processing power and precision for advanced signal processing applications.

Power Supplies (V): 1, 1.5, 1.8

Allows flexibility in power input options to cater to different system requirements.

No. of Terminals: 841

Provides multiple connection points for interfacing with other components and peripherals.

Minimum Supply Voltage: 1.045 V

Ensures stable operation even at low power input levels.

Maximum Operating Temperature: 85 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: 0 °C

Allows the DSP to function in a wide range of temperature conditions.

Terminal Finish: TIN SILVER COPPER

Provides a reliable and durable finish for the terminal connections.

Terminal Position: BOTTOM

Facilitates easy and secure mounting on PCBs for efficient circuit integration.

RAM Words: 32768

Offers a large memory capacity for storing and processing data during operation.

Width: 24 mm

Compact size allows for easy placement in various electronic devices.

Boundary Scan: YES

Facilitates testing and debugging of the DSP during production and maintenance.

External Data Bus Width: 64

Enables fast data transfer between the DSP and external devices for efficient processing.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and reflow process during manufacturing for reliable connections.

Peak Reflow Temperature °C: 245

Withstands high-temperature reflow processes without compromising performance.

Internal Bus Architecture: SINGLE

Simplifies data transfer within the DSP for faster processing and reduced complexity.

Length: 24 mm

Compact dimensions allow for versatile placement in electronic devices.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Provides a wide range of peripheral interface options for diverse application requirements.

No. of Timers: 24

Allows for precise timing control for various operations and functions.

Technology: CMOS

Offers low power consumption and high noise immunity for efficient signal processing.

Terminal Form: BALL

Facilitates reliable and secure connections during soldering and mounting processes.

Nominal Supply Voltage: 1.1 V

Optimal voltage level for efficient and stable operation of the DSP.

No. of DMA Channels: 80

Allows for efficient data transfer between memory and peripherals without CPU intervention.

ROM Programmability: MROM

Offers non-volatile memory for storing critical instructions and data.

Terminal Pitch: 0.8 mm

Provides a compact footprint for efficient PCB layout and design.

Format: FLOATING POINT

Supports high-precision mathematical calculations for advanced signal processing applications.

Moisture Sensitivity Level (MSL): 4

Ensures proper handling and storage to prevent moisture-related damage during manufacturing and operation.

Low Power Mode: YES

Offers power-saving features for extended battery life and energy-efficient operation.

On Chip Program ROM Width: 8

Provides sufficient memory capacity for storing essential program instructions.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6674ACYP attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

16

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

24

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

32768

ROM Programmability:

MROM

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.155 V

Minimum Supply Voltage:

1.045 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6674ACYP Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A991.B.4.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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