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TM4C123GH6ZRBI

Texas Instruments

TM4C123GH6ZRBI by Texas Instruments

TM4C123GH6ZRBI by Texas Instruments is a 32-bit microcontroller with a max clock frequency of 25 MHz. It features 24-channel, 12-bit analog-to-digital converters and offers connectivity options such as CAN, I2C, SPI, UART, and USB. This microcontroller is commonly used in industrial applications due to its temperature grade and robust peripherals.

Median Price

$7.532

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 901 parts In-Stock

1+ parts

$5.780

100+ parts

$5.660

1k+ parts

$5.550

10k+ parts

-

901

$5.780

$5.660

$5.550

-

DigiKey

USA . 170 parts In-Stock

1+ parts

$11.230

100+ parts

-

1k+ parts

$7.311

10k+ parts

$6.368

170

$11.230

-

$7.311

$6.368

Avnet

USA . 138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.532

10k+ parts

$6.953

138

-

-

$7.532

$6.953

Distributors (In-Stock)

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Nova Conductors

Japan . 24 parts In-Stock

1+ parts

$9.625

100+ parts

-

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24

$9.625

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Vyrian

USA . 4,768 parts In-Stock

1+ parts

-

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4,768

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Digiode

USA . 3,295 parts In-Stock

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3,295

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Distributors (Availability)

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Semicontronic

India . 1,536 parts In-Stock

1+ parts

$4.000

100+ parts

$3.900

1k+ parts

$3.880

10k+ parts

-

1,536

$4.000

$3.900

$3.880

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AZTECH Wire

Italy . 818 parts In-Stock

1+ parts

$4.994

100+ parts

-

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818

$4.994

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Continental Prestige Electronics

USA . 109 parts In-Stock

1+ parts

$9.625

100+ parts

-

1k+ parts

-

10k+ parts

$9.433

109

$9.625

-

-

$9.433

One Stop Electronics

USA . 679 parts In-Stock

1+ parts

$12.000

100+ parts

-

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679

$12.000

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Ampacity Inc.

Singapore . 282 parts In-Stock

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$13.000

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282

$13.000

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Parana Technologies

USA . 2,377 parts In-Stock

1+ parts

$30.070

100+ parts

-

1k+ parts

$66.765

10k+ parts

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2,377

$30.070

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$66.765

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DigiPath Technology Company

USA . 679 parts In-Stock

1+ parts

$33.111

100+ parts

$30.462

1k+ parts

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10k+ parts

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679

$33.111

$30.462

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ChromeModa Solutions

Germany . 4,924 parts In-Stock

1+ parts

$33.787

100+ parts

$27.705

1k+ parts

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4,924

$33.787

$27.705

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IDEA Electronic Components Group

UK . 1,275 parts In-Stock

1+ parts

$33.787

100+ parts

$32.098

1k+ parts

$30.408

10k+ parts

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1,275

$33.787

$32.098

$30.408

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A-Z Elektronik GmbH

Germany . 5,720 parts In-Stock

1+ parts

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5,720

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Corphita

USA . 3,977 parts In-Stock

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3,977

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Argo Parts USA

USA . 531 parts In-Stock

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531

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Overview

Experience the power and precision of the TM4C123GH6ZRBI microcontroller by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers unparalleled quality and reliability. With its advanced features and versatile applications, this microcontroller is the perfect choice for your projects. Whether you're working on industrial automation, consumer electronics, or even robotics, the TM4C123GH6ZRBI offers exceptional value and benefits. Its high-speed processing, extensive connectivity options, and robust peripherals make it a game-changer in the world of microcontrollers. Unlock your creative potential and unleash your innovation with the TM4C123GH6ZRBI from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microcontroller is housed in a robust plastic/epoxy package, providing durability and protection to the internal components, making it a reliable choice for various applications.

Surface Mount: YES

The surface mount capability simplifies the installation process, allowing for easier integration onto circuit boards, making it ideal for high-volume production and compact designs.

