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TMDS341PFCG4

Texas Instruments

TMDS341PFCG4 by Texas Instruments

TMDS341PFCG4 by Texas Instruments is an 80-terminal audio/video switch with a max on-state resistance of 50 ohm. Operating at a temperature range of 0-70°C, it has a supply voltage of 3-3.6V and offers fast switching times of 800 ns. Ideal for commercial applications requiring high-speed signal multiplexing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,218 parts In-Stock

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Vyrian

USA . 3,980 parts In-Stock

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3,980

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Contempo Components LLC

USA . 136 parts In-Stock

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136

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Parana Technologies

USA . 456 parts In-Stock

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$1.614

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$2.240

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456

$1.614

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$2.240

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DigiPath Technology Company

USA . 389 parts In-Stock

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$1.778

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389

$1.778

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ChromeModa Solutions

Germany . 1,392 parts In-Stock

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$1.814

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$1.487

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1,392

$1.814

$1.487

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IDEA Electronic Components Group

UK . 851 parts In-Stock

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$1.814

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$1.633

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851

$1.814

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$1.633

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One Stop Electronics

USA . 1,287 parts In-Stock

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$4.500

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$4.500

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AZTECH Wire

Italy . 312 parts In-Stock

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$14.380

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$14.380

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Lixinc

USA . 9,532 parts In-Stock

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Corphita

USA . 3,678 parts In-Stock

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3,678

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Overview

Unlock endless possibilities with the TMDS341PFCG4 by Texas Instruments, a top-quality Audio/Video switch that guarantees seamless performance and reliability. Designed with precision and expertise, this product is perfect for a wide range of applications where fast switching and high-performance are essential. With its innovative technology and cutting-edge design, customers can enjoy unparalleled value and benefits, making it a standout choice in the world of Multiplexers & Switches. Trust Texas Instruments to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the multiplexer, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation onto a circuit board, saving time and effort during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Compatible with standard voltage levels found in many electronic systems, making integration straightforward.

No. of Terminals: 80

Provides ample connections for various input and output signals, allowing for versatile routing options.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, ensuring reliable performance even in demanding environments.

Minimum Supply Voltage (Vsup): 3 V

Operates efficiently at lower supply voltages, potentially reducing power consumption and heat generation.

Maximum On-state Resistance (Ron): 50 ohm

Low resistance leads to minimal signal loss and distortion, maintaining the quality of the transmitted data.

No. of Channels: 3

Offers multiple channels for simultaneous signal processing, increasing flexibility and functionality for the user.

Technical Specifications

Multiplexers & Switches TMDS341PFCG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Additional Features:

3-CHANNEL MUX/DEMUX

Other IC type:

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e4

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

3

No. of Functions:

1

No. of Terminals:

80

Maximum On-state Resistance (Ron):

50 ohm

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Maximum Switch-off Time:

800 ns

Maximum Switch-on Time:

800 ns

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

12 mm

Trade Compliance

TMDS341PFCG4 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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