Loading...

TMS320C6670AXCYPA2

Texas Instruments

TMS320C6670AXCYPA2 by Texas Instruments

TMS320C6670AXCYPA2 by Texas Instruments is a 32-bit DSP with integrated cache, operating at temperatures from -40 to 100°C. With 841 terminals and 80 DMA channels, it's ideal for industrial applications requiring high-speed signal processing in a compact package. Its low power mode and floating-point format make it suitable for various digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,372

-

-

-

-

Digiode

USA . 919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

919

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 271 parts In-Stock

1+ parts

$15.003

100+ parts

-

1k+ parts

-

10k+ parts

-

271

$15.003

-

-

-

One Stop Electronics

USA . 923 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

-

923

$18.000

-

-

-

Parana Technologies

USA . 130 parts In-Stock

1+ parts

$68.004

100+ parts

-

1k+ parts

-

10k+ parts

-

130

$68.004

-

-

-

Corohmni

South Africa . 301 parts In-Stock

1+ parts

$74.590

100+ parts

-

1k+ parts

-

10k+ parts

-

301

$74.590

-

-

-

DigiPath Technology Company

USA . 2,354 parts In-Stock

1+ parts

$74.881

100+ parts

$68.890

1k+ parts

-

10k+ parts

-

2,354

$74.881

$68.890

-

-

ChromeModa Solutions

Germany . 1,226 parts In-Stock

1+ parts

$76.409

100+ parts

$62.655

1k+ parts

-

10k+ parts

-

1,226

$76.409

$62.655

-

-

IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$76.409

100+ parts

$72.589

1k+ parts

$68.768

10k+ parts

-

905

$76.409

$72.589

$68.768

-

Microchip USA

USA . 1,568 parts In-Stock

1+ parts

$326.020

100+ parts

$317.320

1k+ parts

$312.980

10k+ parts

$308.630

1,568

$326.020

$317.320

$312.980

$308.630

QUARKTWIN TECHNOLOGY LTD

USA . 6,877 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,877

-

-

-

-

Corphita

USA . 543 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

543

-

-

-

-

GreenTree Electronics

Israel . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5

-

-

-

-

Overview

Experience unparalleled performance and efficiency with the TMS320C6670AXCYPA2 by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality digital signal processors that are perfect for a wide range of applications. From telecommunications to industrial automation, this DSP offers unmatched value and benefits to customers. With integrated cache, low power mode, and a wide range of power supplies, this product is designed to meet the demands of any project. Trust Texas Instruments to provide you with cutting-edge technology that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it ideal for portable devices.

Integrated Cache: YES

Integrated cache helps in improving the performance of the DSP by reducing memory access time and enhancing overall processing speed.

Maximum Supply Voltage: 1.05 V

The maximum supply voltage of 1.05 V ensures efficient power consumption and low heat dissipation, making the product energy-efficient.

Bit Size: 32

The 32-bit architecture allows for efficient processing of complex digital signals, making the product suitable for advanced signal processing tasks.

No. of Terminals: 841

With a high number of terminals, the DSP can interface with multiple external devices and peripherals, providing versatile connectivity options.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C ensures the product can perform reliably even in demanding industrial environments.

RAM Words: 32768

The ample amount of RAM words allows for efficient storage and manipulation of data, enabling smooth and uninterrupted processing of signals.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, MIXED

The mixed peripheral IC type enables the DSP to handle a wide range of digital signal processing tasks, making it versatile and suitable for diverse applications.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6670AXCYPA2 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Format:

FLOATING POINT

Integrated Cache:

YES

Internal Bus Architecture:

SINGLE

JESD-30 Code:

S-PBGA-B841

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

80

No. of Terminals:

841

No. of Timers:

16

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA841,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

245

Power Supplies (V):

1,1.5,1.8

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.39 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6670AXCYPA2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1.A

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 20