Maximum Supply Voltage: 1.32 V

With a maximum supply voltage of 1.32 V, this microcontroller can operate efficiently across a wide range of power sources, offering flexibility in different power supply scenarios.

Package Shape: SQUARE

The square package shape facilitates efficient placement on circuit boards, optimizing space utilization and providing a compact footprint, making it suitable for space-constrained applications.

Bit Size: 32

Featuring a 32-bit architecture, this microcontroller is designed to handle complex tasks and process larger sets of data, enabling it to execute advanced algorithms and enhance overall performance.

Power Supplies (V): 1.2,3.3

With support for multiple power supply voltages (1.2 V and 3.3 V), this microcontroller offers compatibility with a wide range of power sources, allowing for versatile integration into various systems.

No. of Terminals: 157

The large number of terminals provided (157) allows for efficient connectivity with peripheral devices and external components, enabling seamless communication and integration within a system.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array package style, combined with a very thin profile and fine pitch, offers excellent thermal dissipation and efficient signal routing, ensuring reliable performance in demanding applications.

Minimum Supply Voltage: 1.08 V

With a minimum supply voltage of 1.08 V, this microcontroller can operate effectively even in low voltage scenarios, making it suitable for energy-efficient designs and battery-powered applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this microcontroller can withstand harsh environments and operate reliably in industrial settings, ensuring stable performance under demanding conditions.

CPU Family: CORTEX-M4F

Based on the Cortex-M4F CPU family, this microcontroller provides advanced processing capabilities, including floating-point operations, enabling it to handle computationally intensive tasks and complex algorithms efficiently.

Minimum Operating Temperature: -40 °C

Designed to operate reliably even in extreme temperatures, this microcontroller has a minimum operating temperature of -40°C, making it suitable for use in rugged environments and demanding applications.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin silver copper ensures excellent electrical conductivity and corrosion resistance, ensuring reliable connections and long-term performance.

ADC Channels: YES

Equipped with an analog-to-digital converter (ADC), this microcontroller can accurately convert analog signals into digital data, making it suitable for applications that require precise measurements or sensing capabilities.

DMA Channels: YES

With support for direct memory access (DMA) channels, this microcontroller can efficiently offload data transfer tasks, improving overall system performance and enabling real-time data processing.

Terminal Position: BOTTOM

The terminal position at the bottom of the package simplifies the PCB layout and allows for easier routing of traces, enhancing the overall design flexibility and ease of integration.

ROM Words: 262144

With a large ROM capacity of 262,144 words, this microcontroller can store a significant amount of program code, enabling the implementation of complex software solutions and advanced functionalities.

Maximum Seated Height: 1 mm

With a maximum seated height of 1 mm, this microcontroller provides a compact form factor, suitable for space-limited designs and applications where height constraints are crucial.

Width: 9 mm

With a narrow width of 9 mm, this microcontroller offers space-saving benefits and can be easily integrated into small form factor devices or PCB layouts.

Data EEPROM Size: 2K

Featuring a data electrically erasable programmable read-only memory (EEPROM) size of 2K, this microcontroller enables the storage and retrieval of critical data, configurations, or user preferences, adding flexibility to the system's memory management.

Peripherals: BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Equipped with a wide range of peripherals such as brown-out detector (BOD), comparators, direct memory access (DMA), power-on reset (POR), pulse-width modulation (PWM), quadrature encoder interface (QEI), real-time clock (RTC), timers, and watchdog timer (WDT), this microcontroller offers rich functionalities and supports diverse application requirements.

Maximum Clock Frequency: 25 MHz

With a maximum clock frequency of 25 MHz, this microcontroller can execute instructions and process data at high speeds, enhancing overall system responsiveness and performance.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum allowable time of 30 seconds at the peak reflow temperature, this microcontroller can withstand the soldering process during assembly, ensuring reliable solder joint integrity and minimizing the risk of damage.

