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TM4C129XKCZADT3

Texas Instruments

TM4C129XKCZADT3 by Texas Instruments

TM4C129XKCZADT3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 24-Ch 12-Bit ADC, 32 DMA channels, and peripherals like BOD, CRC, LCD. Ideal for industrial applications due to its wide temperature range (-40 to 105 °C) and connectivity options including CAN, Ethernet, USB.

Median Price

$15.489

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,594 parts In-Stock

1+ parts

$15.489

100+ parts

$13.530

1k+ parts

$9.331

10k+ parts

-

3,594

$15.489

$13.530

$9.331

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,916 parts In-Stock

1+ parts

$14.715

100+ parts

-

1k+ parts

-

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4,916

$14.715

-

-

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Vyrian

USA . 6,305 parts In-Stock

1+ parts

-

100+ parts

-

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-

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6,305

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,204 parts In-Stock

1+ parts

$11.210

100+ parts

-

1k+ parts

-

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1,204

$11.210

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Corphita

USA . 2,168 parts In-Stock

1+ parts

$13.940

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-

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2,168

$13.940

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Parana Technologies

USA . 868 parts In-Stock

1+ parts

$23.613

100+ parts

-

1k+ parts

$24.249

10k+ parts

-

868

$23.613

-

$24.249

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DigiPath Technology Company

USA . 1,169 parts In-Stock

1+ parts

$26.001

100+ parts

$23.921

1k+ parts

-

10k+ parts

-

1,169

$26.001

$23.921

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ChromeModa Solutions

Germany . 3,010 parts In-Stock

1+ parts

$26.532

100+ parts

$21.756

1k+ parts

-

10k+ parts

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3,010

$26.532

$21.756

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IDEA Electronic Components Group

UK . 109 parts In-Stock

1+ parts

$26.532

100+ parts

$25.205

1k+ parts

$23.879

10k+ parts

-

109

$26.532

$25.205

$23.879

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Microchip USA

USA . 1,610 parts In-Stock

1+ parts

$43.010

100+ parts

$42.400

1k+ parts

$42.090

10k+ parts

$41.780

1,610

$43.010

$42.400

$42.090

$41.780

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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8,000

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Perfect Parts

USA . 412 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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412

-

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A-Z Elektronik GmbH

Germany . 276 parts In-Stock

1+ parts

-

100+ parts

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276

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Overview

Unleash the power of innovation with the TM4C129XKCZADT3 by Texas Instruments, a cutting-edge microcontroller designed to elevate your projects to new heights. As a trusted manufacturer, Texas Instruments delivers top-quality products that push boundaries in performance and reliability. Ideal for a wide range of applications, this microcontroller offers unparalleled value with its advanced features and capabilities. Experience seamless connectivity, efficient data processing, and low power consumption, all in a compact and cost-effective package. Take your designs to the next level with the TM4C129XKCZADT3 and unleash your creativity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, ensuring a longer lifespan and reliability.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on circuit boards, making it ideal for compact designs.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power input, accommodating various power sources.

On Chip Data RAM Width: 8

The wide data RAM width enhances data processing speed and efficiency, improving overall performance.

Address Bus Width: 28

The wide address bus width enables the microcontroller to access a large memory space, allowing for complex applications.

Package Shape: SQUARE

The square package shape simplifies PCB design and layout, optimizing space utilization and ease of integration.

Bit Size: 32

The 32-bit architecture supports advanced calculations and processing capabilities, making it suitable for demanding applications.

No. of Terminals: 212

The high number of terminals increases connectivity options and peripheral support for versatile usage.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers high pin density, compactness, and reliability, making it suitable for space-constrained applications.

Minimum Supply Voltage: 1.14 V

The low minimum supply voltage allows for energy-efficient operation and compatibility with low-power systems.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance in harsh environmental conditions and industrial settings.

CPU Family: CORTEX-M4F

The Cortex-M4F architecture provides a high-performance and energy-efficient computing platform for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for reliable operation in extreme cold environments without performance degradation.

Terminal Finish: TIN SILVER COPPER

The terminal finish offers excellent conductivity, corrosion resistance, and solderability, ensuring reliable connections and durability.

