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TMDS141RHARG4

Texas Instruments

TMDS141RHARG4 by Texas Instruments

TMDS141RHARG4 by Texas Instruments is a 40-terminal audio/video switch with separate outputs. Operating at 3.3V, it has a max supply current of 130mA and can handle temperatures from 0 to 70°C. This chip carrier with a very thin profile is ideal for commercial applications requiring multiplexers & switches.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,666 parts In-Stock

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Digiode

USA . 3,459 parts In-Stock

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Classic Components Corporation

USA . 323 parts In-Stock

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Nova Conductors

Japan . 66 parts In-Stock

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One Stop Electronics

USA . 813 parts In-Stock

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$4.500

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813

$4.500

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Ampacity Inc.

Singapore . 285 parts In-Stock

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$6.500

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AZTECH Wire

Italy . 568 parts In-Stock

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$10.031

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$10.031

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Parana Technologies

USA . 1,862 parts In-Stock

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$11.890

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$1,104.121

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$10.701

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$1,104.121

$10.701

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DigiPath Technology Company

USA . 2,250 parts In-Stock

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$13.092

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ChromeModa Solutions

Germany . 2,346 parts In-Stock

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$13.359

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$10.954

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$13.359

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IDEA Electronic Components Group

UK . 335 parts In-Stock

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$13.359

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$12.691

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$12.023

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335

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,185 parts In-Stock

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Microchip USA

USA . 1,321 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Corphita

USA . 644 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 272 parts In-Stock

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Overview

Upgrade your audio/video systems with the TMDS141RHARG4 by Texas Instruments, a top-quality multiplexer and switch designed to deliver seamless performance. With Texas Instruments' reputation for excellence in manufacturing, this product ensures reliability and durability. Ideal for a wide range of applications, this chip carrier with very thin profile offers separate outputs, quad terminals, and a nominal supply voltage of 3.3V. Take advantage of the benefits of this versatile device, such as its efficient design, high performance, and ease of installation. Elevate your projects with the TMDS141RHARG4 and experience unparalleled value and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V supply voltage ensures compatibility with a wide range of systems and circuits.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various input and output channels.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, the product can perform reliably under challenging conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at temperatures as low as 0°C makes the product suitable for use in different environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold for terminal finishing ensures good conductivity and corrosion resistance.

Output (V): SEPARATE OUTPUT

Having separate outputs for each channel allows for individual signal routing and control.

Width (mm): 6 mm

The compact width of 6mm saves space on the circuit board and makes the product suitable for applications with limited space.

Minimum Supply Voltage (Vsup): 3 V

The 3V minimum supply voltage ensures proper functionality and performance of the product.

No. of Channels: 4

Having 4 channels allows for switching and routing of signals from multiple sources, increasing the product's versatility.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch facilitates precise and compact connections on the circuit board.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product can withstand moderate exposure to moisture during handling and storage.

Technical Specifications

Multiplexers & Switches TMDS141RHARG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Current (Isup):

130 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

6 mm

Trade Compliance

TMDS141RHARG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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