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TM4C123GH6ZRBI7R

Texas Instruments

TM4C123GH6ZRBI7R by Texas Instruments

TM4C123GH6ZRBI7R by Texas Instruments is a 32-bit microcontroller with Cortex-M4F CPU family, offering 24-Ch 12-Bit ADC channels and 32 DMA channels. It features a max clock frequency of 25 MHz, suitable for industrial applications requiring low power mode and connectivity options like CAN, I2C, SPI, UART, and USB. With on-chip program ROM width of 8 bits and flash ROM programmability, it provides versatile solutions in a compact package style with a grid array shape.

Median Price

$7.965

Lifecycle Status

EOL

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$7.965

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100

$7.965

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Component Sense

UK . 15,406 parts In-Stock

1+ parts

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15,406

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Vyrian

USA . 4,062 parts In-Stock

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4,062

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Digiode

USA . 253 parts In-Stock

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253

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Distributors (Availability)

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$7.965

100+ parts

$7.806

1k+ parts

$7.567

10k+ parts

$7.407

2,000

$7.965

$7.806

$7.567

$7.407

Continental Prestige Electronics

USA . 1,382 parts In-Stock

1+ parts

$7.965

100+ parts

-

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$7.806

1,382

$7.965

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-

$7.806

Semicontronic

India . 772 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

-

772

$13.000

$12.675

$12.610

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AZTECH Wire

Italy . 530 parts In-Stock

1+ parts

$15.804

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530

$15.804

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Ampacity Inc.

Singapore . 858 parts In-Stock

1+ parts

$23.000

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858

$23.000

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Parana Technologies

USA . 100 parts In-Stock

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$23.460

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$24.092

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100

$23.460

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$24.092

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Microchip USA

USA . 2,423 parts In-Stock

1+ parts

$23.460

100+ parts

$23.130

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$22.960

10k+ parts

$22.790

2,423

$23.460

$23.130

$22.960

$22.790

DigiPath Technology Company

USA . 2,224 parts In-Stock

1+ parts

$25.832

100+ parts

$23.765

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2,224

$25.832

$23.765

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ChromeModa Solutions

Germany . 5,969 parts In-Stock

1+ parts

$26.359

100+ parts

$21.614

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5,969

$26.359

$21.614

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IDEA Electronic Components Group

UK . 1,757 parts In-Stock

1+ parts

$26.359

100+ parts

$25.041

1k+ parts

$23.723

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1,757

$26.359

$25.041

$23.723

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One Stop Electronics

USA . 1,128 parts In-Stock

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$31.000

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$31.000

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Corphita

USA . 4,143 parts In-Stock

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Argo Parts USA

USA . 3,614 parts In-Stock

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3,614

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Overview

Unlock the power of innovation with the Texas Instruments TM4C123GH6ZRBI7R Microcontroller. Crafted with precision and expertise, this device offers unparalleled performance and reliability for a wide range of applications. From robotics to industrial automation, this microcontroller delivers advanced features such as integrated cache, high-speed connectivity options, and low power modes, making it the ideal choice for your next project. Experience the quality and value that Texas Instruments brings to every product, and elevate your designs to new heights with the TM4C123GH6ZRBI7R.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the microcontroller lightweight and durable, making it easy to handle and less susceptible to damage during handling and installation.

Integrated Cache: YES

Having an integrated cache helps improve the performance of the microcontroller by reducing the access time to frequently used data and instructions, leading to faster execution of tasks.

Maximum Supply Voltage: 1.32 V

The higher maximum supply voltage allows for flexibility in power supply options and can accommodate a wider range of applications without risking damage to the microcontroller.

CPU Family: CORTEX-M4F

The CORTEX-M4F CPU family is known for its high performance and energy efficiency, making it ideal for applications where both speed and power consumption are important factors.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency of 25 MHz, this microcontroller can handle demanding tasks and real-time processing requirements efficiently and effectively.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

The wide range of connectivity options including CAN, I2C, SPI, UART, and USB makes this microcontroller versatile and suitable for a variety of communication protocols and interfaces, enhancing its compatibility with different systems.

Technical Specifications

Microcontrollers TM4C123GH6ZRBI7R attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

Boundary Scan:

YES

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B157

JESD-609 Code:

e1

Length:

9 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

32

No. of External Interrupts:

0

No. of I/O Lines:

120

No. of Serial I/Os:

21

No. of Terminals:

157

No. of Timers:

12

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

32768

RAM Words:

32

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Maximum Supply Current:

54.9 mA

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C123GH6ZRBI7R Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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