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TM4C129XKCZADI3

Texas Instruments

TM4C129XKCZADI3 by Texas Instruments

TM4C129XKCZADI3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 24-Ch 12-Bit ADC channels and 32 DMA channels. It features a max clock frequency of 25 MHz and supports various peripherals like UART(8) and USB, making it ideal for industrial applications requiring high-speed data processing. With a package style of GRID ARRAY, this microcontroller has a low power mode and operates in an industrial temperature range from -40 to 85 °C.

Median Price

$17.641

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,028 parts In-Stock

1+ parts

$17.641

100+ parts

$15.409

1k+ parts

$10.627

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4,028

$17.641

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$10.627

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Distributors (In-Stock)

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Digiode

USA . 351 parts In-Stock

1+ parts

$16.759

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351

$16.759

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Vyrian

USA . 8,502 parts In-Stock

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8,502

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Rotakorn

Sweden . 920 parts In-Stock

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920

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Distributors (Availability)

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AZTECH Wire

Italy . 939 parts In-Stock

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$11.310

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939

$11.310

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Corphita

USA . 3,543 parts In-Stock

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$15.877

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3,543

$15.877

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Microchip USA

USA . 1,674 parts In-Stock

1+ parts

$47.660

100+ parts

$46.830

1k+ parts

$46.410

10k+ parts

$46.000

1,674

$47.660

$46.830

$46.410

$46.000

Parana Technologies

USA . 1,078 parts In-Stock

1+ parts

$58.870

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1,078

$58.870

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DigiPath Technology Company

USA . 1,658 parts In-Stock

1+ parts

$64.823

100+ parts

$59.637

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1,658

$64.823

$59.637

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ChromeModa Solutions

Germany . 894 parts In-Stock

1+ parts

$66.146

100+ parts

$54.240

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894

$66.146

$54.240

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IDEA Electronic Components Group

UK . 733 parts In-Stock

1+ parts

$66.146

100+ parts

$62.839

1k+ parts

$59.531

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733

$66.146

$62.839

$59.531

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Lixinc

USA . 8,538 parts In-Stock

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8,538

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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iodParts Technologies Inc.

India . 485 parts In-Stock

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485

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Overview

Experience unparalleled performance and reliability with the TM4C129XKCZADI3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge microcontrollers that are perfect for a wide range of applications. From industrial automation to consumer electronics, this microcontroller offers unmatched value, benefits, and advantages to customers. With advanced features like 24-channel ADC, 32 DMA channels, and 8 PWM channels, the TM4C129XKCZADI3 ensures seamless connectivity and optimal functionality. Trust Texas Instruments for high-quality products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the internal components of the microcontroller and is commonly used in electronic devices.

Maximum Supply Voltage: 1.32 V

The high maximum supply voltage allows for flexibility in power supply options.

ROM Words: 524288

The large ROM capacity allows for storing a significant amount of program code and data.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals into digital data for processing.

Maximum Clock Frequency: 25 MHz

The high clock frequency enables fast processing and response times for the microcontroller.

Connectivity: 1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The multiple connectivity options make this microcontroller suitable for a wide range of applications and communication protocols.

Low Power Mode: YES

The low power mode helps in reducing power consumption when the microcontroller is not in active use.

Technical Specifications

Microcontrollers TM4C129XKCZADI3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

3

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

1-WIRE, CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129XKCZADI3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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