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TM4C123GH6ZRBIR

Texas Instruments

TM4C123GH6ZRBIR by Texas Instruments

TM4C123GH6ZRBIR by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU, 32768 bytes of RAM, and 262144 ROM words. It features 24-Ch 12-Bit ADC channels, 16 PWM channels, and connectivity options like CAN(2), I2C(6), SPI, UART(8), USB for industrial applications. With a max clock frequency of 25 MHz and operating temperature range from -40 to 85 °C, it offers high performance in a compact package style.

Median Price

$7.965

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$7.965

100+ parts

-

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300

$7.965

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Vyrian

USA . 4,571 parts In-Stock

1+ parts

-

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-

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4,571

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Digiode

USA . 533 parts In-Stock

1+ parts

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533

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 516 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

10k+ parts

-

516

$5.000

$4.875

$4.850

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Continental Prestige Electronics

USA . 4,310 parts In-Stock

1+ parts

$7.965

100+ parts

-

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$7.806

4,310

$7.965

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-

$7.806

One Stop Electronics

USA . 797 parts In-Stock

1+ parts

$14.000

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-

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797

$14.000

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AZTECH Wire

Italy . 862 parts In-Stock

1+ parts

$18.509

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862

$18.509

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Ampacity Inc.

Singapore . 1,259 parts In-Stock

1+ parts

$20.000

100+ parts

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1,259

$20.000

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Parana Technologies

USA . 1,275 parts In-Stock

1+ parts

$55.243

100+ parts

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1,275

$55.243

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DigiPath Technology Company

USA . 209 parts In-Stock

1+ parts

$60.830

100+ parts

$55.963

1k+ parts

-

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209

$60.830

$55.963

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ChromeModa Solutions

Germany . 6,655 parts In-Stock

1+ parts

$62.071

100+ parts

$50.898

1k+ parts

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6,655

$62.071

$50.898

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IDEA Electronic Components Group

UK . 608 parts In-Stock

1+ parts

$62.071

100+ parts

$58.967

1k+ parts

$55.864

10k+ parts

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608

$62.071

$58.967

$55.864

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Corphita

USA . 3,414 parts In-Stock

1+ parts

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3,414

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Argo Parts USA

USA . 1,962 parts In-Stock

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1,962

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$7.806

1k+ parts

$7.567

10k+ parts

$7.407

500

-

$7.806

$7.567

$7.407

Overview

Experience the power of cutting-edge technology with the TM4C123GH6ZRBIR by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality microcontrollers that offer unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with high value, efficiency, and versatility. With advanced features and a robust design, the TM4C123GH6ZRBIR is the perfect solution for your next project, ensuring seamless operation and optimal results every time. Elevate your work with Texas Instruments and unlock endless possibilities today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material for the package body, ensuring the product is sturdy and easy to handle.

Surface Mount: YES

Easy installation and space-saving design, suitable for compact electronic devices.

Maximum Supply Voltage: 1.32 V

Allows for efficient power management and optimal performance within specified voltage limits.

Bit Size: 32

High bit size provides enhanced processing capabilities and data handling.

Power Supplies (V): 1.2,3.3

Supports multiple power supply options for flexibility in different applications.

No. of Terminals: 157

Sufficient terminals for connectivity and interfacing with other components.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Innovative package style for compact and efficient board layout.

Minimum Supply Voltage: 1.08 V

Ensures stable operation even at lower supply voltages for energy efficiency.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial applications.

CPU Family: CORTEX-M4F

Utilizes advanced Cortex-M4F architecture for high-performance computing.

Minimum Operating Temperature: -40 °C

Can operate in extreme cold temperatures, ideal for a variety of environments.

ADC Channels: YES

Integrated Analog to Digital Converters for accurate and efficient signal processing.

DMA Channels: YES

Direct Memory Access functionality for faster data transfer and reduced CPU workload.

ROM Words: 262144

Large Read-Only Memory capacity for storing program instructions and data.

Maximum Clock Frequency: 25 MHz

High clock frequency for speedy data processing and real-time responsiveness.

RAM Bytes: 32768

Ample Random Access Memory for temporary data storage and efficient multitasking.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high-speed operation.

Analog To Digital Convertors: 24-Ch 12-Bit

Multiple high-resolution ADCs for accurate analog signal conversion.

PWM Channels: YES

Pulse Width Modulation channels for precise control of analog outputs.

ROM Programmability: FLASH

Flash programmable ROM for easy and quick firmware updates.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Versatile connectivity options for interfacing with a wide range of devices and protocols.

Technical Specifications

Microcontrollers TM4C123GH6ZRBIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B157

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

157

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA157,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C123GH6ZRBIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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