Peak Reflow Temperature °C: 260

Designed to withstand peak reflow temperatures up to 260°C, this microcontroller is suitable for surface mount technology (SMT) soldering processes, ensuring secure and reliable solder connections.

Length: 9 mm

With a compact length of 9 mm, this microcontroller's form factor is optimized for space-constrained designs, allowing for efficient assembly and integration into various electronic systems.

Temperature Grade: INDUSTRIAL

Certified for industrial temperature ranges, this microcontroller can operate reliably in extreme temperature conditions, making it suitable for industrial applications that require robust and durable components.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller based on reduced instruction set computing (RISC) architecture, this product offers efficient and streamlined data processing capabilities, enabling the execution of complex algorithms and fast response times.

RAM Bytes: 32768

With a generous RAM capacity of 32,768 bytes, this microcontroller provides ample storage for data variables, stack allocation, and temporary storage, enabling the efficient execution of dynamic tasks and multitasking applications.

Technology: CMOS

Utilizing complementary metal-oxide-semiconductor (CMOS) technology, this microcontroller offers low power consumption, high noise immunity, and superior integration capabilities, making it an energy-efficient and reliable choice for various applications.

Terminal Form: BALL

The ball terminal form simplifies the assembly and soldering process, ensuring reliable electrical connections and improving the overall manufacturing efficiency of the microcontroller.

Analog To Digital Convertors: 24-Ch 12-Bit

Featuring 24 analog-to-digital converter (ADC) channels with a 12-bit resolution, this microcontroller can accurately capture and convert analog signals into digital data, suitable for applications that require precise analog measurements or sensor interfaces.

Nominal Supply Voltage: 1.2 V

With a nominal supply voltage of 1.2 V, this microcontroller offers energy-efficient operation, allowing for reduced power consumption and extended battery life in battery-powered applications.

PWM Channels: YES

Equipped with pulse-width modulation (PWM) channels, this microcontroller can generate precise analog output signals with varying duty cycles, enabling control of motors, servos, and other analog devices.

Connectivity: CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

With versatile connectivity options including controller area network (CAN), I2C, infrared data association (IRDA), Microwire, serial peripheral interface (SPI), synchronous serial interface (SSI), universal asynchronous receiver-transmitter (UART), and universal serial bus (USB), this microcontroller provides extensive interface capabilities, allowing seamless communication with a wide range of external devices and peripherals.

ROM Programmability: FLASH

Featuring flash memory for program storage, this microcontroller allows for easy and flexible reprogramming, enabling firmware updates and helping streamline product development and maintenance processes.

Terminal Pitch: 0.65 mm

With a narrow terminal pitch of 0.65 mm, this microcontroller allows for tighter trace routing on the PCB, optimizing space utilization and facilitating high-density designs.

Moisture Sensitivity Level (MSL): 3

Manufactured with moisture sensitivity level 3 (MSL-3) compliance, this microcontroller offers better moisture resistance during storage and assembly, ensuring reliable performance and reducing the risks of moisture-related damage.

Speed: 80 rpm

With a speed rating of 80 revolutions per minute (rpm), this microcontroller is suitable for controlling motor or rotary motion applications, providing precise speed control and motor responsiveness.

On Chip Program ROM Width: 8

Featuring an on-chip program ROM width of 8 bits, this microcontroller offers efficient storage and execution of program instructions, enabling highly optimized code and enhancing overall system performance.

No. of I/O Lines: 120

With a large number of input/output lines (120), this microcontroller offers extensive connectivity options and allows for flexible interfacing with external devices, sensors, and actuators, making it highly versatile for various system configurations.

Technical Specifications

Microcontrollers TM4C123GH6ZRBI attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B157

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

120

No. of Terminals:

157

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA157,13X13,25

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(6), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(3), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

24-Ch 12-Bit

Trade Compliance

TM4C123GH6ZRBI Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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