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TM4C123GH6ZRBT

Texas Instruments

TM4C123GH6ZRBT by Texas Instruments

TM4C123GH6ZRBT by Texas Instruments is a 32-bit microcontroller with 262144 ROM words and 32768 RAM bytes. It features 24-Ch 12-Bit ADC channels, 16 PWM channels, and connectivity options like CAN, I2C, SPI, UART. Ideal for industrial applications requiring high-speed processing and extensive peripheral support.

Median Price

$6.100

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 336 parts In-Stock

1+ parts

$6.100

100+ parts

$5.980

1k+ parts

$5.860

10k+ parts

-

336

$6.100

$5.980

$5.860

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,985 parts In-Stock

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6,985

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Digiode

USA . 3,841 parts In-Stock

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3,841

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Distributors (Availability)

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One Stop Electronics

USA . 863 parts In-Stock

1+ parts

$15.000

100+ parts

-

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863

$15.000

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AZTECH Wire

Italy . 439 parts In-Stock

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$15.504

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439

$15.504

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Parana Technologies

USA . 1,778 parts In-Stock

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$66.827

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1,778

$66.827

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DigiPath Technology Company

USA . 51 parts In-Stock

1+ parts

$73.584

100+ parts

$67.698

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51

$73.584

$67.698

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ChromeModa Solutions

Germany . 6,514 parts In-Stock

1+ parts

$75.086

100+ parts

$61.571

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6,514

$75.086

$61.571

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IDEA Electronic Components Group

UK . 176 parts In-Stock

1+ parts

$75.086

100+ parts

$71.332

1k+ parts

$67.577

10k+ parts

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176

$75.086

$71.332

$67.577

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Component Stockers USA

USA . 773 parts In-Stock

1+ parts

$99.990

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773

$99.990

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A-Z Elektronik GmbH

Germany . 6,476 parts In-Stock

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6,476

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Corphita

USA . 655 parts In-Stock

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655

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ChipstoGo Electronic ltd

UK . 159 parts In-Stock

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159

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Overview

Enhance your electronic projects with the TM4C123GH6ZRBT microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. This versatile microcontroller is perfect for a wide range of applications, offering advanced features such as ADC channels, DMA channels, PWM channels, and more. With its efficient design and powerful performance, the TM4C123GH6ZRBT provides exceptional value and benefits to customers looking to bring their projects to the next level. Experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the microcontroller, making it suitable for various applications.

Maximum Supply Voltage: 1.32 V

Allows for a higher potential difference to be applied to the microcontroller without causing damage.

Bit Size: 32

Offers a larger bit size for handling more complex computations and data processing tasks effectively.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options, enabling flexibility in design and operation.

ADC Channels: YES

Includes Analog to Digital Convertor channels, allowing for accurate conversion of analog signals to digital data.

DMA Channels: YES

Incorporates Direct Memory Access channels for efficient data transfer between peripherals and memory without CPU intervention.

CPU Family: CORTEX-M4F

Utilizes a powerful Cortex-M4F CPU family for high performance and energy-efficient operation.

ROM Words: 262144

Provides ample ROM storage capacity for storing program instructions and data.

RAM Bytes: 32768

Offers a generous amount of Random Access Memory for temporary data storage during operation.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Supports multiple communication interfaces for seamless connectivity with various external devices and peripherals.

Speed: 80 rpm

Operates at a speed of 80 revolutions per minute, suitable for a wide range of motor control applications.

Technical Specifications

Microcontrollers TM4C123GH6ZRBT attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B157

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

157

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA157,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C123GH6ZRBT Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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