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TM4C123GE6PMIR

Texas Instruments

TM4C123GE6PMIR by Texas Instruments

TM4C123GE6PMIR by Texas Instruments is a 32-bit microcontroller with 131072 ROM words and 32768 RAM bytes. It features 12-Ch 12-Bit ADC channels, 16 PWM channels, and connectivity options like CAN, I2C, SPI, UART. Ideal for industrial applications requiring high-speed processing and multiple peripherals in a compact form factor.

Median Price

$8.694

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,964 parts In-Stock

1+ parts

$8.694

100+ parts

$7.088

1k+ parts

$4.725

10k+ parts

-

7,964

$8.694

$7.088

$4.725

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,051 parts In-Stock

1+ parts

$8.259

100+ parts

-

1k+ parts

-

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-

3,051

$8.259

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Vyrian

USA . 6,286 parts In-Stock

1+ parts

-

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-

1k+ parts

-

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6,286

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Chip Stock

USA . 4,257 parts In-Stock

1+ parts

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4,257

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,656 parts In-Stock

1+ parts

$7.825

100+ parts

-

1k+ parts

-

10k+ parts

-

4,656

$7.825

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AZTECH Wire

Italy . 719 parts In-Stock

1+ parts

$11.960

100+ parts

-

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719

$11.960

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Microchip USA

USA . 3,484 parts In-Stock

1+ parts

$18.040

100+ parts

$17.780

1k+ parts

$17.650

10k+ parts

$17.520

3,484

$18.040

$17.780

$17.650

$17.520

Parana Technologies

USA . 1,906 parts In-Stock

1+ parts

$58.349

100+ parts

-

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1,906

$58.349

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DigiPath Technology Company

USA . 2,067 parts In-Stock

1+ parts

$64.250

100+ parts

$59.110

1k+ parts

-

10k+ parts

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2,067

$64.250

$59.110

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ChromeModa Solutions

Germany . 2,304 parts In-Stock

1+ parts

$65.561

100+ parts

$53.760

1k+ parts

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2,304

$65.561

$53.760

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IDEA Electronic Components Group

UK . 604 parts In-Stock

1+ parts

$65.561

100+ parts

$62.283

1k+ parts

$59.005

10k+ parts

-

604

$65.561

$62.283

$59.005

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Overview

Experience the power of Texas Instruments with the TM4C123GE6PMIR microcontroller, a versatile solution for a wide range of applications. This high-quality device offers exceptional performance and reliability, thanks to its advanced features and cutting-edge technology. With a wide array of peripherals, including ADC channels, DMA channels, PWM capabilities, and more, this microcontroller is perfect for industrial-grade projects that demand precision and efficiency. Trust in Texas Instruments to deliver exceptional value and unmatched benefits with the TM4C123GE6PMIR microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and thermal properties for the microcontroller.

Surface Mount: YES

Allows for easy installation and integration onto circuit boards.

Maximum Supply Voltage: 1.32 V

Allows for stable operation within the specified voltage range.

Bit Size: 32

Offers high computational capabilities for processing tasks efficiently.

Power Supplies (V): 1.2,3.3

Provides flexibility in power input options for various applications.

No. of Terminals: 64

Offers a sufficient number of connection points for interfacing with external devices.

ADC Channels: YES

Allows for analog to digital conversion, essential for many sensor-based applications.

DMA Channels: YES

Enables efficient data transfer between peripherals and memory without CPU intervention.

ROM Words: 131072

Provides ample storage capacity for program code and data.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for high performance and efficiency in computing tasks.

Technology: CMOS

Offers low power consumption and high noise immunity for reliable operation.

Analog To Digital Convertors: 12-Ch 12-Bit

Enables accurate conversion of analog signals to digital data for sensor interfaces.

Connectivity: CAN(2), I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Provides a wide range of communication options for interfacing with other devices and systems.

Technical Specifications

Microcontrollers TM4C123GE6PMIR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

43

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

32768

ROM Words:

131072

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

80 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.32 V

Minimum Supply Voltage:

1.08 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C(4), IRDA, MICROWIRE, SPI, SSI(4), UART(8), USB

Peripherals:

BOD, COMPARATOR(2), DMA(32), POR, PWM(16), QEI(2), RTC, TIMER(13), WDT(2)

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

TM4C123GE6PMIR Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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