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TMS320C6414TGLZA8

Texas Instruments

TMS320C6414TGLZA8 by Texas Instruments

TMS320C6414TGLZA8 by Texas Instruments is a 32-bit DSP with 23-bit address bus, 64-bit external data bus, and operates at max 75 MHz. Ideal for industrial applications requiring high-speed signal processing in a compact package with low power mode capability.

Median Price

$260.512

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 44 parts In-Stock

1+ parts

$221.710

100+ parts

$208.410

1k+ parts

$195.100

10k+ parts

-

44

$221.710

$208.410

$195.100

-

DigiKey

USA . 44 parts In-Stock

1+ parts

$277.140

100+ parts

-

1k+ parts

-

10k+ parts

-

44

$277.140

-

-

-

Verical

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$260.512

1k+ parts

$243.875

10k+ parts

-

30

-

$260.512

$243.875

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,166 parts In-Stock

1+ parts

$244.558

100+ parts

-

1k+ parts

-

10k+ parts

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1,166

$244.558

-

-

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Vyrian

USA . 3,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,975

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,120 parts In-Stock

1+ parts

$53.305

100+ parts

-

1k+ parts

-

10k+ parts

-

1,120

$53.305

-

-

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DigiPath Technology Company

USA . 1,308 parts In-Stock

1+ parts

$58.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,308

$58.695

-

-

-

ChromeModa Solutions

Germany . 1,946 parts In-Stock

1+ parts

$59.893

100+ parts

$49.112

1k+ parts

-

10k+ parts

-

1,946

$59.893

$49.112

-

-

IDEA Electronic Components Group

UK . 1,122 parts In-Stock

1+ parts

$59.893

100+ parts

$56.898

1k+ parts

$53.904

10k+ parts

-

1,122

$59.893

$56.898

$53.904

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Corohmni

South Africa . 1,885 parts In-Stock

1+ parts

$62.139

100+ parts

-

1k+ parts

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1,885

$62.139

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Ampacity Inc.

Singapore . 37 parts In-Stock

1+ parts

$218.820

100+ parts

-

1k+ parts

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37

$218.820

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-

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Corphita

USA . 1,956 parts In-Stock

1+ parts

$231.687

100+ parts

-

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10k+ parts

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1,956

$231.687

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Microchip USA

USA . 1,748 parts In-Stock

1+ parts

$252.050

100+ parts

$245.330

1k+ parts

$241.970

10k+ parts

$238.610

1,748

$252.050

$245.330

$241.970

$238.610

Kepictronics

USA . 163 parts In-Stock

1+ parts

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163

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Overview

Unleash the power of cutting-edge technology with the TMS320C6414TGLZA8 by Texas Instruments, a top-tier manufacturer known for delivering high-quality digital signal processors. Designed for a wide range of applications, this DSP offers unparalleled performance and reliability. With a focus on value and innovation, customers can expect seamless integration, superior processing capabilities, and enhanced efficiency. Elevate your projects to new heights with the TMS320C6414TGLZA8 and experience the advantages of advanced technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the DSP, making it suitable for various environments.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and costs in production.

Maximum Supply Voltage: 1.24 V

The low maximum supply voltage helps in reducing power consumption and extending the lifespan of the DSP.

Address Bus Width: 23

The wide address bus width allows for efficient communication and processing of data within the DSP.

Package Shape: SQUARE

The square package shape provides a compact design, making it easier to integrate the DSP into various electronic devices.

Bit Size: 32

The 32-bit architecture enables high-speed processing and calculation capabilities for complex digital signal processing tasks.

Power Supplies (V): 1.2,3.3

Multiple power supply options provide flexibility in power management and compatibility with different voltage requirements.

No. of Terminals: 532

The high number of terminals allows for seamless connectivity and data transfer between the DSP and other components in the system.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style enables a high density of terminals in a small footprint, optimizing PCB layout and space utilization.

Minimum Supply Voltage: 1.16 V

The low minimum supply voltage ensures stable operation and efficient power usage for the DSP.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range makes the DSP suitable for industrial applications that require reliable performance in harsh environments.

Minimum Operating Temperature: -40 °C

The wide temperature range enables the DSP to operate in extreme cold conditions, providing versatility in deployment.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and installation onto the PCB, ensuring a secure connection.

Maximum Seated Height: 3.25 mm

The low maximum seated height allows for a slim profile and space-saving design in electronic devices.

RAM Words: 16384

The ample RAM capacity enables efficient storage and retrieval of data for complex signal processing algorithms.

Width: 23 mm

The compact width dimension enables integration into various system architectures without occupying excessive space.

Boundary Scan: YES

Boundary scan capability enhances testing and diagnosis of the DSP during production and maintenance, ensuring high reliability.

External Data Bus Width: 64

The wide external data bus width allows for fast data transfer between the DSP and external memory or peripherals, improving efficiency.

Maximum Clock Frequency: 75 MHz

The high clock frequency enables rapid processing and execution of signal processing algorithms, enhancing overall system performance.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architectures enhance data flow and processing efficiency within the DSP, enabling parallel processing of multiple tasks.

Length: 23 mm

The compact length dimension provides a balanced form factor for easy integration and installation in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions, making the DSP suitable for industrial applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

The inclusion of various peripheral IC types expands the functionality and connectivity options of the DSP, enhancing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making the DSP energy-efficient and suitable for demanding applications.

Terminal Form: BALL

Ball terminal form simplifies the soldering process and improves the reliability of the electrical connections in the system.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable operation of the DSP under varying load conditions.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for high-density packaging, enabling more terminals in a given area and optimizing PCB layout.

Format: FIXED POINT

Fixed-point format enhances computational efficiency and accuracy in digital signal processing applications, ensuring precise results.

Low Power Mode: YES

The low power mode feature reduces power consumption during idle or low processing tasks, extending the battery life and overall efficiency of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6414TGLZA8 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

23

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

75 MHz

External Data Bus Width:

64

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B532

Length:

23 mm

Low Power Mode:

YES

No. of Terminals:

532

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA532,26X26,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Words:

16384

Maximum Seated Height:

3.25 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.24 V

Minimum Supply Voltage:

1.16 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

23 mm

Peripheral IC Type:

Trade Compliance

TMS320C6414TGLZA8 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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