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TMS320C6454BZTZA

Texas Instruments

TMS320C6454BZTZA by Texas Instruments

TMS320C6454BZTZA by Texas Instruments is a 32-bit DSP with 64-bit external data bus, operating at max 66.6 MHz clock frequency. Ideal for digital signal processing applications due to its fixed-point format, 32768 RAM words, and multiple internal bus architecture.

Median Price

$245.276

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 196 parts In-Stock

1+ parts

$225.540

100+ parts

$212.010

1k+ parts

$198.480

10k+ parts

-

196

$225.540

$212.010

$198.480

-

DigiKey

USA . 196 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

196

-

-

-

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Verical

USA . 195 parts In-Stock

1+ parts

-

100+ parts

$265.012

1k+ parts

$248.100

10k+ parts

-

195

-

$265.012

$248.100

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,480 parts In-Stock

1+ parts

$248.776

100+ parts

-

1k+ parts

-

10k+ parts

-

2,480

$248.776

-

-

-

DigiKey Marketplace

USA . 196 parts In-Stock

1+ parts

$272.340

100+ parts

-

1k+ parts

-

10k+ parts

-

196

$272.340

-

-

-

Vyrian

USA . 3,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,947

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 433 parts In-Stock

1+ parts

$28.436

100+ parts

$2,640.668

1k+ parts

$25.592

10k+ parts

-

433

$28.436

$2,640.668

$25.592

-

DigiPath Technology Company

USA . 2,089 parts In-Stock

1+ parts

$31.311

100+ parts

-

1k+ parts

-

10k+ parts

-

2,089

$31.311

-

-

-

ChromeModa Solutions

Germany . 2,801 parts In-Stock

1+ parts

$31.950

100+ parts

$26.199

1k+ parts

-

10k+ parts

-

2,801

$31.950

$26.199

-

-

IDEA Electronic Components Group

UK . 2,305 parts In-Stock

1+ parts

$31.950

100+ parts

$30.352

1k+ parts

$28.755

10k+ parts

-

2,305

$31.950

$30.352

$28.755

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Corohmni

South Africa . 877 parts In-Stock

1+ parts

$233.490

100+ parts

-

1k+ parts

-

10k+ parts

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877

$233.490

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-

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Corphita

USA . 3,271 parts In-Stock

1+ parts

$235.683

100+ parts

-

1k+ parts

-

10k+ parts

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3,271

$235.683

-

-

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Microchip USA

USA . 347 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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347

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Overview

Unlock the power of digital signal processing with the TMS320C6454BZTZA by Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology in the form of this DSP. Ideal for a wide range of applications, this processor offers unparalleled performance and efficiency. Get ready to experience fast processing speeds and seamless operation with this innovative product. Upgrade your system today and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers a good balance of durability and cost-effectiveness.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards.

Maximum Supply Voltage: 1.89 V

The higher maximum supply voltage provides flexibility in power input options.

Address Bus Width: 20

The 20-bit address bus width allows for efficient memory addressing and data retrieval.

Package Shape: SQUARE

The square package shape helps in easy placement and alignment during assembly.

Bit Size: 32

The 32-bit size allows for processing of larger chunks of data at once, improving efficiency.

Power Supplies (V): 1.2

The 1.2V power supply offers efficient power consumption for the DSP.

No. of Terminals: 697

The high number of terminals allows for connectivity to various external components and peripherals.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array, fine pitch package style enables high-density mounting for space-saving designs.

Minimum Supply Voltage: 1.71 V

The 1.71V minimum supply voltage ensures stable operation even at lower power inputs.

Maximum Operating Temperature: 90 °C

The high maximum operating temperature range allows for reliable performance in diverse environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures usability in varied temperature conditions.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides corrosion resistance and reliable connections.

Terminal Position: BOTTOM

The bottom terminal position facilitates easier mounting and soldering onto circuit boards.

Maximum Seated Height: 3.3 mm

The maximum seated height allows for compact and slim device designs.

RAM Words: 32768

The 32768 RAM words ensure sufficient memory for data storage and processing.

Width: 24 mm

The 24mm width offers a compact form factor for integration into various electronic devices.

Boundary Scan: YES

Having boundary scan capability enables efficient testing and debugging during production.

External Data Bus Width: 64

The 64-bit external data bus width enhances data transfer speeds and processing efficiency.

Maximum Clock Frequency: 66.6 MHz

The high maximum clock frequency allows for fast data processing and computation.

Maximum Time At Peak Reflow Temperature (s): 30

The 30-second maximum time at peak reflow temperature ensures proper soldering and component bonding.

Peak Reflow Temperature °C: 260

The 260°C peak reflow temperature enables reliable soldering for robust connections.

Internal Bus Architecture: MULTIPLE

The multiple internal bus architecture enhances data flow efficiency within the DSP.

Length: 24 mm

The 24mm length complements the compact width for a space-saving overall design.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Being a digital signal processor with additional peripheral IC capabilities makes it versatile for multiple tasks.

Technology: CMOS

The CMOS technology ensures low power consumption and high-speed operation.

Terminal Form: BALL

The ball terminal form offers reliable electrical connections and easy soldering onto PCBs.

Nominal Supply Voltage: 1.8 V

The 1.8V nominal supply voltage provides stable power input for consistent performance.

Terminal Pitch: 0.8 mm

The 0.8mm terminal pitch allows for precise mounting and alignment on circuit boards.

Format: FIXED POINT

The fixed point format is suitable for a wide range of digital signal processing applications.

Moisture Sensitivity Level (MSL): 4

The MSL 4 rating indicates good moisture resistance for reliable operation in varying environmental conditions.

Barrel Shifter: YES

The barrel shifter feature enhances computational efficiency and speed in data processing.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6454BZTZA attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Address Bus Width:

20

Barrel Shifter:

YES

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

66.6 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B697

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

697

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA697,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2

Qualification:

Not Qualified

RAM Words:

32768

Maximum Seated Height:

3.3 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TMS320C6454BZTZA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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