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TMS320C6202BZNZ300

Texas Instruments

TMS320C6202BZNZ300 by Texas Instruments

TMS320C6202BZNZ300 by Texas Instruments is a 32-bit DSP with 131072 RAM words, 300 MHz clock frequency, and 1.5V nominal voltage. Ideal for digital signal processing applications requiring high-speed data processing and low power consumption. Features integrated cache, boundary scan support, and multiple internal bus architecture for efficient performance.

Median Price

$117.652

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$104.580

1k+ parts

$93.570

10k+ parts

$88.060

40

-

$104.580

$93.570

$88.060

DigiKey

USA . 40 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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40

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-

-

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Verical

USA . 40 parts In-Stock

1+ parts

-

100+ parts

$130.725

1k+ parts

$116.963

10k+ parts

$110.075

40

-

$130.725

$116.963

$110.075

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,913 parts In-Stock

1+ parts

$110.390

100+ parts

-

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1,913

$110.390

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-

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Vyrian

USA . 3,148 parts In-Stock

1+ parts

-

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3,148

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ACDS - Activité Composants Distribution Service

France . 181 parts In-Stock

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181

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Odintec Ltd.

Israel . 31 parts In-Stock

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31

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,917 parts In-Stock

1+ parts

$13.572

100+ parts

-

1k+ parts

$14.078

10k+ parts

-

1,917

$13.572

-

$14.078

-

DigiPath Technology Company

USA . 2,276 parts In-Stock

1+ parts

$14.945

100+ parts

-

1k+ parts

-

10k+ parts

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2,276

$14.945

-

-

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ChromeModa Solutions

Germany . 5,642 parts In-Stock

1+ parts

$15.250

100+ parts

$12.505

1k+ parts

-

10k+ parts

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5,642

$15.250

$12.505

-

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IDEA Electronic Components Group

UK . 1,186 parts In-Stock

1+ parts

$15.250

100+ parts

$14.488

1k+ parts

$13.725

10k+ parts

-

1,186

$15.250

$14.488

$13.725

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Corohmni

South Africa . 337 parts In-Stock

1+ parts

$19.161

100+ parts

-

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337

$19.161

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Corphita

USA . 1,996 parts In-Stock

1+ parts

$104.580

100+ parts

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10k+ parts

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1,996

$104.580

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Microchip USA

USA . 2,055 parts In-Stock

1+ parts

$118.300

100+ parts

$115.150

1k+ parts

$113.570

10k+ parts

$111.990

2,055

$118.300

$115.150

$113.570

$111.990

Authorized Procurement Solutions

USA . 181 parts In-Stock

1+ parts

-

100+ parts

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181

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Overview

Unlock the power of digital signal processing with the TMS320C6202BZNZ300 by Texas Instruments. Known for their top-quality products, Texas Instruments offers a range of applications for this DSP, from audio processing to telecommunications. With integrated cache and low power mode, this product provides exceptional value and benefits to customers seeking high-performance solutions. Experience seamless operation and reliable performance with the TMS320C6202BZNZ300, designed to meet your DSP needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the DSP, making it suitable for various applications.

Integrated Cache: YES

Integrated cache helps in improving the overall performance of the DSP by reducing data access times and increasing processing speed.

Maximum Supply Voltage: 1.57 V

Having a maximum supply voltage of 1.57 V ensures efficient power usage and prevents the risk of overloading the DSP.

On Chip Data RAM Width: 8

The 8-bit width of on-chip data RAM allows for efficient data storage and retrieval within the DSP.

Address Bus Width: 22

A wider address bus width of 22 bits enables the DSP to access a larger memory space, enhancing its processing capabilities.

Bit Size: 32

Having a 32-bit architecture enables the DSP to handle complex calculations and data processing tasks effectively.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature of 90°C, this DSP can be used in demanding environmental conditions without compromising performance.

Maximum Clock Frequency: 300 MHz

The high maximum clock frequency of 300 MHz allows for quick data processing and efficient operation of the DSP.

Technical Specifications

Digital Signal Processors (DSPs) TMS320C6202BZNZ300 attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

22

Barrel Shifter:

NO

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

300 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B352

JESD-609 Code:

e1

Length:

27 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of DMA Channels:

4

No. of External Interrupts:

4

No. of Terminals:

352

No. of Timers:

2

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA352,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

RAM Words:

131072

ROM Programmability:

MROM

Maximum Seated Height:

2.8 mm

Sub-Category:

Digital Signal Processors

Maximum Supply Voltage:

1.57 V

Minimum Supply Voltage:

1.43 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

TMS320C6202BZNZ300 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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