ADC Channels: YES

The analog-to-digital converter channels enable the microcontroller to interface with analog sensors and signals, expanding its sensing capabilities.

DMA Channels: YES

The Direct Memory Access channels enhance data transfer speed and efficiency, freeing up the CPU for other tasks and improving overall performance.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and routing, optimizing signal integrity and reducing interference.

ROM Words: 524288

The large ROM capacity allows for storing a significant amount of program code and data, supporting complex software applications.

Maximum Seated Height: 1 mm

The low seated height enables slim and compact designs, reducing the overall size of the electronic device and enhancing portability.

RAM Words: 256

The RAM capacity provides temporary storage for data and variables during program execution, improving processing speed and efficiency.

Width: 10 mm

The compact width size supports smaller form factor designs and space-constrained applications, enabling versatile integration.

Data EEPROM Size: 6K

The sizable EEPROM storage allows for non-volatile data retention, configuration settings, and parameter storage, enhancing system reliability.

Boundary Scan: YES

Boundary scan capability facilitates debugging, testing, and fault isolation during manufacturing and development, improving overall product quality.

External Data Bus Width: 32

The wide external data bus width enhances data transfer speed between the microcontroller and external memory devices, improving performance.

Peripherals: BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

The diverse set of peripherals offers expanded functionality and connectivity options for various applications, increasing versatility and performance capabilities.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency supports rapid data processing and execution, enabling quick response times and efficient operation.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and assembly of the microcontroller, reducing manufacturing defects.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable solder joints and thermal stability during manufacturing and assembly processes.

Length: 10 mm

The compact length size supports space-saving designs and flexible integration options, making it suitable for compact electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments with temperature fluctuations and challenging conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

The RISC architecture of the microcontroller provides high performance, low power consumption, and efficient instruction execution, enhancing overall system efficiency.

No. of Timers: 8

The multiple timer channels allow for precise timing control, event capture, and frequency generation, enabling versatile timing applications.

RAM Bytes: 262144

The large RAM size accommodates extensive data storage and manipulation, supporting complex algorithms and data processing tasks.

Technology: CMOS

The CMOS technology offers low power consumption, high noise immunity, and reliable performance, making it ideal for battery-powered and energy-efficient devices.

Terminal Form: BALL

The ball terminal form simplifies soldering and assembly processes, ensuring secure connections and reliable performance in varied environmental conditions.

Analog To Digital Convertors: 24-Ch 12-Bit

The high-channel count and bit resolution of the ADCs enable precise analog signal conversion, supporting accurate sensor interfacing and data acquisition.

Nominal Supply Voltage: 1.2 V

The stable nominal supply voltage ensures consistent and reliable operation of the microcontroller, maintaining performance under varying load conditions.

No. of DMA Channels: 32

The multiple DMA channels support efficient data transfer and processing, reducing CPU overhead and enhancing overall system performance.

No. of Serial I/Os: 3

The serial I/O interfaces provide communication options for connecting to external devices, expanding connectivity and interoperability capabilities.

PWM Channels: YES

The Pulse Width Modulation channels enable precise control of analog signals, supporting motor control, power management, and LED dimming applications.

Connectivity: 1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The diverse connectivity options cater to a wide range of communication protocols and networking needs, enabling seamless integration in various systems.

ROM Programmability: FLASH

The flash programmable ROM allows for flexible firmware updates, code modifications, and system upgrades, ensuring adaptability and longevity.

Terminal Pitch: 0.5 mm

The narrow terminal pitch supports high-density interconnects, reducing PCB footprint and enabling compact and miniaturized electronic designs.

Format: FLOATING POINT

The floating-point format supports precise mathematical calculations, complex algorithms, and scientific computations, enhancing computational accuracy and efficiency.

Moisture Sensitivity Level (MSL): 3

The MSL rating indicates the moisture sensitivity of the microcontroller during reflow soldering, ensuring proper handling and storage for manufacturing processes.

Technical Specifications

Microcontrollers TM4C129XKCZADT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

3

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129XKCZADT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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