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TM4C1294NCZADT3

Texas Instruments

TM4C1294NCZADT3 by Texas Instruments

TM4C1294NCZADT3 by Texas Instruments is a 32-bit CORTEX-M4F microcontroller with 1048576 ROM words, 256 RAM words, and 24-Ch 12-Bit ADC channels. It features CAN(2), ETHERNET(2), I2C(10), SPI connectivity for industrial applications requiring low power mode and max clock frequency of 25 MHz.

Median Price

$17.440

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 184 parts In-Stock

1+ parts

$9.280

100+ parts

$9.090

1k+ parts

$8.910

10k+ parts

-

184

$9.280

$9.090

$8.910

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Texas Instruments

USA . 3,711 parts In-Stock

1+ parts

$13.579

100+ parts

$11.861

1k+ parts

$8.180

10k+ parts

-

3,711

$13.579

$11.861

$8.180

-

DigiKey

USA . 647 parts In-Stock

1+ parts

$21.300

100+ parts

$15.969

1k+ parts

$13.860

10k+ parts

-

647

$21.300

$15.969

$13.860

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Mouser Electronics

USA . 203 parts In-Stock

1+ parts

$21.300

100+ parts

$14.420

1k+ parts

$13.850

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203

$21.300

$14.420

$13.850

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,646 parts In-Stock

1+ parts

$8.816

100+ parts

-

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2,646

$8.816

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$14.995

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-

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150

$14.995

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Semtec, LLC

USA . 4,950 parts In-Stock

1+ parts

-

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4,950

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-

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Chip Stock

USA . 4,650 parts In-Stock

1+ parts

-

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4,650

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Vyrian

USA . 3,135 parts In-Stock

1+ parts

-

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3,135

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Prism Electronics

USA . 3 parts In-Stock

1+ parts

-

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3

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,095 parts In-Stock

1+ parts

$7.890

100+ parts

-

1k+ parts

-

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1,095

$7.890

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Semicontronic

India . 827 parts In-Stock

1+ parts

$7.890

100+ parts

$7.693

1k+ parts

$7.653

10k+ parts

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827

$7.890

$7.693

$7.653

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Corphita

USA . 3,358 parts In-Stock

1+ parts

$8.352

100+ parts

-

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3,358

$8.352

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Continental Prestige Electronics

USA . 2,091 parts In-Stock

1+ parts

$14.995

100+ parts

-

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$14.695

2,091

$14.995

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-

$14.695

Corohmni

South Africa . 368 parts In-Stock

1+ parts

$51.498

100+ parts

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368

$51.498

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Microchip USA

USA . 7,033 parts In-Stock

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$53.200

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7,033

$53.200

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$59.448

100+ parts

$54.098

1k+ parts

$48.747

10k+ parts

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3,000

$59.448

$54.098

$48.747

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Parana Technologies

USA . 853 parts In-Stock

1+ parts

$68.285

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853

$68.285

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ChromeModa Solutions

Germany . 3,335 parts In-Stock

1+ parts

$76.725

100+ parts

$62.914

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-

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3,335

$76.725

$62.914

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IDEA Electronic Components Group

UK . 1,843 parts In-Stock

1+ parts

$76.725

100+ parts

$72.889

1k+ parts

$69.052

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1,843

$76.725

$72.889

$69.052

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Lixinc

USA . 6,118 parts In-Stock

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Argo Parts USA

USA . 3,454 parts In-Stock

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3,454

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DigiPath Technology Company

USA . 1,761 parts In-Stock

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$69.175

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1,761

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$69.175

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Perfect Parts

USA . 828 parts In-Stock

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828

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Kepictronics

USA . 160 parts In-Stock

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160

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A-Z Elektronik GmbH

Germany . 126 parts In-Stock

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126

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Overview

Unlock endless possibilities with the TM4C1294NCZADT3 by Texas Instruments, a cutting-edge microcontroller designed to revolutionize your projects. With Texas Instruments' renowned quality and expertise, this device offers unparalleled performance and reliability in a variety of applications. From industrial automation to consumer electronics, this microcontroller delivers value, efficiency, and versatility to meet all your needs. Embrace the power of innovation with Texas Instruments and take your creations to the next level.

Feature Benefit Bullets

Package Body Material - PLASTIC/EPOXY

Plastic/epoxy material makes the package lightweight and durable, ideal for portable or rugged applications.

Surface Mount - YES

Surface mount capability allows for easier and more compact PCB assembly, saving space and cost.

Maximum Supply Voltage - 1.32 V

Operates efficiently within a low maximum supply voltage range, reducing power consumption and heat dissipation.

On Chip Data RAM Width - 8

8-bit data RAM width allows for efficient data processing and storage capabilities.

Address Bus Width - 28

Wide 28-bit address bus enables access to a larger memory space, accommodating complex applications.

Package Shape - SQUARE

Square package shape facilitates easier PCB layout and mounting, optimizing space usage.

Bit Size - 32

32-bit architecture provides enhanced processing power and efficiency for high-performance applications.

No. of Terminals - 212

With 212 terminals, this microcontroller offers extensive connectivity options for peripherals and external components.

Package Style (Meter) - GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Grid array package style with a thin profile and fine pitch design enhances signal integrity and reliability in high-frequency applications.

Minimum Supply Voltage - 1.14 V

The low minimum supply voltage requirement allows for operation in energy-efficient and battery-powered devices.

