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TMDS351PAGRG4

Texas Instruments

TMDS351PAGRG4 by Texas Instruments

TMDS351PAGRG4 by Texas Instruments is a 3-channel audio/video switch with 40 ohm max on-state resistance. Operating at 0-70°C, it has a supply voltage range of 3-3.6V and 0.9ns switch-on/off time. Ideal for multimedia applications requiring high-speed switching in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 3,178 parts In-Stock

1+ parts

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3,178

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Vyrian

USA . 2,781 parts In-Stock

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-

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2,781

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Digiode

USA . 1,411 parts In-Stock

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1,411

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,455 parts In-Stock

1+ parts

$3.500

100+ parts

-

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1,455

$3.500

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AZTECH Wire

Italy . 363 parts In-Stock

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$12.407

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363

$12.407

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Parana Technologies

USA . 1,562 parts In-Stock

1+ parts

$15.873

100+ parts

-

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$16.230

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1,562

$15.873

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$16.230

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DigiPath Technology Company

USA . 129 parts In-Stock

1+ parts

$17.478

100+ parts

$16.080

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129

$17.478

$16.080

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ChromeModa Solutions

Germany . 5,269 parts In-Stock

1+ parts

$17.835

100+ parts

$14.625

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5,269

$17.835

$14.625

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IDEA Electronic Components Group

UK . 2,362 parts In-Stock

1+ parts

$17.835

100+ parts

$16.943

1k+ parts

$16.052

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2,362

$17.835

$16.943

$16.052

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Lixinc

USA . 12,622 parts In-Stock

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12,622

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A-Z Elektronik GmbH

Germany . 4,838 parts In-Stock

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4,838

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Corphita

USA . 213 parts In-Stock

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213

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Kepictronics

USA . 155 parts In-Stock

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155

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Overview

Elevate your audio/video switching experience with the TMDS351PAGRG4 by Texas Instruments. Crafted with precision and quality in mind, this multiplexer offers seamless performance and reliability. Ideal for a wide range of applications, this versatile device is designed to enhance functionality while providing unmatched value to customers. Say goodbye to compromise and hello to top-notch performance with the TMDS351PAGRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides a lightweight and durable package for the multiplexer or switch, making it easy to handle and resistant to wear and tear.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3 V supply voltage is commonly used in many electronic devices, ensuring compatibility with a wide range of applications.

No. of Channels: 3

With 3 channels, this multiplexer or switch allows for versatile switching between different audio/video sources or signals, providing flexibility in use.

Maximum On-state Resistance (Ron): 40 ohm

The low on-state resistance of 40 ohms ensures minimal signal loss or distortion when the switch is in the 'on' state, maintaining high signal quality.

Surface Mount: YES

Being surface mountable, this multiplexer or switch can be easily integrated onto circuit boards, saving space and simplifying assembly.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can reliably operate in a wide range of environments without overheating.

Technical Specifications

Multiplexers & Switches TMDS351PAGRG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

64

Maximum On-state Resistance (Ron):

40 ohm

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

.9 ns

Maximum Switch-on Time:

.9 ns

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

10 mm

Trade Compliance

TMDS351PAGRG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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