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TMS320C6455BZTZA

Texas Instruments

TMS320C6455BZTZA by Texas Instruments

TMS320C6455BZTZA by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at 66.6 MHz. It features 32768 RAM words and operates b/w -40 to +90 °C. Ideal for digital signal processing applications requiring high-speed performance in a compact form factor.

Median Price

$301.810

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$301.810

100+ parts

$295.800

1k+ parts

$289.770

10k+ parts

-

2

$301.810

$295.800

$289.770

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,795 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,795

-

-

-

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Digiode

USA . 56 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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56

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 823 parts In-Stock

1+ parts

$18.000

100+ parts

-

1k+ parts

-

10k+ parts

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823

$18.000

-

-

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AZTECH Wire

Italy . 191 parts In-Stock

1+ parts

$19.805

100+ parts

-

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191

$19.805

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Corohmni

South Africa . 2,232 parts In-Stock

1+ parts

$50.708

100+ parts

-

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2,232

$50.708

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Parana Technologies

USA . 1,701 parts In-Stock

1+ parts

$66.201

100+ parts

-

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1,701

$66.201

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ChromeModa Solutions

Germany . 5,267 parts In-Stock

1+ parts

$74.383

100+ parts

$60.994

1k+ parts

-

10k+ parts

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5,267

$74.383

$60.994

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IDEA Electronic Components Group

UK . 1,310 parts In-Stock

1+ parts

$74.383

100+ parts

$70.664

1k+ parts

$66.945

10k+ parts

-

1,310

$74.383

$70.664

$66.945

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S.R.D Solutions

India . 15,000 parts In-Stock

1+ parts

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15,000

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Microchip USA

USA . 3,469 parts In-Stock

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3,469

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Corphita

USA . 2,877 parts In-Stock

1+ parts

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2,877

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DigiPath Technology Company

USA . 611 parts In-Stock

1+ parts

-

100+ parts

$67.064

1k+ parts

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10k+ parts

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611

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$67.064

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Overview

Unlock the power of cutting-edge technology with the TMS320C6455BZTZA by Texas Instruments. Crafted by a renowned manufacturer, this Digital Signal Processor (DSP) offers unmatched performance and versatility for a wide range of applications. Whether you're in need of high-speed data processing or advanced signal manipulation, this product delivers exceptional value, benefits, and advantages to customers looking to stay ahead of the curve. Experience seamless integration, reliability, and innovation with the TMS320C6455BZTZA. Elevate your projects to new heights with this state-of-the-art solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the DSP within a circuit board, saving space and improving overall design flexibility.

Maximum Supply Voltage: 1.2875 V

A higher maximum supply voltage allows for better performance and flexibility in different operating conditions.

Address Bus Width: 20

A wider address bus allows for a larger memory address range, enabling the DSP to access and process more data efficiently.

Package Shape: SQUARE

The square shape makes it easier to integrate the DSP into various electronic systems and provides a more uniform layout design.

Bit Size: 32

With a 32-bit architecture, the DSP can perform complex calculations and processing tasks with higher precision and accuracy.

Power Supplies (V): 1.2

A stable power supply of 1.2V ensures reliable and consistent operation of the DSP under different load conditions.

No. of Terminals: 697

A higher number of terminals allows for more connectivity options and integration with other components in the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array style with a fine pitch layout enables high-density mounting and efficient heat dissipation for improved performance.

Minimum Supply Voltage: 1.2125 V

A low minimum supply voltage helps in reducing power consumption and improving energy efficiency of the DSP.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the DSP can withstand tough environmental conditions and operate reliably in varying temperature ranges.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures ensures the DSP can function in cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and solderability, ensuring reliable connections and durability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easier PCB layout and assembly, making it more convenient for integration into electronic systems.

Maximum Seated Height: 3.242 mm

A low seated height profile allows for a slim and compact design, ideal for applications where space is limited.

RAM Words: 32768

With a large RAM capacity, the DSP can store and process a significant amount of data efficiently, enhancing its performance capabilities.

Width: 24 mm

The compact width dimension makes the DSP suitable for applications with space constraints, without compromising on functionality.

Boundary Scan: YES

Boundary scan capability allows for easy testing and debugging of the DSP during manufacturing and maintenance processes.

External Data Bus Width: 64

A wider external data bus width enables faster data transfer and processing speeds, enhancing overall performance.

Maximum Clock Frequency: 66.6 MHz

A high maximum clock frequency ensures efficient operation and fast execution of instructions, making the DSP suitable for real-time processing applications.

Maximum Time At Peak Reflow Temperature (s): 30

The ability to withstand peak reflow temperatures for up to 30 seconds allows for reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the DSP can endure the soldering process without any damage to its components.

Internal Bus Architecture: MULTIPLE

A multiple internal bus architecture allows for parallel processing and efficient data flow within the DSP, enhancing overall performance.

Length: 24 mm

The compact length dimension offers versatility in design and integration options, making the DSP suitable for various applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The DSP's peripheral IC type enhances its versatility and compatibility with different electronic systems and components.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making the DSP energy-efficient and ideal for portable devices.

Terminal Form: BALL

Ball terminal form provides reliable electrical connections and eases the soldering process during manufacturing, enhancing overall product reliability.

Nominal Supply Voltage: 1.25 V

The nominal supply voltage provides a stable operating voltage for the DSP, ensuring consistent performance and reliability.

Terminal Pitch: 0.8 mm

With a fine terminal pitch, the DSP facilitates high-density mounting and compact PCB layout designs for space-efficient applications.

Format: FIXED POINT

The fixed-point format simplifies arithmetic operations and accelerates signal processing tasks, improving overall efficiency.

Moisture Sensitivity Level (MSL): 4

MSL 4 indicates that the DSP has a moderate moisture sensitivity, making it suitable for standard assembly processes and environments.

Low Power Mode: YES

The low power mode feature helps in reducing power consumption during idle or low processing activities, enhancing energy efficiency.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6455BZTZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

20

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.242 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.2875 V

Minimum Supply Voltage:

1.2125 V

Nominal Supply Voltage:

1.25 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6455BZTZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

NSN

5962-01-645-0689, 5962016450689

NIIN

016450689

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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