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TM4C129DNCZADI3R

Texas Instruments

TM4C129DNCZADI3R by Texas Instruments

TM4C129DNCZADI3R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 1048576 ROM words, and 256 RAM words. It features 24-Ch 12-Bit ADCs, 32 DMA channels, and peripherals like CAN, Ethernet, and USB. Ideal for industrial applications requiring high-speed processing and low power consumption.

Median Price

$13.230

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,484 parts In-Stock

1+ parts

$13.230

100+ parts

$11.557

1k+ parts

$7.970

10k+ parts

-

6,484

$13.230

$11.557

$7.970

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,944 parts In-Stock

1+ parts

$12.568

100+ parts

-

1k+ parts

-

10k+ parts

-

4,944

$12.568

-

-

-

Vyrian

USA . 7,412 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,412

-

-

-

-

Chip Stock

USA . 135 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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135

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,626 parts In-Stock

1+ parts

$11.907

100+ parts

-

1k+ parts

-

10k+ parts

-

2,626

$11.907

-

-

-

AZTECH Wire

Italy . 81 parts In-Stock

1+ parts

$16.660

100+ parts

-

1k+ parts

-

10k+ parts

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81

$16.660

-

-

-

Microchip USA

USA . 2,028 parts In-Stock

1+ parts

$29.980

100+ parts

$29.550

1k+ parts

$29.330

10k+ parts

$29.120

2,028

$29.980

$29.550

$29.330

$29.120

Parana Technologies

USA . 754 parts In-Stock

1+ parts

$41.969

100+ parts

-

1k+ parts

-

10k+ parts

-

754

$41.969

-

-

-

ChromeModa Solutions

Germany . 4,609 parts In-Stock

1+ parts

$47.156

100+ parts

$38.668

1k+ parts

-

10k+ parts

-

4,609

$47.156

$38.668

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-

IDEA Electronic Components Group

UK . 975 parts In-Stock

1+ parts

$47.156

100+ parts

$44.798

1k+ parts

$42.440

10k+ parts

-

975

$47.156

$44.798

$42.440

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Component Stockers USA

USA . 4,839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.530

10k+ parts

-

4,839

-

-

$8.530

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DigiPath Technology Company

USA . 1,792 parts In-Stock

1+ parts

-

100+ parts

$42.516

1k+ parts

-

10k+ parts

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1,792

-

$42.516

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-

Overview

Experience the cutting-edge technology of the TM4C129DNCZADI3R microcontroller by Texas Instruments, a pioneer in the industry known for its top-quality products. This versatile device offers a wide range of applications, from industrial automation to consumer electronics, providing customers with unmatched performance and reliability. With advanced features like integrated cache and a variety of peripherals, this microcontroller delivers exceptional value, making it the ideal choice for your next project. Trust Texas Instruments to bring innovation to your designs with the TM4C129DNCZADI3R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used in microcontrollers due to its durability and low cost.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the microcontroller by storing frequently accessed data.

Maximum Supply Voltage: 1.32 V

The higher supply voltage allows for more power to be delivered to the microcontroller, enabling it to handle more complex tasks.

Address Bus Width: 28

A wider address bus allows the microcontroller to access a larger range of memory locations, enhancing its capabilities.

Bit Size: 32

With a bit size of 32, this microcontroller is capable of processing data in larger chunks, leading to faster execution of instructions.

ROM Words: 1048576

The large ROM size allows for storing a significant amount of program data, making the microcontroller suitable for complex applications.

Peripherals: BOD, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

The wide range of peripherals available on this microcontroller enables it to interface with various external devices, expanding its functionality.

Maximum Clock Frequency: 25 MHz

The high clock frequency allows the microcontroller to process instructions quickly, leading to improved performance.

Analog To Digital Convertors: 24-Ch 12-Bit

The multiple ADC channels with high resolution enable the microcontroller to accurately measure analog signals, making it suitable for sensor applications.

Connectivity: CAN(2), ETHERNET, I2C(10), IRDA, SPI, SSI(4), UART(8), USB

The diverse connectivity options make it easy to interface with different communication protocols and devices, enhancing its versatility.

Technical Specifications

Microcontrollers TM4C129DNCZADI3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

5

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

102.3 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET, I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C129DNCZADI3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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