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TM4C129EKCPDTT3

Texas Instruments

TM4C129EKCPDTT3 by Texas Instruments

TM4C129EKCPDTT3 by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, offering 20-Ch 12-Bit ADC channels and 32 DMA channels. Ideal for industrial applications, it features CAN(2), ETHERNET(2), I2C(10), SPI, UART(8), USB connectivity options. Operating temperature ranges from -40 to 105 °C.

Median Price

$12.277

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,034 parts In-Stock

1+ parts

$12.277

100+ parts

$10.724

1k+ parts

$7.396

10k+ parts

-

4,034

$12.277

$10.724

$7.396

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,250 parts In-Stock

1+ parts

$11.663

100+ parts

-

1k+ parts

-

10k+ parts

-

4,250

$11.663

-

-

-

Vyrian

USA . 4,291 parts In-Stock

1+ parts

-

100+ parts

-

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-

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-

4,291

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,081 parts In-Stock

1+ parts

$11.049

100+ parts

-

1k+ parts

-

10k+ parts

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4,081

$11.049

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-

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AZTECH Wire

Italy . 318 parts In-Stock

1+ parts

$13.520

100+ parts

-

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-

10k+ parts

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318

$13.520

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-

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Microchip USA

USA . 1,534 parts In-Stock

1+ parts

$34.090

100+ parts

$33.610

1k+ parts

$33.360

10k+ parts

$33.120

1,534

$34.090

$33.610

$33.360

$33.120

Parana Technologies

USA . 895 parts In-Stock

1+ parts

$43.662

100+ parts

-

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-

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-

895

$43.662

-

-

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DigiPath Technology Company

USA . 247 parts In-Stock

1+ parts

$48.077

100+ parts

-

1k+ parts

-

10k+ parts

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247

$48.077

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-

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ChromeModa Solutions

Germany . 6,837 parts In-Stock

1+ parts

$49.058

100+ parts

$40.228

1k+ parts

-

10k+ parts

-

6,837

$49.058

$40.228

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IDEA Electronic Components Group

UK . 2,287 parts In-Stock

1+ parts

$49.058

100+ parts

$46.605

1k+ parts

$44.152

10k+ parts

-

2,287

$49.058

$46.605

$44.152

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

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Overview

Unlock the power of innovation with the TM4C129EKCPDTT3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality microcontrollers that are versatile and reliable. With applications ranging from automotive to industrial automation, this microcontroller provides exceptional value and benefits to customers. Experience seamless connectivity, efficient performance, and cutting-edge technology with the TM4C129EKCPDTT3, making it the perfect choice for your next project. Elevate your designs and stay ahead of the curve with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the microcontroller, making it suitable for various environments and applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB integration, saving space and simplifying assembly processes.

Maximum Supply Voltage: 1.32 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, increasing its versatility.

On Chip Data RAM Width: 8

Having an 8-bit data RAM width enables efficient data processing and storage within the microcontroller.

Address Bus Width: 28

A wide 28-bit address bus allows the microcontroller to access a large memory space, facilitating complex operations and multitasking.

Package Shape: SQUARE

Square package shape provides uniformity in design and makes it easier to handle during assembly and mounting procedures.

Bit Size: 32

32-bit architecture offers high computational power, enabling the microcontroller to perform complex calculations and tasks effectively.

No. of Terminals: 128

Having a high number of terminals allows for multiple connections and interfaces, enhancing the microcontroller's connectivity capabilities.

Maximum Clock Frequency: 25 MHz

A high maximum clock frequency ensures fast and responsive operation, making the microcontroller suitable for real-time applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates that the microcontroller can withstand moderate humidity levels, making it reliable in a variety of environmental conditions.

Technical Specifications

Microcontrollers TM4C129EKCPDTT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

90

No. of Serial I/Os:

2

No. of Terminals:

128

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

20-Ch 12-Bit

Trade Compliance

TM4C129EKCPDTT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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