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TM4C1299NCZADT3R

Texas Instruments

TM4C1299NCZADT3R by Texas Instruments

TM4C1299NCZADT3R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family. It features 24-Ch 12-Bit ADC, 32 DMA channels, and peripherals like CAN, Ethernet, and USB. Ideal for industrial applications due to its wide temperature range (-40 to 105 °C) and low power mode capability.

Median Price

$16.421

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,985 parts In-Stock

1+ parts

$16.421

100+ parts

$14.343

1k+ parts

$9.892

10k+ parts

-

3,985

$16.421

$14.343

$9.892

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,422 parts In-Stock

1+ parts

$15.600

100+ parts

-

1k+ parts

-

10k+ parts

-

3,422

$15.600

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-

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Vyrian

USA . 3,041 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,041

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 1,015 parts In-Stock

1+ parts

$14.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,015

$14.050

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-

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Corphita

USA . 991 parts In-Stock

1+ parts

$14.779

100+ parts

-

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991

$14.779

-

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Microchip USA

USA . 2,777 parts In-Stock

1+ parts

$37.210

100+ parts

$36.670

1k+ parts

$36.410

10k+ parts

$36.140

2,777

$37.210

$36.670

$36.410

$36.140

Parana Technologies

USA . 1,212 parts In-Stock

1+ parts

$69.513

100+ parts

-

1k+ parts

-

10k+ parts

-

1,212

$69.513

-

-

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ChromeModa Solutions

Germany . 1,854 parts In-Stock

1+ parts

$78.104

100+ parts

$64.045

1k+ parts

-

10k+ parts

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1,854

$78.104

$64.045

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IDEA Electronic Components Group

UK . 572 parts In-Stock

1+ parts

$78.104

100+ parts

$74.199

1k+ parts

$70.294

10k+ parts

-

572

$78.104

$74.199

$70.294

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

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3,000

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DigiPath Technology Company

USA . 2,154 parts In-Stock

1+ parts

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100+ parts

$70.419

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2,154

-

$70.419

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Overview

Experience the power of innovation with the TM4C1299NCZADT3R by Texas Instruments, a cutting-edge microcontroller designed for a wide range of applications. With a reputation for excellence and reliability, Texas Instruments delivers unrivaled quality in every product. This microcontroller offers exceptional value to customers, providing advanced features such as integrated cache and ADC channels. Perfect for industrial use, this microcontroller boasts a high clock frequency and low power mode, making it an essential component for any project requiring precision and efficiency. Trust Texas Instruments to deliver superior performance and reliability in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and cost-effective.

Integrated Cache: YES

Having an integrated cache helps in improving the device performance by reducing access times to frequently used data.

Maximum Supply Voltage: 1.32 V

The maximum supply voltage of 1.32 V ensures safe operation and helps in preventing damage to the device.

On Chip Data RAM Width: 8

The on-chip data RAM width of 8 enhances the system's data processing capabilities and speed.

Address Bus Width: 28

The 28-bit address bus width allows the microcontroller to access a larger memory space, enabling more complex applications to be executed.

Package Shape: SQUARE

The square package shape makes the microcontroller suitable for space-constrained applications where a compact form factor is required.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process larger data sets and execute more complex instructions efficiently.

No. of Terminals: 212

Having a higher number of terminals allows for more connectivity options, enabling the microcontroller to interface with a variety of external devices.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style with a very thin profile and fine pitch design makes the microcontroller suitable for high-density mounting applications, saving space on the PCB.

Minimum Supply Voltage: 1.14 V

The minimum supply voltage of 1.14 V ensures reliable operation even under low power conditions, making the microcontroller energy-efficient.

Maximum Operating Temperature: 105 °C

With a high maximum operating temperature of 105°C, the microcontroller can withstand harsh environmental conditions and extended operation.

Technical Specifications

Microcontrollers TM4C1299NCZADT3R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

3

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1299NCZADT3R Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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