Maximum Operating Temperature - 105 °C

High maximum operating temperature ensures reliable performance in harsh industrial environments.

CPU Family - CORTEX-M4F

Cortex-M4F architecture offers efficient processing capabilities and low-power consumption, making it suitable for a wide range of applications.

Minimum Operating Temperature - -40 °C

Wide temperature range from -40 to 105°C allows for operation in extreme environmental conditions.

Terminal Finish - TIN SILVER COPPER

Tin silver copper terminal finish provides excellent conductivity and reliability for long-term use.

ADC Channels - YES

Analog-to-digital converter channels enable precise and accurate conversion of analog signals for sensor interfacing and data acquisition.

DMA Channels - YES

Direct memory access channels enhance data transfer speed and efficiency, particularly useful for real-time processing and high-speed communication interfaces.

Terminal Position - BOTTOM

Bottom terminal position simplifies PCB layout and assembly process, enhancing overall system integration.

ROM Words - 1048576

Large ROM memory size of 1048576 words allows for extensive program storage and efficient code execution.

Maximum Seated Height - 1 mm

Low maximum seated height enables compact device designs and reduced system profile for space-constrained applications.

RAM Words - 256

256 words of RAM provide sufficient memory for data storage and temporary processing, supporting multitasking and data manipulation tasks.

Width - 10 mm

Narrow 10mm width makes the microcontroller suitable for compact and slim device designs with space-saving benefits.

Data EEPROM Size - 6K

6K data EEPROM size allows for non-volatile data storage and retrieval, preserving critical information during power cycles.

Boundary Scan - YES

Boundary scan feature allows for efficient testing and debugging during production, ensuring high-quality and reliable manufacturing.

External Data Bus Width - 32

Wide 32-bit external data bus width supports high-speed data transfer and communication with external devices for enhanced system performance.

Peripherals - BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Rich set of peripherals including BOD, comparators, DMA, PWM, timers, and communication interfaces enhance system functionality and flexibility for diverse applications.

Maximum Clock Frequency - 25 MHz

High maximum clock frequency of 25 MHz enables swift data processing and real-time responsiveness for time-critical applications.

Maximum Time At Peak Reflow Temperature (s) - 30

Extended time at peak reflow temperature ensures thorough and reliable solder connections during manufacturing processes.

Peak Reflow Temperature °C - 260

High peak reflow temperature of 260°C ensures proper solder melting and joint formation for robust soldering connections.

Length - 10 mm

Compact 10mm length facilitates space-efficient PCB layout and system integration, allowing for smaller device form factors.

Temperature Grade - INDUSTRIAL

Industrial temperature grade ensures reliable operation in demanding industrial environments with varying temperature conditions.

Peripheral IC Type - MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers efficient instruction execution and reduced power consumption, ideal for embedded systems.

No. of Timers - 8

8 timers provide versatile timing and event management capabilities for scheduling tasks and coordinating system operations.

RAM Bytes - 262144

Large RAM size of 262144 bytes supports extensive data storage and efficient memory access for complex algorithms and data processing.

Technology - CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for battery-powered and noise-sensitive applications.

Terminal Form - BALL

Ball terminal form facilitates reliable solder connections and simplifies device mounting, ensuring secure electrical connections.

Analog To Digital Convertors - 24-Ch 12-Bit

24-channel 12-bit ADC provides high-resolution analog signal conversion for precise sensor interfacing and data acquisition.

Maximum Supply Current - 144.6 mA

With a maximum supply current of 144.6 mA, the microcontroller operates efficiently within power constraints and minimizes energy consumption.

Nominal Supply Voltage - 1.2 V

Nominal supply voltage of 1.2V ensures stable and reliable operation without exceeding power requirements, improving overall system reliability.

No. of Serial I/Os - 5

5 serial I/O interfaces provide versatile connectivity options for communication with external devices, expanding system integration capabilities.

PWM Channels - YES

PWM channels enable precise control of analog outputs and motor speed, essential for applications requiring variable voltage or current control.

Connectivity - CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Versatile connectivity options including CAN, Ethernet, I2C, SPI, UART, and USB enhance communication interfaces for diverse device connectivity and networking.

ROM Programmability - FLASH

Flash ROM programming allows for flexible and easy firmware updates, enabling quick system enhancements and modifications.

Terminal Pitch - 0.5 mm

Fine terminal pitch of 0.5mm facilitates high-density PCB layouts and miniaturization, enabling compact device designs with optimized space usage.

Format - FIXED POINT

Fixed-point format simplifies numerical calculations and reduces computational complexity, improving performance efficiency for mathematical operations.

Moisture Sensitivity Level (MSL) - 3

MSL level 3 indicates moderate sensitivity to moisture during storage and assembly, requiring standard handling precautions to maintain component reliability.

Speed - 120 rpm

Operating speed of 120 rpm enables fast data processing and system response, suitable for applications requiring quick data analysis or control.

Technical Specifications

Microcontrollers TM4C1294NCZADT3 attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B212

JESD-609 Code:

e1

Length:

10 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

140

No. of Serial I/Os:

5

No. of Terminals:

212

No. of Timers:

8

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

RAM Words:

256

ROM Words:

1048576

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

120 rpm

Maximum Supply Current:

144.6 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.14 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

6K

Connectivity:

CAN(2), ETHERNET(2), I2C(10), IRDA, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), CRC, DMA(32), LCD, POR, PWM(8), QEI, RTC, TIMER(9), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C1294NCZADT3 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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