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TM4C129ENCZADI3R

Texas Instruments

TM4C129ENCZADI3R by Texas Instruments

TM4C129ENCZADI3R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 24-Ch 12-Bit ADC channels and 8 PWM channels. It features 256 words of RAM, CAN(2), ETHERNET(2), I2C(10), SPI connectivity, and operates at a max clock frequency of 25 MHz. Ideal for industrial applications requiring low power mode and high-speed processing capabilities.

Median Price

$14.382

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,928 parts In-Stock

1+ parts

$14.382

100+ parts

$12.563

1k+ parts

$8.664

10k+ parts

-

5,928

$14.382

$12.563

$8.664

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Distributors (In-Stock)

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Digiode

USA . 3,996 parts In-Stock

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$13.663

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3,996

$13.663

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Vyrian

USA . 5,504 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 5,831 parts In-Stock

1+ parts

$12.220

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5,831

$12.220

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Semicontronic

India . 5,428 parts In-Stock

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$12.220

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$11.914

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$11.853

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5,428

$12.220

$11.914

$11.853

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Corphita

USA . 344 parts In-Stock

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$12.944

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344

$12.944

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AZTECH Wire

Italy . 596 parts In-Stock

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$14.090

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596

$14.090

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Advanced Electronics

New Zealand . 72 parts In-Stock

1+ parts

$18.592

100+ parts

$17.662

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$17.662

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72

$18.592

$17.662

$17.662

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Microchip USA

USA . 2,179 parts In-Stock

1+ parts

$32.590

100+ parts

$32.120

1k+ parts

$31.890

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$31.660

2,179

$32.590

$32.120

$31.890

$31.660

Parana Technologies

USA . 870 parts In-Stock

1+ parts

$57.405

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870

$57.405

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DigiPath Technology Company

USA . 1,853 parts In-Stock

1+ parts

$63.210

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$58.153

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1,853

$63.210

$58.153

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ChromeModa Solutions

Germany . 1,725 parts In-Stock

1+ parts

$64.500

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$52.890

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1,725

$64.500

$52.890

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IDEA Electronic Components Group

UK . 234 parts In-Stock

1+ parts

$64.500

100+ parts

$61.275

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$58.050

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234

$64.500

$61.275

$58.050

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Corohmni

South Africa . 198 parts In-Stock

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$68.221

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Component Stockers USA

USA . 431 parts In-Stock

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$211.850

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QUARKTWIN TECHNOLOGY LTD

USA . 27,499 parts In-Stock

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Perfect Parts

USA . 22,400 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,307 parts In-Stock

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Argo Parts USA

USA . 3,971 parts In-Stock

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Continental Prestige Electronics

USA . 2,853 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unleash the power of innovation with the TM4C129ENCZADI3R microcontroller by Texas Instruments. Designed with precision and expertise, this device offers unmatched quality and reliability. Ideal for a wide range of applications, this microcontroller provides advanced features and capabilities that cater to various needs. From its integrated cache to its plethora of peripherals, this product guarantees exceptional performance and efficiency. Experience seamless connectivity and enhanced functionality with the TM4C129ENCZADI3R, setting new standards in the world of microcontrollers. Elevate your projects and unlock endless possibilities with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and light weight, making it suitable for a wide range of applications.

Integrated Cache: YES

The integrated cache enhances performance by reducing access times to frequently used data, improving overall efficiency.

Surface Mount: YES

The surface mount design allows for easy and space-efficient integration onto circuit boards, simplifying the manufacturing process.

Maximum Supply Voltage: 1.32 V

This high supply voltage capability provides flexibility in power supply options and ensures stable operation under varying voltage conditions.

On Chip Data RAM Width: 8

The wide data RAM width allows for efficient data processing and storage, enhancing the microcontroller's performance capabilities.

Address Bus Width: 28

The wide address bus width enables access to a large memory space, making it suitable for applications requiring extensive data retrieval.

Package Shape: SQUARE

The square package shape allows for uniform and compact placement within circuit designs, optimizing space utilization.

Bit Size: 32

The 32-bit architecture allows for high-speed processing, making it ideal for applications that require complex computations.

No. of Terminals: 212

The numerous terminals provide versatile connectivity options, enabling the microcontroller to interface with a variety of external components.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style offers a high-density interconnect layout, reducing signal propagation delays and improving overall performance.

Minimum Supply Voltage: 1.14 V

The ability to operate at low supply voltages enhances energy efficiency and extends battery life, making it suitable for portable devices.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliable performance in harsh environmental conditions, increasing the microcontroller's versatility.

CPU Family: CORTEX-M4F

The Cortex-M4F CPU family offers advanced processing capabilities, suitable for applications that require complex computations and real-time processing.

Minimum Operating Temperature: -40 °C

The low operating temperature range allows for reliable performance in extreme cold environments, making it suitable for outdoor applications.

Terminal Finish: TIN SILVER COPPER

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability in various operating conditions.

ADC Channels: YES

The integrated ADC channels enable analog-to-digital conversion, making it suitable for applications that require accurate sensor data processing.

DMA Channels: YES

The DMA channels enhance data transfer speeds and reduce CPU load, improving overall system efficiency in data-intensive applications.

Terminal Position: BOTTOM

The terminal position at the bottom simplifies PCB layout and provides easier access to the microcontroller's terminals during assembly and maintenance.

ROM Words: 1048576

The large ROM word capacity allows for extensive program storage, accommodating complex firmware requirements in various applications.

Maximum Seated Height: 1 mm

The low profile design with a maximum seated height of 1 mm allows for compact integration in space-constrained designs.

RAM Words: 256

The ample RAM word capacity facilitates efficient data storage and manipulation, enhancing the microcontroller's multitasking capabilities.

Width: 10 mm

The compact 10 mm width enables space-efficient integration in small form factor designs, making it suitable for compact electronic devices.

Technical Specifications

Microcontrollers TM4C129ENCZADI3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

5

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

133.4 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129ENCZADI3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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